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TDA7575BPD

STMicroelectronics

TDA7575BPD by STMicroelectronics

TDA7575BPD by STMicroelectronics is a Class AB audio amplifier with 50W output power and operates b/w 8V to 18V. It features a compact design with a dual terminal configuration and low harmonic distortion of 10%. Ideal for high-quality audio applications, it ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 8,680 parts In-Stock

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8,680

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Vyrian

USA . 3,336 parts In-Stock

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3,336

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Digiode

USA . 1,392 parts In-Stock

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1,392

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Anansix

USA . 297 parts In-Stock

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297

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 360 parts In-Stock

1+ parts

$3.046

100+ parts

-

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$2.742

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360

$3.046

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$2.742

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MKK Technologies

India . 2,325 parts In-Stock

1+ parts

$5.728

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2,325

$5.728

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DigiPath Technology Company

USA . 2,325 parts In-Stock

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$5.728

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2,325

$5.728

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AZTECH Wire

Italy . 50 parts In-Stock

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$14.620

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50

$14.620

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Microchip USA

USA . 2,626 parts In-Stock

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$24.920

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2,626

$24.920

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RC Electronics

USA . 7,093 parts In-Stock

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7,093

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 6,357 parts In-Stock

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6,357

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Corphita

USA . 4,434 parts In-Stock

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Assy Fe

Spain . 1,819 parts In-Stock

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Parana Technologies

USA . 408 parts In-Stock

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$3.642

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408

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$3.642

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Overview

Elevate your audio experience with the TDA7575BPD from STMicroelectronics, a trusted name in innovative technology. This high-performance Class AB amplifier delivers exceptional sound quality and efficiency, making it ideal for automotive and consumer applications alike. With its compact design and impressive power output, the TDA7575BPD ensures crisp, clear audio that will captivate your audience. Enjoy the benefits of superior reliability and performance, backed by ST's commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and thermal stability, making this amplifier suitable for various environments.

Surface Mount: YES

Being a surface mount component allows for compact designs and easy integration into modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, enabling efficient design layouts.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB design offers a balance between efficiency and sound fidelity, making it ideal for high-quality audio applications.

Harmonic Distortion: 10 %

Lower harmonic distortion ensures clearer and more accurate audio reproduction, enhancing the listening experience.

Power Supplies (V): 14.4

A nominal power supply requirement of 14.4V is common, making it easily compatible with most audio systems.

No. of Terminals: 36

A greater number of terminals allows for flexible connections, increasing the versatility in circuit integration.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style aids in efficient heat dissipation, ensuring stable performance during high workloads.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and reliable electrical connections, enhancing durability.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and provides more current paths, enhancing performance.

Nominal Output Power: 50 W

A substantial output power of 50W supports a wide range of audio applications, from home theaters to professional setups.

Maximum Seated Height: 3.43 mm

The low profile design allows for space-efficient applications, making it suitable for slim devices.

Width: 11 mm

A compact width enables easier placement on smaller PCBs, optimizing space utilization in designs.

Minimum Supply Voltage (Vsup): 8 V

With a minimum supply voltage of only 8V, this amplifier can operate effectively in diverse power environments.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing for a maximum reflow time of 30 seconds helps prevent damage during the assembly process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature indicates robustness, accommodating various soldering techniques.

Length: 15.9 mm

The appropriate length ensures compatibility with existing designs while maintaining a compact overall footprint.

No. of Channels: 2

A dual-channel configuration supports stereo audio applications, making it ideal for audio amplification.

Technology: BCDMOS

BCD technology allows for better power efficiency and performance, making this amplifier an excellent choice for audio hardware.

Nominal Bandwidth: 0.022 kHz

A modestly low nominal bandwidth indicates the ability to handle various audio frequencies without distortion.

Terminal Form: GULL WING

The gull wing terminal design ensures stable mounting and assists in automated assembly processes.

Maximum Supply Current: 200 mA

With a maximum supply current of 200 mA, this amplifier is effective while conserving power, making it efficient for long-term use.

Terminal Pitch: 0.65 mm

The terminal pitch facilitates compact layouts on the PCB, contributing to space-saving designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates handling precautions needed, which helps in maintaining reliability over its lifespan.

Maximum Supply Voltage (Vsup): 18 V

A maximum supply voltage of 18V allows for flexible design options and supports a variety of power configurations.

Technical Specifications

Audio & Video Amplifiers TDA7575BPD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

TDA7575BPD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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