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STV9428

STMicroelectronics

STV9428 by STMicroelectronics

STV9428 by STMicroelectronics is a CMOS on-screen display IC designed for monitors, operating at 5V with a max temp of 70 °C. It features a compact rectangular package (25.15mm x 7.62mm) and has 20 terminals for easy integration. Ideal for enhancing video displays in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,867 parts In-Stock

1+ parts

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2,867

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-

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Anansix

USA . 2,855 parts In-Stock

1+ parts

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-

1k+ parts

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2,855

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Digiode

USA . 2,729 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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2,729

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Pegasus Components GmbH

Germany . 200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 577 parts In-Stock

1+ parts

$1.572

100+ parts

-

1k+ parts

$1.415

10k+ parts

-

577

$1.572

-

$1.415

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MKK Technologies

India . 1,748 parts In-Stock

1+ parts

$2.957

100+ parts

-

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1,748

$2.957

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DigiPath Technology Company

USA . 1,748 parts In-Stock

1+ parts

$2.957

100+ parts

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1,748

$2.957

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Parana Technologies

USA . 1,326 parts In-Stock

1+ parts

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100+ parts

$1.880

1k+ parts

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1,326

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$1.880

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Corphita

USA . 1,225 parts In-Stock

1+ parts

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1,225

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Kepictronics

USA . 404 parts In-Stock

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404

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Overview

Elevate your video display capabilities with the STV9428 from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced On-Screen Display IC ensures stunning visuals and seamless integration for monitors, enhancing user experience across various applications. With its robust design and efficient performance, the STV9428 offers exceptional value, making it the ideal choice for professionals seeking reliable quality and cutting-edge technology. Transform your visual projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring the IC performs reliably in various conditions.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, making it easier to integrate into designs.

General IC Type: ON-SCREEN DISPLAY IC

Designed specifically for on-screen display applications, this IC is optimized for high-quality visual output, making it a perfect fit for monitors.

Power Supplies (V): 5

Operating at a low 5V supply makes this IC power-efficient, reducing energy consumption and heat generation in device operation.

No. of Terminals: 20

With 20 terminals, this IC allows for a wide range of connections, providing flexibility in design and connectivity options.

Package Style (Meter): IN-LINE

The in-line package style is easy to handle and install, contributing to efficient production and assembly processes.

Application: MONITOR

Specifically tailored for monitor applications, ensuring optimal performance in displaying visual data.

Maximum Operating Temperature: 70 °C

The operating temperature range allows the IC to function reliably in warmer environments, making it suitable for various applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this IC can perform effectively in cooler conditions, broadening its usability.

Terminal Finish: TIN LEAD

The tin-lead finish on terminals ensures good solderability and corrosion resistance, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide versatility in mounting options, simplifying integration into different PCB layouts.

Maximum Seated Height: 3.93 mm

The compact height allows for low-profile designs, which is crucial in modern slim electronic devices.

Width: 7.62 mm

A narrow width helps save space on the PCB, allowing for more components in a given area and facilitating better design flexibility.

Length: 25.15 mm

An optimal length contributes to the overall compact design of the IC, making it suitable for various applications requiring limited space.

Temperature Grade: COMMERCIAL

Meeting commercial temperature grade standards ensures reliability for general consumer applications without extreme environmental stress.

Technology: CMOS

Utilizing CMOS technology enables lower power consumption and higher speed operation, making this IC both efficient and fast.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical stability in the circuit, making it ideal for robust applications.

Terminal Pitch: 2.54 mm

A standard terminal pitch makes it compatible with a wide range of PCB designs and simplifies the manufacturing process.

Technical Specifications

Superimposer Video ICs STV9428 attributes and parameters. Explore more Superimposer Video ICs devices from STMicroelectronics

Specs

Application:

MONITOR

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

Length:

25.15 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

STV9428 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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