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STV9936S

STMicroelectronics

STV9936S by STMicroelectronics

STV9936S by STMicroelectronics is a compact on-screen display IC designed for monitors, featuring 8 background colors and a max supply voltage of 3.6V. It operates within -0 °C to 70 °C and supports surface mount with a small outline package. Ideal for enhancing visual displays in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,271

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-

-

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Digiode

USA . 3,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,962

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-

-

-

Anansix

USA . 2,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,504

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,340 parts In-Stock

1+ parts

$3.438

100+ parts

-

1k+ parts

$3.094

10k+ parts

-

1,340

$3.438

-

$3.094

-

MKK Technologies

India . 155 parts In-Stock

1+ parts

$6.465

100+ parts

-

1k+ parts

-

10k+ parts

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155

$6.465

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DigiPath Technology Company

USA . 155 parts In-Stock

1+ parts

$6.465

100+ parts

-

1k+ parts

-

10k+ parts

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155

$6.465

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-

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Corphita

USA . 1,413 parts In-Stock

1+ parts

-

100+ parts

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1,413

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Parana Technologies

USA . 278 parts In-Stock

1+ parts

-

100+ parts

$4.111

1k+ parts

-

10k+ parts

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278

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$4.111

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Overview

Elevate your visual experience with the STV9936S from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced on-screen display IC ensures vibrant and clear imagery for monitors, making it perfect for various applications. With its compact design and exceptional performance, the STV9936S delivers unmatched quality and reliability. Choose STMicroelectronics for a product that enhances your displays while providing lasting value and superior benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this IC suitable for various applications.

Surface Mount: YES

The surface mount design facilitates easy and efficient PCB assembly, allowing for greater design flexibility and reduced space requirements in compact devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, making it an ideal choice for compact applications.

General IC Type: ON-SCREEN DISPLAY IC

As an on-screen display IC, it is specifically designed for applications requiring user interface overlays, making it perfect for monitors.

Power Supplies (V): 3.3

Operating at a nominal voltage of 3.3V makes this IC compatible with modern low-power devices, contributing to overall energy efficiency.

No. of Terminals: 16

Having 16 terminals allows for a good number of connections which can support a range of functionalities while maintaining a compact design.

No. of Background Colors: 8

The ability to display 8 background colors enhances versatility in visual outputs, making it suitable for various display applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes PCB real estate, allowing for the integration into compact electronic devices.

Application: MONITOR

Designed for monitor applications, this IC offers specialized capabilities for enhancing visual outputs, ideal for display devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is reliable for various environments, ensuring consistent performance under heat.

Minimum Operating Temperature: 0 °C

The operational range down to 0 °C ensures functionality in colder environments, allowing for versatile applications.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability, ensuring robust connections and reliability in the final product assembly.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility in PCB design, facilitating better integration into tight spaces.

Maximum Seated Height: 1.75 mm

With a low seated height of just 1.75 mm, this IC is suitable for ultra-thin device designs, contributing to modern product aesthetics.

Width: 3.9 mm

A narrow width allows for space-efficient placement on PCBs, which is crucial in compact electronic devices.

Minimum Supply Voltage (Vsup): 3 V

Operating down to 3V makes this IC compatible with a wide range of power supply configurations.

Length: 9.9 mm

The compact length of 9.9 mm is ideal for space-constrained designs, allowing integration into smaller devices.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this IC provides reliability and performance in consumer electronics.

Terminal Form: GULL WING

The gull-wing terminal form enhances accessibility and ease of soldering, ensuring optimal integration in assembly.

Character Array Size: 12 X 18

The 12x18 character array size is versatile for displaying alphanumeric information, enhancing user interaction with devices.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this IC is energy-efficient while providing adequate performance for visual display functions.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for soldering on standard PCB layouts, facilitating easy integration in most designs.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a range of power management solutions in electronic designs.

Technical Specifications

Superimposer Video ICs STV9936S attributes and parameters. Explore more Superimposer Video ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Character Array Size:

12 X 18

General IC Type:

Live Picture Freezing:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Background Colors:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STV9936S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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