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TDA7427AD

STMicroelectronics

TDA7427AD by STMicroelectronics

TDA7427AD by STMicroelectronics is a CMOS PLL frequency synthesizer with a 5V nominal voltage and operates b/w -40 °C to 85 °C. It features a compact 28-terminal, thin-profile package (4.4mm x 9.7mm) for efficient surface mounting. Ideal for industrial applications requiring precise frequency control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,253 parts In-Stock

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4,253

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Vyrian

USA . 1,997 parts In-Stock

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1,997

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Anansix

USA . 1,448 parts In-Stock

1+ parts

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1,448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,355 parts In-Stock

1+ parts

$16.417

100+ parts

-

1k+ parts

$14.776

10k+ parts

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2,355

$16.417

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$14.776

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MKK Technologies

India . 142 parts In-Stock

1+ parts

$30.872

100+ parts

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142

$30.872

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DigiPath Technology Company

USA . 142 parts In-Stock

1+ parts

$30.872

100+ parts

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142

$30.872

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Parana Technologies

USA . 2,288 parts In-Stock

1+ parts

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$19.630

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2,288

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$19.630

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Kepictronics

USA . 1,183 parts In-Stock

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1,183

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Corphita

USA . 338 parts In-Stock

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338

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Overview

Unlock the potential of your designs with the TDA7427AD from STMicroelectronics—your trusted partner in innovation. This advanced PLL and frequency synthesizer offers unmatched reliability, ensuring peak performance across a wide temperature range. Perfect for industrial applications, it delivers exceptional value by minimizing energy consumption while maximizing functionality. Elevate your projects with this compact, high-quality solution that embodies STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection, making this product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and easy integration into modern electronics, enhancing design flexibility.

Package Shape: RECTANGULAR

A rectangular package shape aids in efficient space utilization on PCBs, promoting compact design.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V is a common standard, which makes it compatible with a wide range of applications and existing systems.

No. of Terminals: 28

Having 28 terminals ensures versatility and the ability to support various functionalities within a single component.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design optimize space while providing reliable performance in densely packed circuit boards.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes it suitable for industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extreme environments, such as automotive or aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent solderability and resistance to oxidation, enhancing the long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positions facilitate easier mounting options, helping designers to optimize the layout of their circuit boards.

Maximum Seated Height: 1.2 mm

With a low seated height, it allows for more compact designs, which is essential for modern electronic devices where space is at a premium.

Width: 4.4 mm

A width of 4.4 mm makes it suitable for fitting into small spaces on circuit boards, aligning with trends towards miniaturization.

Other IC Type: PLL FREQUENCY SYNTHESIZER

As a PLL frequency synthesizer, it can generate a variety of frequencies, making it versatile for different signaling and clocking applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V offers flexibility for lower power applications, ensuring compatibility with a diverse range of systems.

Length: 9.7 mm

A length of 9.7 mm contributes to the compactness of the device, facilitating design in space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, it ensures reliability and performance in demanding conditions typical of industrial settings.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency, leading to lower power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and improve thermal conductivity, which enhances overall component reliability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser configurations on PCBs, making it suitable for advanced technology applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, it indicates moderate sensitivity to moisture, requiring proper handling which also signifies quality in manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides a buffer for power supply variations, promoting system stability and reliability.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits TDA7427AD attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES A 10V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

TDA7427AD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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