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STW81103AT

STMicroelectronics

STW81103AT by STMicroelectronics

STW81103AT by STMicroelectronics is a compact consumer IC designed for industrial applications, featuring a max supply voltage of 3.6V and operating temps from -40 °C to 85 °C. Its quad terminal design ensures efficient heat dissipation in tight spaces. Ideal for surface mount technology with a very thin profile.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,244 parts In-Stock

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Digiode

USA . 2,985 parts In-Stock

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2,985

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Anansix

USA . 775 parts In-Stock

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775

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MISTER SPROCKETS

USA . 18 parts In-Stock

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IDEA Electronic Components Group

UK . 496 parts In-Stock

1+ parts

$2.095

100+ parts

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$1.885

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496

$2.095

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$1.885

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MKK Technologies

India . 458 parts In-Stock

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$3.939

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458

$3.939

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DigiPath Technology Company

USA . 458 parts In-Stock

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$3.939

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458

$3.939

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AZTECH Wire

Italy . 431 parts In-Stock

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$12.090

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431

$12.090

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Corphita

USA . 3,085 parts In-Stock

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Perfect Parts

USA . 2,298 parts In-Stock

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Parana Technologies

USA . 2,110 parts In-Stock

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$2.505

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$2.505

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Cyclops Electronics Ltd (Excess)

UK . 1,026 parts In-Stock

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Overview

Unlock unparalleled performance with the STW81103AT by STMicroelectronics, a cutting-edge consumer IC designed for reliability and efficiency. With its sleek, ultra-thin profile and robust thermal management, this versatile chip is perfect for diverse applications, from smart home devices to industrial automation. Trust in STMicroelectronics' legacy of innovation and quality, ensuring you gain maximum value and superior functionality for your projects. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design facilitates easy and efficient integration into compact electronic assemblies.

Package Shape: SQUARE

The square package shape maximizes space utilization on PCBs, allowing for higher density layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC offers reliability and performance tailored for everyday electronic products.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options for complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design ensure efficient heat dissipation, making it suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this IC suitable for a variety of environments, including outdoor uses.

Minimum Operating Temperature: -40 °C

Ability to function in temperatures as low as -40 °C enhances its robustness for industrial applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: QUAD

Quad terminal positioning allows for versatile routing options on PCBs, simplifying design layouts.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1 mm, this component can be used in ultra-thin devices, keeping the profile sleek.

Width: 5 mm

A compact width of 5 mm is ideal for space-constrained designs, maximizing PCB layer count.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage allows for wider compatibility with battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this IC can withstand the soldering process without degradation.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with various soldering processes, enhancing manufacturing flexibility.

Length: 5 mm

A length of 5 mm contributes to compact design solutions, suitable for modern electronics.

Temperature Grade: INDUSTRIAL

Industrial grade ensures durability and performance under harsh conditions, extending the product's lifespan.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: NO LEAD

No lead design enhances environmental sustainability and simplifies PCB layout, promoting compactness.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for higher pin count in smaller footprints, enabling advanced circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making the IC appropriate for many manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V ensures operational compatibility with most modern low-voltage electronic circuits.

Technical Specifications

Other Function Consumer ICs STW81103AT attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

STW81103AT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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