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STV5350/T

STMicroelectronics

STV5350/T by STMicroelectronics

STV5350/T by STMicroelectronics is a Teletext IC with 13.875 MHz crystal frequency, 8 internal pages, and 5V power supply. It is used for TELETEXT AND VPS/PDC DECODER applications in commercial-grade technology with 28 terminals and rectangular package shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,494 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,494

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Anansix

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,007

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Digiode

USA . 669 parts In-Stock

1+ parts

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10k+ parts

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669

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,423 parts In-Stock

1+ parts

$3.018

100+ parts

-

1k+ parts

$2.716

10k+ parts

-

1,423

$3.018

-

$2.716

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MKK Technologies

India . 1,984 parts In-Stock

1+ parts

$5.674

100+ parts

-

1k+ parts

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10k+ parts

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1,984

$5.674

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$5.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

$5.674

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-

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Parana Technologies

USA . 589 parts In-Stock

1+ parts

-

100+ parts

$3.608

1k+ parts

-

10k+ parts

-

589

-

$3.608

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Corphita

USA . 175 parts In-Stock

1+ parts

-

100+ parts

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175

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Overview

Elevate your television viewing experience with the STV5350/T from STMicroelectronics, a leading manufacturer in the industry. This teletext IC offers unparalleled quality and reliability for seamless integration into various applications. Unlock a world of possibilities with its advanced features and exceptional performance, providing customers with value and benefits that exceed expectations. Upgrade your entertainment setup today with the STV5350/T and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the teletext ICs easy to handle and resistant to damage.

Nominal Crystal Frequency: 13.875 MHz

Provides accurate timing for the decoder, ensuring efficient processing of teletext and VPS/PDC signals.

No. of Stored Internal Pages: 8

Having a capacity to store 8 internal pages allows for ample information to be processed and displayed for the user.

Power Supplies (V): 5

Operating at 5 volts provides a stable power source for the ICs to function properly and reliably.

No. of Terminals: 28

With 28 terminals, the ICs have the flexibility to connect to various components in a teletext system efficiently.

Maximum Operating Temperature: 70 °C

Being able to operate at temperatures up to 70 °C ensures the ICs can perform under demanding conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the ICs can function in a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the ICs energy efficient and reliable.

Technical Specifications

Teletext ICs STV5350/T attributes and parameters. Explore more Teletext ICs devices from STMicroelectronics

Specs

General IC Type:

Nominal Crystal Frequency:

13.875 MHz

External Page Memory Support:

NO

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.83 mm

No. of Functions:

1

No. of Stored Internal Pages:

8

No. of Languages:

7

No. of Lines per Frame:

625

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.445 mm

Sub-Category:

Teletext ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Video Input Processor:

NO

Width:

15.24 mm

Trade Compliance

STV5350/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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