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STW81102AT

STMicroelectronics

STW81102AT by STMicroelectronics

STW81102AT by STMicroelectronics is a consumer circuit IC designed for industrial applications, featuring a compact 5mm x 5mm square package. It operates b/w -40 °C to 85°C with a supply voltage range of 3V to 3.6V. This BICMOS technology device supports surface mount assembly and has a max reflow temp of 260°C.

Median Price

$5.914

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,167 parts In-Stock

1+ parts

$5.914

100+ parts

-

1k+ parts

-

10k+ parts

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1,167

$5.914

-

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Verical

USA . 1,167 parts In-Stock

1+ parts

$5.914

100+ parts

-

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1,167

$5.914

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-

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Chip1Stop

Japan . 1,420 parts In-Stock

1+ parts

$6.090

100+ parts

-

1k+ parts

-

10k+ parts

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1,420

$6.090

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

$5.786

100+ parts

-

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4,729

$5.786

-

-

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Vyrian

USA . 7,147 parts In-Stock

1+ parts

-

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7,147

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Anansix

USA . 1,379 parts In-Stock

1+ parts

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1,379

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Avant Electronics Limited

UK . 21 parts In-Stock

1+ parts

-

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21

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ComSIT Distribution GmbH

Germany . 7 parts In-Stock

1+ parts

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7

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Sea View Technologies

USA . 5 parts In-Stock

1+ parts

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5

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$2.230

100+ parts

-

1k+ parts

$2.007

10k+ parts

-

1,881

$2.230

-

$2.007

-

MKK Technologies

India . 879 parts In-Stock

1+ parts

$4.194

100+ parts

-

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879

$4.194

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DigiPath Technology Company

USA . 879 parts In-Stock

1+ parts

$4.194

100+ parts

-

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879

$4.194

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Semicontronic

India . 1,159 parts In-Stock

1+ parts

$5.180

100+ parts

$5.050

1k+ parts

$5.025

10k+ parts

-

1,159

$5.180

$5.050

$5.025

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Corphita

USA . 1,574 parts In-Stock

1+ parts

$5.481

100+ parts

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1,574

$5.481

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Component Stockers USA

USA . 3,152 parts In-Stock

1+ parts

$6.720

100+ parts

$6.720

1k+ parts

$6.720

10k+ parts

-

3,152

$6.720

$6.720

$6.720

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Microchip USA

USA . 2,366 parts In-Stock

1+ parts

$7.605

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2,366

$7.605

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$10.640

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405

$10.640

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RC Electronics

USA . 41,400 parts In-Stock

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41,400

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A-Z Elektronik GmbH

Germany . 7,335 parts In-Stock

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7,335

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Perfect Parts

USA . 4,390 parts In-Stock

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4,390

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,157 parts In-Stock

1+ parts

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100+ parts

$2.666

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1,157

-

$2.666

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Overview

Elevate your designs with the STW81102AT from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance consumer IC offers superior reliability and efficiency, making it perfect for a variety of applications, from smart home devices to industrial automation. With its compact design and robust temperature range, it ensures seamless operation in diverse environments. Experience unmatched quality and support, giving you peace of mind and boosting your project's success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design enables compact layouts, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and simplifies routing.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility with various devices.

No. of Terminals: 28

With 28 terminals, this IC offers considerable functionality and connection options while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile aids in heat dissipation and versatility in design, making it easier to integrate into different systems.

Maximum Operating Temperature: 85 °C

Provides reliability under high temperatures, making it suitable for various demanding applications.

Minimum Operating Temperature: -40 °C

Allows operation in extreme cold conditions, ensuring performance in a wide range of environments.

Terminal Finish: Matte Tin (Sn) - annealed

This finish enhances solderability and lowers contact resistance, improving overall performance.

Terminal Position: QUAD

The quad terminal position supports effective routing and connects easily with other components.

Maximum Seated Height: 1 mm

The low seated height contributes to slimmer designs, facilitating more compact electronic devices.

Width: 5 mm

The 5 mm width allows for flexibility in layout design while not compromising on performance.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with modern soldering techniques, increasing manufacturability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates robustness against thermal processes during assembly.

Length: 5 mm

The compact length fits well within space-restricted designs, optimizing the overall size of the product.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability and performance in harsh operational conditions.

Technology: BICMOS

BICMOS technology merges the advantages of Bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

No-lead design reduces the footprint, simplifies mounting, and enhances reliability by lowering the risk of solder joint failure.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for a higher density of connections, making it suitable for advanced electronics.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable precautions regarding moisture sensitivity, ensuring reliability during handling and assembly.

Maximum Supply Voltage (Vsup): 3.6 V

Provides flexibility in power supply options while enhancing the product's capability to integrate with diverse systems.

Technical Specifications

Other Function Consumer ICs STW81102AT attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

STW81102AT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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