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TDE3247FPT

STMicroelectronics

TDE3247FPT by STMicroelectronics

TDE3247FPT by STMicroelectronics is a versatile interface IC designed for commercial applications, operating b/w -20 °C and 85 °C. It features a compact 14-terminal gull-wing package and supports power supplies from 8V to 30V with a max output current of 0.15A. Ideal for surface mount designs, it ensures reliable performance in various electronic devices.

Median Price

$2.820

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,469 parts In-Stock

1+ parts

$2.239

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

$2.239

-

-

-

Chip1Stop

Japan . 2,469 parts In-Stock

1+ parts

$3.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

$3.400

-

-

-

Verical

USA . 2,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,886 parts In-Stock

1+ parts

$2.096

100+ parts

-

1k+ parts

-

10k+ parts

-

3,886

$2.096

-

-

-

Vyrian

USA . 11,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,536

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,875

-

-

-

-

Anansix

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,742 parts In-Stock

1+ parts

$1.985

100+ parts

-

1k+ parts

-

10k+ parts

-

2,742

$1.985

-

-

-

AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$8.250

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$8.250

-

-

-

IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$11.147

100+ parts

-

1k+ parts

$10.032

10k+ parts

-

379

$11.147

-

$10.032

-

MKK Technologies

India . 971 parts In-Stock

1+ parts

$20.961

100+ parts

-

1k+ parts

-

10k+ parts

-

971

$20.961

-

-

-

DigiPath Technology Company

USA . 971 parts In-Stock

1+ parts

$20.961

100+ parts

-

1k+ parts

-

10k+ parts

-

971

$20.961

-

-

-

Perfect Parts

USA . 16,747 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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16,747

-

-

-

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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100+ parts

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13,000

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 11,473 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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11,473

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A-Z Elektronik GmbH

Germany . 6,786 parts In-Stock

1+ parts

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100+ parts

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6,786

-

-

-

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Microchip USA

USA . 4,575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,575

-

-

-

-

Metaverse IC Inc.

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

-

-

-

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Parana Technologies

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$13.328

1k+ parts

-

10k+ parts

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540

-

$13.328

-

-

Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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300

-

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-

-

Overview

Elevate your designs with the TDE3247FPT from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile interface IC ensures reliable performance across various applications, from consumer electronics to industrial automation. With exceptional temperature resilience and compact surface mount design, it seamlessly integrates into your projects, enhancing quality and efficiency while delivering consistent results you can trust. Unleash the potential of your next creation with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient layout design, optimizing space and performance.

Power Supplies (V): 8/30

Versatile power supply range allows compatibility with various system designs, enhancing its applicability.

No. of Terminals: 14

With 14 terminals, this IC can support a wide range of functionalities and connections, providing flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for high-density applications, contributing to miniaturization of electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in a range of environments, suitable for commercial use.

Minimum Operating Temperature: -20 °C

The ability to operate in lower temperatures expands application possibilities, allowing use in colder climates.

Terminal Position: DUAL

Dual terminal positioning facilitates better routing and connectivity options on circuit boards.

Maximum Seated Height: 1.75 mm

The low seated height aids in designing thin devices, essential for modern electronics that prioritize compact form factors.

Width: 3.9 mm

A narrow width helps in fitting into tight spaces within device enclosures, enhancing design flexibility.

Length: 8.65 mm

The length is optimized for standard layouts, ensuring compatibility with various mounting styles and PCB designs.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade signifies durability and reliability, making it suitable for a broad range of applications.

Maximum Output Current: 0.15 A

Supporting a maximum output current of 0.15 A allows the IC to drive low-power devices effectively, ideal for battery-operated designs.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and high gain, which is excellent for interface applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent solder joint reliability, essential for long-term performance in various conditions.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact yet accessible connections, simplifying assembly and minimizing space.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is tailored for interfacing between different components, enhancing compatibility and signal integrity.

Technical Specifications

Other Function Interface ICs TDE3247FPT attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/30

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TDE3247FPT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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