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STW15NB50

STMicroelectronics

STW15NB50 by STMicroelectronics

STW15NB50 by STMicroelectronics is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for SWITCHING applications. It features 58.4A max pulsed drain current and 850mJ avalanche energy rating. Operating in enhancement mode, it has a max power dissipation of 190W and can handle up to 150 °C operating temperature.

Median Price

$8.775

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2 parts In-Stock

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$8.775

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$8.775

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Vyrian

USA . 4,844 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,940 parts In-Stock

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Digiode

USA . 2,783 parts In-Stock

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Anansix

USA . 2,201 parts In-Stock

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J2 Sourcing AB

Sweden . 259 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 227 parts In-Stock

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ABC Electronics Ltd.

UK . 187 parts In-Stock

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Classic Components Corporation

USA . 66 parts In-Stock

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PAR Electronics

UK . 50 parts In-Stock

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50

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Speed Components Ltd

Israel . 33 parts In-Stock

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33

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Fibra_Brandt Electronic GMBH

Germany . 29 parts In-Stock

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GES GmbH

Germany . 10 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Semtec, LLC

USA . 4 parts In-Stock

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Lakeland Logistics Inc

USA . 2 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 576 parts In-Stock

1+ parts

$0.931

100+ parts

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$0.838

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576

$0.931

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$0.838

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MKK Technologies

India . 12 parts In-Stock

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$1.751

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$1.751

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DigiPath Technology Company

USA . 12 parts In-Stock

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$1.751

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12

$1.751

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AZTECH Wire

Italy . 370 parts In-Stock

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$19.520

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370

$19.520

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Kepictronics

USA . 20,740 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,081 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,622 parts In-Stock

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Corphita

USA . 1,481 parts In-Stock

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Perfect Parts

USA . 86 parts In-Stock

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FE SAS

France . 28 parts In-Stock

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Parana Technologies

USA . 17 parts In-Stock

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$1.113

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Assy Fe

Spain . 12 parts In-Stock

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Overview

Revolutionize your power switching applications with the STW15NB50 by STMicroelectronics. Crafted with precision and expertise, this N-channel Power FET offers unrivaled performance and reliability. Whether you're in need of enhanced efficiency or increased power handling capabilities, this transistor is the perfect solution for a wide range of switching applications. Trust in STMicroelectronics to deliver top-quality components that exceed expectations, providing you with the value, benefits, and advantages you deserve. Elevate your projects with the STW15NB50 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this transistor a good choice for switching applications.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this transistor can withstand high voltages, making it suitable for various high-power applications.

Maximum Drain Current (ID): 14.6 A

The high maximum drain current rating allows this transistor to handle large current loads, making it ideal for power switching applications.

Maximum Power Dissipation (Abs): 190 W

This transistor can dissipate up to 190 watts of power without overheating, indicating its high power handling capability.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) STW15NB50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

14.6 A

Maximum Drain Current (ID):

14.6 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

58.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW15NB50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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