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STW60NE10

STMicroelectronics

STW60NE10 by STMicroelectronics

STW60NE10 from STMicroelectronics is a robust N-channel FET designed for efficient switching applications. It features a max drain current of 60 A, breakdown voltage of 100 V, and power dissipation up to 180 W. Ideal for high-performance power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Vyrian

USA . 7,002 parts In-Stock

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Anansix

USA . 2,386 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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Pegasus Components GmbH

Germany . 1,710 parts In-Stock

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1,710

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ECAB

Sweden . 330 parts In-Stock

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330

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Electronic Expediters

USA . 280 parts In-Stock

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280

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Chip Stock

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185

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Inventory MP

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38

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Bristol Electronics

USA . 38 parts In-Stock

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38

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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North Shore Components

USA . 12 parts In-Stock

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Microfarads

USA . 10 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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IDEA Electronic Components Group

UK . 800 parts In-Stock

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$0.846

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$0.762

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$0.846

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MKK Technologies

India . 1,359 parts In-Stock

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$1.592

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$1.592

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DigiPath Technology Company

USA . 1,359 parts In-Stock

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$1.592

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AZTECH Wire

Italy . 1,125 parts In-Stock

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$21.660

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$21.660

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,117 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 2,105 parts In-Stock

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Corphita

USA . 2,056 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Unlock exceptional performance with the STW60NE10 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET seamlessly combines reliability and efficiency, making it ideal for demanding switching applications. With its robust design and built-in diode, it excels in high-voltage environments while ensuring minimal energy loss. Elevate your projects with a component engineered for excellence, delivering superior thermal management and impressive current handling. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making this FET suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide high efficiency and better performance in power handling, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse polarity, enhancing overall circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET allows for fast and efficient operation in power management systems.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can operate safely in circuits with substantial voltage levels, providing greater design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are suitable for high-power applications, ensuring reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower off-state currents, contributing to improved efficiency in the circuit.

Maximum Pulsed Drain Current (IDM): 240 A

A high pulsed drain current rating allows this FET to handle short bursts of high power, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 500 mJ

The avalanche energy rating indicates excellent power handling capabilities, providing resilience to voltage spikes in various applications.

Maximum Drain Current (Abs) (ID): 60 A

With a maximum drain current of 60 A, this FET is well suited for high-current applications, ensuring effective performance in demanding environments.

No. of Terminals: 3

Three terminals allow for simple and efficient circuit design, facilitating ease of integration into various electronic systems.

Maximum Power Dissipation (Abs): 180 W

A high power dissipation rating allows this FET to operate efficiently in high-power applications, ensuring durability and longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount styles are ideal for heat dissipation and mechanical stability in high-power applications, enhancing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides superior switching characteristics and low on-state resistance, resulting in increased efficiency.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures this FET can perform reliably in extreme conditions without failure.

Transistor Element Material: SILICON

Silicon material is widely used and proven in FET applications, ensuring consistent performance and longevity.

Terminal Finish: TIN LEAD

Tin lead finish improves solderability and contact reliability, making assembly processes easier and more efficient.

Maximum Drain Current (ID): 60 A

Reiterating a maximum drain current of 60 A emphasizes the robustness and capacity of this FET for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.022 ohm

A low on-resistance improves efficiency and reduces heat generation during operation, which is crucial for high-performance applications.

Terminal Position: SINGLE

A single terminal position simplifies the layout, making it easier to implement and design in compact circuits.

Technical Specifications

Power Field Effect Transistors (FET) STW60NE10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW60NE10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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