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STV9426

STMicroelectronics

STV9426 by STMicroelectronics

STV9426 by STMicroelectronics is a CMOS on-screen display IC designed for monitors, featuring 8 background colors and a 12x18 character array. It operates b/w 4.75V and 5.25V with a max current of 50mA. Its compact design includes a rectangular plastic package with dual terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,459 parts In-Stock

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3,459

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Anansix

USA . 1,919 parts In-Stock

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Vyrian

USA . 1,295 parts In-Stock

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1,295

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Sinequanon

UK . 380 parts In-Stock

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380

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ABC Electronics Ltd.

UK . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 120 parts In-Stock

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120

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Mil-Aero Solutions, Inc.

USA . 64 parts In-Stock

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64

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Component Sense

UK . 34 parts In-Stock

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EMSNET

USA . 25 parts In-Stock

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First Choice Components Inc.

USA . 15 parts In-Stock

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Velocity Electronics

USA . 13 parts In-Stock

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LittleDiode

UK . 6 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 2,021 parts In-Stock

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$1.465

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$1.318

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MKK Technologies

India . 2,240 parts In-Stock

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$2.754

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$2.754

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$2.754

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A-Z Elektronik GmbH

Germany . 5,469 parts In-Stock

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Corphita

USA . 3,362 parts In-Stock

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Parana Technologies

USA . 1,852 parts In-Stock

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$1.751

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Kepictronics

USA . 520 parts In-Stock

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520

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Elevate your video display projects with the STV9426 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile on-screen display IC offers exceptional quality and reliability for monitor applications, bringing vibrant visuals to life with eight background color options. Designed for seamless integration and outstanding performance, the STV9426 empowers creators and engineers alike to enhance user experiences while simplifying design efforts. Transform your displays today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and strong protection against environmental factors, making it suitable for various applications in electronic devices.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient use of PCB space and simplifies the design of the electronic layout.

General IC Type: ON-SCREEN DISPLAY IC

Being an on-screen display IC makes this product ideal for applications like monitors, enhancing user interfaces with visual information.

Power Supplies (V): 5

The standard 5V power supply requirement ensures compatibility with a wide range of electronic circuits, facilitating easy integration.

No. of Terminals: 16

With 16 terminals, this IC offers sufficient connectivity for various functionalities without taking up excessive space on a PCB.

No. of Background Colors: 8

The ability to produce 8 background colors allows for enhanced visual customization, making it suitable for diverse display applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies assembly processes and is compatible with automated manufacturing techniques.

Application: MONITOR

Designed specifically for monitor applications, this IC optimizes performance and features tailored for display technology.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and stability under typical operating conditions for commercial environments.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows for functionality in a wide range of environmental conditions, increasing versatility.

Terminal Finish: TIN LEAD

Tin-lead finish increases solderability and provides robust connections during assembly, ensuring reliability in performance.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility on PCBs and allows for easier routing of connections.

Maximum Seated Height: 5.1 mm

A maximum seated height of 5.1 mm ensures compatibility with standard PCB heights while allowing for compact designs.

Width: 7.62 mm

At 7.62 mm wide, this component can be integrated easily into compact designs, making it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.75 V

The minimum supply voltage of 4.75V provides flexibility for power supply design considerations in various applications.

Temperature Grade: COMMERCIAL

A commercial temperature grade ensures that this IC can operate in typical consumer electronic environments without issues.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and efficient performance, making it suitable for modern electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for easy handling and secure mounting on PCBs, enhancing the reliability of the product in various applications.

Character Array Size: 12 X 18

The 12x18 character array size supports clear and readable on-screen text, making it suitable for user interfaces.

Maximum Supply Current: 50 mA

With a maximum supply current of 50 mA, this IC is energy-efficient, which is important for battery-operated devices.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard in many applications, facilitating compatibility with existing designs and components.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V ensures compatibility with typical circuit designs while allowing for some margin in power supply specifications.

Technical Specifications

Superimposer Video ICs STV9426 attributes and parameters. Explore more Superimposer Video ICs devices from STMicroelectronics

Specs

Application:

MONITOR

Character Array Size:

12 X 18

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Background Colors:

8

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

STV9426 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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