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STW8009BS3R/LF

STMicroelectronics

STW8009BS3R/LF by STMicroelectronics

STW8009BS3R/LF by STMicroelectronics is a consumer IC in a very thin profile grid array package, featuring 49 terminals. It operates b/w -30 °C and 85°C with a supply voltage range of 2.7V to 3.6V, ideal for compact electronic applications. Its square shape and fine pitch design enhance space efficiency in modern devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

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2,715

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Anansix

USA . 1,987 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,987

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Vyrian

USA . 338 parts In-Stock

1+ parts

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100+ parts

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338

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,150 parts In-Stock

1+ parts

$1.793

100+ parts

-

1k+ parts

$1.614

10k+ parts

-

2,150

$1.793

-

$1.614

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MKK Technologies

India . 2,352 parts In-Stock

1+ parts

$3.372

100+ parts

-

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-

10k+ parts

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2,352

$3.372

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DigiPath Technology Company

USA . 2,352 parts In-Stock

1+ parts

$3.372

100+ parts

-

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10k+ parts

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2,352

$3.372

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Corphita

USA . 2,106 parts In-Stock

1+ parts

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2,106

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Parana Technologies

USA . 678 parts In-Stock

1+ parts

-

100+ parts

$2.144

1k+ parts

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10k+ parts

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678

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$2.144

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Overview

Elevate your consumer electronics with the STW8009BS3R/LF from STMicroelectronics—a leader in innovation and reliability. This sleek, compact IC delivers exceptional performance while seamlessly fitting into your designs. With a robust temperature range and advanced features, it empowers diverse applications from smart home devices to portable gadgets, ensuring efficiency and longevity. Trust in STMicroelectronics for unmatched quality and experience the difference in your products today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and ensures reliability in various environmental conditions, making the product suitable for consumer applications.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, reducing overall PCB space and enabling high-density applications.

Package Shape: SQUARE

The square package shape enhances PCB layout flexibility, allowing for efficient use of space and facilitating easier thermal management.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC indicates that it is optimized for performance and power efficiency in consumer electronics, ideal for everyday devices.

No. of Terminals: 49

With 49 terminals, the product supports complex functionalities, allowing integration into advanced consumer products that require numerous connections.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch of the grid array style enhance design compactness while maintaining electrical performance, making it suitable for slim devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the IC to function reliably in a wide range of consumer environments, enhancing longevity and performance.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C ensures reliable performance in colder climates and diverse conditions, making it versatile for various applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective heat dissipation while promoting better connectivity, increasing the overall efficiency of the IC in the circuit.

Maximum Seated Height: 1 mm

A maximum seated height of only 1 mm contributes to a low-profile design, which is essential for modern compact devices where space is a significant constraint.

Width: 3 mm

The compact width of 3 mm allows for easy integration into small electronic devices, ensuring it meets the demands for size in today's consumer products.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V confirms low power consumption characteristics, making it ideal for battery-operated devices.

Length: 3 mm

This compact length complements its width to create a square form factor, enhancing design flexibility in tight spaces.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures that the IC can operate reliably beyond the typical range, which is advantageous for consumer devices exposed to variable conditions.

Terminal Form: BALL

Ball terminal form offers excellent solderability and reliability, ensuring a strong connection on PCBs, which is critical for performance in consumer applications.

Terminal Pitch: 0.4 mm

The fine 0.4 mm terminal pitch facilitates high-density connections on PCBs, supporting the design of compact and efficient electronic products.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in power supply design, allowing for compatibility with a range of consumer electronic systems.

Technical Specifications

Other Function Consumer ICs STW8009BS3R/LF attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO IT REQUIRES 1.08V TO 1.47V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B49

Length:

3 mm

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

STW8009BS3R/LF General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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