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STY140NS10

STMicroelectronics

STY140NS10 by STMicroelectronics

STY140NS10 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 140 A and a breakdown voltage of 100 V. It operates in enhancement mode with a power dissipation of up to 450 W. This robust transistor ensures reliable performance in demanding environments, with an operating temp range of -55 °C to 175 °C.

Median Price

$13.414

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,712 parts In-Stock

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Vyrian

USA . 7,172 parts In-Stock

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Zilex Electronics Inc.

Canada . 6,000 parts In-Stock

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Bristol Electronics

USA . 2,188 parts In-Stock

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Dan-Mar Components

USA . 2,188 parts In-Stock

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Anansix

USA . 2,160 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,070 parts In-Stock

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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IDEA Electronic Components Group

UK . 867 parts In-Stock

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$1.179

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$1.061

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MKK Technologies

India . 668 parts In-Stock

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$2.218

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DigiPath Technology Company

USA . 668 parts In-Stock

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Corphita

USA . 1,251 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,064 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Alle Elektronik GmbH

Germany . 3,560 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 2,110 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 801 parts In-Stock

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Assy Fe

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Overview

Unlock the potential of your designs with the STY140NS10 from STMicroelectronics. Renowned for its unparalleled quality and innovation, STMicroelectronics delivers a powerful N-channel FET that excels in efficiency and reliability for switching applications. With robust performance capabilities, including high current handling and impressive thermal resilience, this transistor ensures your systems run smoothly under demanding conditions. Elevate your projects with a trusted solution that combines excellence, durability, and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and faster, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from voltage spikes and reverse polarity issues, enhancing reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power in various electronic circuits.

Minimum DS Breakdown Voltage: 100 V

A minimum breakdown voltage of 100V ensures the FET can handle high voltage applications safely.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCB layouts, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easy to solder, making assembly straightforward.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors typically exhibit lower off-state current, reducing power loss in energy-sensitive applications.

Maximum Pulsed Drain Current (IDM): 560 A

A high pulsed current rating makes this FET suitable for applications requiring peak power handling capabilities.

Avalanche Energy Rating (EAS): 2900 mJ

The high avalanche energy rating indicates the FET can withstand significant energy spikes, enhancing durability.

Maximum Drain Current (Abs) (ID): 140 A

With a maximum drain current of 140A, this FET can handle substantial loads, making it ideal for high-powered applications.

No. of Terminals: 3

A simple three-terminal configuration makes this FET versatile for various circuit applications.

Maximum Power Dissipation (Abs): 450 W

The high power dissipation capability allows for effective thermal management in demanding electronic environments.

Package Style (Meter): IN-LINE

In-line package style aids in streamlined assembly on circuit boards, optimizing space efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and excellent switching characteristics, making this product efficient.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures reliability in high-temperature environments, essential for robust applications.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal conductivity and supports high-performance operation.

Minimum Operating Temperature: -55 °C

The ability to operate down to -55 °C makes this FET suitable for extreme temperature applications, enhancing versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides good corrosion resistance and ensures reliable electrical connections in various environments.

Maximum Drain Current (ID): 140 A

With a maximum drain current of 140A, this FET can handle substantial loads, making it ideal for high-powered applications.

Maximum Drain-Source On Resistance: 0.011 ohm

A low on-resistance of 0.011 ohm minimizes power loss and heat generation during operation, contributing to overall efficiency.

Terminal Position: SINGLE

The single terminal position provides a simple connection layout, enhancing compatibility with various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STY140NS10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

2900 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

560 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY140NS10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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