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STU60N3LH5

STMicroelectronics

STU60N3LH5 by STMicroelectronics

STU60N3LH5 by STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 48 A, a breakdown voltage of 30 V, and operates at temperatures from -55 °C to 175°C. Its compact design ensures efficient power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,948 parts In-Stock

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8,948

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Digiode

USA . 3,480 parts In-Stock

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3,480

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Anansix

USA . 2,215 parts In-Stock

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2,215

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

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$1.204

100+ parts

-

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$1.084

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1,229

$1.204

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$1.084

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Advanced Electronics

New Zealand . 36 parts In-Stock

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$1.948

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$1.773

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$1.597

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36

$1.948

$1.773

$1.597

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MKK Technologies

India . 185 parts In-Stock

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$2.265

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185

$2.265

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DigiPath Technology Company

USA . 185 parts In-Stock

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$2.265

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185

$2.265

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AZTECH Wire

Italy . 322 parts In-Stock

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$16.530

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322

$16.530

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Component Stockers USA

USA . 549 parts In-Stock

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$99.990

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549

$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,306 parts In-Stock

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Perfect Parts

USA . 18,322 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,828 parts In-Stock

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Corphita

USA . 3,890 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 927 parts In-Stock

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$1.440

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927

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$1.440

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Kepictronics

USA . 895 parts In-Stock

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895

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Fairview Electronics Ltd

UK . 100 parts In-Stock

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100

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Overview

Experience unparalleled reliability and performance with the STU60N3LH5 from STMicroelectronics. This N-Channel power FET is designed for seamless switching applications, ensuring high efficiency and low energy loss. Backed by a renowned manufacturer known for innovation and quality, this device excels in demanding environments, making it perfect for industrial automation, power management, and renewable energy solutions. Elevate your projects with STMicroelectronics—where cutting-edge technology meets exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and performance in various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and offer better performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit efficiency and simplifies design, making it easier to implement in various applications.

Transistor Application: SWITCHING

Designed for efficient switching, this FET is ideal for power management and control applications.

Minimum DS Breakdown Voltage: 30 V

This voltage rating allows for safe operation in various high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape provides ease of mounting and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable electrical connections in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode ensures low power consumption when not actively switching, enhancing overall efficiency.

Maximum Pulsed Drain Current (IDM): 192 A

This high pulsed current rating allows the device to handle significant surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 160 mJ

A high EAS rating increases reliability by protecting against transient energy events in circuits.

Maximum Drain Current (Abs): 48 A

This high maximum drain current ensures the FET can manage substantial power loads efficiently.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design while allowing effective control of current flow.

Maximum Power Dissipation (Abs): 60 W

A high power dissipation capability supports robust performance in high-power applications.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and easy to integrate into existing designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables faster switching and lower power loss compared to other types of transistors.

Maximum Operating Temperature: 175 °C

The ability to operate at high temperatures increases the reliability of the FET in extreme conditions.

Transistor Element Material: SILICON

Silicon provides excellent thermal and electrical properties, ensuring reliable device operation.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature allows usage in harsh environmental conditions and extreme applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, improving overall product lifespan.

Maximum Drain Current (ID): 48 A

This allows for efficient power handling in various applications, ensuring optimal performance.

Maximum Drain-Source On Resistance: 0.0114 ohm

Low on-resistance leads to minimal power loss during operation, enhancing energy efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies PCB layout and design.

Case Connection: DRAIN

A direct drain connection allows for straightforward integration into various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) STU60N3LH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.0114 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU60N3LH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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