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STW82100BTR

STMicroelectronics

STW82100BTR by STMicroelectronics

STW82100BTR by STMicroelectronics is a BICMOS DOWN CONVERTER with 44 terminals, operating at -40 to 85 °C. It supports RF input frequencies from 1850-2400 MHz and has LO tunability. Ideal for RF/Microwave applications requiring surface mount technology and a characteristic impedance of 50 ohms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,147 parts In-Stock

1+ parts

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2,147

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Vyrian

USA . 2,107 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,107

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Digiode

USA . 468 parts In-Stock

1+ parts

-

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468

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 726 parts In-Stock

1+ parts

$1.473

100+ parts

-

1k+ parts

$1.326

10k+ parts

-

726

$1.473

-

$1.326

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MKK Technologies

India . 667 parts In-Stock

1+ parts

$2.770

100+ parts

-

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-

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-

667

$2.770

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DigiPath Technology Company

USA . 667 parts In-Stock

1+ parts

$2.770

100+ parts

-

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-

10k+ parts

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667

$2.770

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-

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AZTECH Wire

Italy . 100 parts In-Stock

1+ parts

$9.320

100+ parts

-

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100

$9.320

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Component Stockers USA

USA . 273 parts In-Stock

1+ parts

$99.990

100+ parts

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273

$99.990

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Corphita

USA . 1,009 parts In-Stock

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1,009

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Parana Technologies

USA . 511 parts In-Stock

1+ parts

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100+ parts

$1.761

1k+ parts

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511

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$1.761

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Overview

Unlock unparalleled performance and reliability with the STW82100BTR by STMicroelectronics, a leading manufacturer known for delivering top-notch quality products. This RF/Microwave Up/Down Converter is the perfect solution for a wide range of applications, offering superior value and benefits to customers. With advanced technology and innovative design, this component ensures seamless operation and exceptional results. Experience the advantages of this converter and elevate your projects to new heights with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the converter, making it suitable for various environments and applications.

Construction: COMPONENT

The component-based construction ensures high performance and allows for easy maintenance and repairs if needed.

Power Supplies (V): 3.3,5

The option of using power supplies of 3.3V or 5V provides flexibility in terms of power source compatibility.

No. of Terminals: 44

With a high number of terminals, this converter offers connectivity options for various components and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the converter can perform reliably in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the converter to function effectively in cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures a secure electrical connection for optimal signal transmission.

LO Tunable: YES

The ability to tune the LO (Local Oscillator) frequency allows for precise signal processing and frequency conversion in different applications.

Technology: BICMOS

The use of BICMOS technology enables high-speed operation, low power consumption, and integration of digital and analog functions for efficient signal processing.

RF or Microwave Device Type: DOWN CONVERTER

As a down converter, this product is designed to convert higher frequency RF signals to lower intermediate frequencies, which is essential for various communication and signal processing applications.

Minimum RF Input Frequency: 1850 MHz

The ability to handle RF signals starting from 1850 MHz makes this converter suitable for a wide range of RF applications and frequency bands.

Characteristic Impedance: 50 ohm

The 50 ohm characteristic impedance ensures efficient power transfer and minimizes signal loss, making this converter ideal for high-frequency RF applications.

Maximum RF Input Frequency: 2400 MHz

With a maximum input frequency of 2400 MHz, this converter can handle a wide range of RF signals for versatile signal processing and conversion.

Mounting Feature: SURFACE MOUNT

The surface mount option simplifies installation and allows for compact and space-saving integration into existing systems or designs.

Technical Specifications

RF/Microwave Up/Down Converters STW82100BTR attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from STMicroelectronics

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC44,.28SQ,20

Power Supplies (V):

3.3,5

Maximum RF Input Frequency:

2400 MHz

Minimum RF Input Frequency:

1850 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Technology:

Terminal Finish:

Matte Tin (Sn) - annealed

Trade Compliance

STW82100BTR RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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