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TDA75610LV

STMicroelectronics

TDA75610LV by STMicroelectronics

TDA75610LV by STMicroelectronics is a 4-channel audio amplifier with 44W output power. It operates b/w -40 to 105 °C, ideal for industrial applications. With a harmonic distortion of 10%, it offers a gain of 26dB and supports supply voltages from 6V to 18V.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 27,367 parts In-Stock

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Vyrian

USA . 7,777 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,227 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,071 parts In-Stock

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ComSIT USA

USA . 1,071 parts In-Stock

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Anansix

USA . 914 parts In-Stock

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Digiode

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IDEA Electronic Components Group

UK . 169 parts In-Stock

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$2.803

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$2.523

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MKK Technologies

India . 994 parts In-Stock

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$5.271

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DigiPath Technology Company

USA . 994 parts In-Stock

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$5.271

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AZTECH Wire

Italy . 183 parts In-Stock

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$9.630

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Kepictronics

USA . 12,430 parts In-Stock

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RC Electronics

USA . 9,732 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,322 parts In-Stock

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Corphita

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Microchip USA

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Parana Technologies

USA . 2,024 parts In-Stock

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$3.352

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Overview

Enhance your audio experience with the TDA75610LV by STMicroelectronics, a top-of-the-line audio amplifier that delivers unparalleled sound quality and performance. Manufactured by industry leader STMicroelectronics, this amplifier is designed for a wide range of applications in the audio and video industry. With its high power output, low harmonic distortion, and industrial-grade temperature range, the TDA75610LV offers customers exceptional value and benefits. Elevate your audio projects with this innovative amplifier and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various systems or devices.

Harmonic Distortion: 10%

Low harmonic distortion ensures high-quality audio output, making this amplifier ideal for audio applications where clarity is essential.

Power Supplies (V): 14.4

Operates at an optimal voltage level for efficient performance and energy consumption.

No. of Terminals: 27

Ample number of terminals provide flexibility for connecting various components or peripherals to the amplifier.

Maximum Operating Temperature: 105 °C

Wide temperature range allows for reliable operation in different environmental conditions.

Nominal Output Power: 44 W

High output power provides ample audio power for driving speakers or amplifying sound signals.

Technology: BCDMOS

BCDMOS technology ensures efficient power handling and performance, making this amplifier a reliable choice for audio applications.

Technical Specifications

Audio & Video Amplifiers TDA75610LV attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-XZFM-T27

JESD-609 Code:

e3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

44 W

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA75610LV General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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