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STY112N65M5

STMicroelectronics

STY112N65M5 by STMicroelectronics

STY112N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 93A max drain current, and 450W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

$38.945

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 296 parts In-Stock

1+ parts

$32.072

100+ parts

-

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296

$32.072

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Future Electronics

Canada . 4 parts In-Stock

1+ parts

$32.290

100+ parts

$31.280

1k+ parts

$30.750

10k+ parts

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4

$32.290

$31.280

$30.750

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Chip1Stop

Japan . 416 parts In-Stock

1+ parts

$45.600

100+ parts

$28.200

1k+ parts

$27.800

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416

$45.600

$28.200

$27.800

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Verical

USA . 832 parts In-Stock

1+ parts

$57.316

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832

$57.316

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Avnet

USA . 15,990 parts In-Stock

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15,990

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Distributors (In-Stock)

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Digiode

USA . 4,950 parts In-Stock

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$27.037

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4,950

$27.037

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IBS Electronics

USA . 664 parts In-Stock

1+ parts

$45.287

100+ parts

$30.729

1k+ parts

$43.127

10k+ parts

-

664

$45.287

$30.729

$43.127

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Vyrian

USA . 12,797 parts In-Stock

1+ parts

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12,797

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Anansix

USA . 1,203 parts In-Stock

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1,203

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ComSIT Distribution GmbH

Germany . 930 parts In-Stock

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930

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R&J Components

USA . 210 parts In-Stock

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210

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 89 parts In-Stock

1+ parts

$0.699

100+ parts

-

1k+ parts

$0.629

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89

$0.699

-

$0.629

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MKK Technologies

India . 1,821 parts In-Stock

1+ parts

$1.315

100+ parts

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1,821

$1.315

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DigiPath Technology Company

USA . 1,821 parts In-Stock

1+ parts

$1.315

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1,821

$1.315

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Component Stockers USA

USA . 265 parts In-Stock

1+ parts

$16.570

100+ parts

$15.740

1k+ parts

$28.940

10k+ parts

$28.940

265

$16.570

$15.740

$28.940

$28.940

Ampacity Inc.

Singapore . 3,772 parts In-Stock

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$24.190

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3,772

$24.190

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Corphita

USA . 1,237 parts In-Stock

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$25.614

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1,237

$25.614

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Continental Prestige Electronics

USA . 30 parts In-Stock

1+ parts

$30.510

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$24.230

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30

$30.510

$24.230

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Microchip USA

USA . 158 parts In-Stock

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$86.687

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158

$86.687

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Authorized Procurement Solutions

USA . 20,400 parts In-Stock

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20,400

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Alle Elektronik GmbH

Germany . 4,026 parts In-Stock

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4,026

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Perfect Parts

USA . 1,661 parts In-Stock

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1,661

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iodParts Technologies Inc.

India . 600 parts In-Stock

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600

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Parana Technologies

USA . 479 parts In-Stock

1+ parts

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$0.836

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479

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$0.836

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Overview

Unlock the power of efficiency with the STY112N65M5 from STMicroelectronics, a leader in semiconductor innovation. This high-performance N-channel FET is designed for seamless switching applications, offering remarkable reliability and exceptional thermal management. With a robust 650V breakdown voltage and efficient energy handling, it empowers your designs while reducing operational costs. Choose STMicroelectronics for quality that drives results in industries like automotive, industrial, and renewable energy!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures good insulation and mechanical protection, making the product reliable in various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically more efficient and provide higher performance, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and allows for better handling of inductive loads, enhancing circuit reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power in various electronic circuits, allowing for effective energy management.

Minimum DS Breakdown Voltage: 650 V

A minimum breakdown voltage of 650 V makes this transistor capable of handling high voltage applications, providing versatility in different circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and facilitates easier arrangement and assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and excellent soldering reliability, essential for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control of the FET, reducing power loss in applications where higher performance is required.

Maximum Pulsed Drain Current (IDM): 372 A

The high pulsed drain current capacity is ideal for applications requiring momentary surges in current, such as in power supply circuits.

Maximum Drain Current (Abs) (ID): 93 A

With a maximum drain current of 93 A, this transistor is suitable for heavy-duty applications where high load handling is essential.

No. of Terminals: 3

The three-terminal configuration simplifies design and connectivity in circuits, making it user-friendly and versatile.

Maximum Power Dissipation (Abs): 450 W

A maximum power dissipation of 450 W ensures that this FET can handle significant power levels, beneficial in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides stable mounting, critical for maintaining performance in demanding operational conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology grants high input impedance and low power consumption, enhancing overall energy efficiency in circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows for reliable performance in extreme conditions, extending operational versatility.

Transistor Element Material: SILICON

Silicon is a well-known semiconductor material that provides excellent thermal stability and performance, making this FET a robust choice for various applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and prevents corrosion, ensuring longevity and reliability in electronic assemblies.

Maximum Drain Current (ID): 93 A

Capable of withstanding a maximum drain current of 93 A further emphasizes its utility in high-current applications.

Maximum Drain-Source On Resistance: 0.022 ohm

The low on-resistance reduces energy loss during operation, enhancing efficiency and lowering heat generation in circuits.

Terminal Position: SINGLE

The single terminal position allows for simpler integration into circuits and enhances design flexibility.

Technical Specifications

Power Field Effect Transistors (FET) STY112N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

93 A

Maximum Drain Current (ID):

93 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

372 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY112N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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