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STU2N62K3

STMicroelectronics

STU2N62K3 by STMicroelectronics

STU2N62K3 by STMicroelectronics is a N-CHANNEL FET with 620V DS Breakdown Voltage, ideal for SWITCHING applications. It features 8.8A IDM, 85mJ EAS, and 3.6Ω RDS(ON). The transistor operates in ENHANCEMENT MODE with SILICON element material in a RECTANGULAR package suitable for various power applications.

Median Price

$0.504

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,708 parts In-Stock

1+ parts

$2.140

100+ parts

$0.968

1k+ parts

$0.733

10k+ parts

$0.575

4,708

$2.140

$0.968

$0.733

$0.575

Arrow

USA . 96,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.453

96,525

-

-

-

$0.453

Chip1Stop

Japan . 15,525 parts In-Stock

1+ parts

-

100+ parts

$0.543

1k+ parts

$0.413

10k+ parts

$0.267

15,525

-

$0.543

$0.413

$0.267

EBV Elektronik

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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3,000

-

-

-

-

Verical

USA . 2,025 parts In-Stock

1+ parts

-

100+ parts

-

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-

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$0.464

2,025

-

-

-

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,831 parts In-Stock

1+ parts

$0.467

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

$0.467

-

-

-

Digiode

USA . 4,355 parts In-Stock

1+ parts

$1.454

100+ parts

-

1k+ parts

-

10k+ parts

-

4,355

$1.454

-

-

-

Cyclops Electronics Ltd

UK . 100,000 parts In-Stock

1+ parts

-

100+ parts

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100,000

-

-

-

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Chip Stock

USA . 4,498 parts In-Stock

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4,498

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-

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HZD GmbH

Germany . 2,200 parts In-Stock

1+ parts

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2,200

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Anansix

USA . 253 parts In-Stock

1+ parts

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253

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ACDS - Activité Composants Distribution Service

France . 115 parts In-Stock

1+ parts

-

100+ parts

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115

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,041 parts In-Stock

1+ parts

$1.377

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$1.377

-

-

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IDEA Electronic Components Group

UK . 1,075 parts In-Stock

1+ parts

$1.529

100+ parts

-

1k+ parts

$1.376

10k+ parts

-

1,075

$1.529

-

$1.376

-

Andel Nordic

Denmark . 4,468 parts In-Stock

1+ parts

$2.149

100+ parts

-

1k+ parts

$2.063

10k+ parts

$2.063

4,468

$2.149

-

$2.063

$2.063

MKK Technologies

India . 908 parts In-Stock

1+ parts

$2.875

100+ parts

-

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908

$2.875

-

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DigiPath Technology Company

USA . 908 parts In-Stock

1+ parts

$2.875

100+ parts

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908

$2.875

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Glotronic Ltd.

UK . 107,220 parts In-Stock

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107,220

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 4,946 parts In-Stock

1+ parts

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4,946

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Alle Elektronik GmbH

Germany . 3,847 parts In-Stock

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3,847

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Perfect Parts

USA . 3,426 parts In-Stock

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3,426

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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RC Electronics

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Cyclops Electronics Ltd (Excess)

UK . 115 parts In-Stock

1+ parts

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115

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Parana Technologies

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$1.828

1k+ parts

-

10k+ parts

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60

-

$1.828

-

-

Overview

Experience superior quality and performance with the STU2N62K3 Power Field Effect Transistor by STMicroelectronics. This N-CHANNEL transistor is designed for switching applications, offering a high DS breakdown voltage of 620V and maximum pulsed drain current of 8.8A. With a built-in diode and enhanced mode operation, this transistor ensures efficient and reliable performance. Whether you're in the automotive, industrial, or consumer electronics industry, this transistor provides the value, benefits, and advantages you need to power your next project with confidence. Upgrade to STU2N62K3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them ideal for many applications.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this FET can handle high voltages and is suitable for applications where overvoltage protection is important.

Transistor Application: SWITCHING

Being designed for switching applications, this FET can efficiently turn on and off high power circuits with minimal loss.

Maximum Pulsed Drain Current (IDM): 8.8 A

The high pulsed drain current rating allows this FET to handle short bursts of high current, making it suitable for applications with dynamic power requirements.

Avalanche Energy Rating (EAS): 85 mJ

The high avalanche energy rating indicates that this FET can withstand sudden high-energy voltage spikes without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Being based on MOSFET technology, this FET offers high input impedance, fast switching speeds, and low power consumption.

Maximum Drain-Source On Resistance: 3.6 ohm

With a low on-resistance, this FET can efficiently conduct current with minimal voltage drop, resulting in low power dissipation.

Technical Specifications

Power Field Effect Transistors (FET) STU2N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

85 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (ID):

2.2 A

Maximum Drain-Source On Resistance:

3.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

8.8 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU2N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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