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T2050H-6I

STMicroelectronics

T2050H-6I by STMicroelectronics

T2050H-6I by STMicroelectronics is a snubberless TRIAC designed for AC applications. It features a max RMS on-state current of 20 A, operates b/w -40 °C to 125 °C, and supports a repetitive peak off-state voltage of 600 V. Ideal for motor control and lighting systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,035

-

-

-

-

Digiode

USA . 2,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,736

-

-

-

-

Anansix

USA . 2,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,577

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,934 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

$4.005

10k+ parts

-

1,934

$4.450

-

$4.005

-

MKK Technologies

India . 1,900 parts In-Stock

1+ parts

$8.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$8.368

-

-

-

DigiPath Technology Company

USA . 1,900 parts In-Stock

1+ parts

$8.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$8.368

-

-

-

Corphita

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,600

-

-

-

-

Parana Technologies

USA . 2,072 parts In-Stock

1+ parts

-

100+ parts

$5.321

1k+ parts

-

10k+ parts

-

2,072

-

$5.321

-

-

Overview

Elevate your designs with the T2050H-6I TRIAC from STMicroelectronics, a trusted leader in semiconductor innovation. This robust component offers unmatched reliability and performance across diverse applications, from motor control to lighting solutions. With its snubberless design and high-temperature tolerance, it ensures superior efficiency and longevity. Choose the T2050H-6I for exceptional quality, empowering your projects to thrive in demanding environments while optimizing energy use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy helps in offering durability and resistance to environmental factors, making this TRIAC suitable for various applications.

Configuration: SINGLE

A single configuration allows for easier integration into circuits and reduces complexity, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, enabling flexible design options.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are ideal for high-power applications, ensuring reliability in performance.

No. of Terminals: 3

With three terminals, this TRIAC supports convenient circuit connections, allowing for enhanced functionality in a wide range of applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style ensures stable mounting and easier handling during installation, which is beneficial for maintenance and assembly.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance even in demanding conditions, making this TRIAC a resilient choice.

Trigger Device Type: SNUBBERLESS TRIAC

As a snubberless TRIAC, it reduces the need for external components, leading to simpler circuit designs and diminished size.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows this TRIAC to function effectively in extremely cold environments, increasing its versatility.

Terminal Finish: TIN

A tin terminal finish ensures good solderability and conductivity, enhancing the overall performance and reliability of the TRIAC.

Terminal Position: SINGLE

Single terminal positioning simplifies the layout and aids in achieving compact circuit designs.

Maximum RMS On-state Current: 20 A

A maximum RMS on-state current rating of 20 A allows this TRIAC to handle substantial loads, making it suitable for high-power applications.

Case Connection: ISOLATED

An isolated case connection enhances safety and prevents unwanted current paths, ensuring reliable operation.

Repetitive Peak Off-state Voltage: 600 V

With a repetitive peak off-state voltage of 600 V, this TRIAC can effectively handle high voltages, ensuring durability and versatility in various applications.

Technical Specifications

Triode For Alternating Current (TRIAC) T2050H-6I attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T2050H-6I Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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