Loading...

STS1C1S250

STMicroelectronics

STS1C1S250 by STMicroelectronics

STS1C1S250 by STMicroelectronics is a versatile N/P-channel FET designed for switching applications. It features a 250V breakdown voltage, 3A max pulsed drain current, and operates in enhancement mode. Ideal for compact designs with its small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

-

-

-

-

Vyrian

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

Anansix

USA . 642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

642

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,217 parts In-Stock

1+ parts

$1.289

100+ parts

-

1k+ parts

$1.160

10k+ parts

-

2,217

$1.289

-

$1.160

-

MKK Technologies

India . 1,127 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$2.424

-

-

-

DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$2.424

-

-

-

Corphita

USA . 888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

888

-

-

-

-

Parana Technologies

USA . 768 parts In-Stock

1+ parts

-

100+ parts

$1.541

1k+ parts

-

10k+ parts

-

768

-

$1.541

-

-

Overview

Unlock superior performance with the STS1C1S250 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile power FET combines N-channel and P-channel capabilities, delivering exceptional efficiency for your switching applications. Encased in a compact surface mount design, it ensures reliability even in demanding environments. Experience enhanced power management and longevity, empowering your projects with unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Supporting both N-channel and P-channel configurations provides versatility in design, accommodating a wide range of circuit configurations.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diodes enhances the protection and functionality of the FET, allowing for improved efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is highly effective in controlling the flow of electricity, making it ideal for various electronic devices.

Surface Mount: YES

Being a surface mount device allows for compact PCB designs, enabling higher density and simpler assembly processes.

Minimum DS Breakdown Voltage: 250 V

A minimum breakdown voltage of 250V ensures reliable operation in high-voltage environments, making it suitable for robust applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout, contributing to better space management in circuit board designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve surface mount reliability, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

The enhancement mode of operation ensures optimal performance characteristics, particularly in low-power applications.

No. of Elements: 2

Having two elements in one package enhances functionality while saving board space and reducing overall component count.

Maximum Pulsed Drain Current (IDM): 3 A

A peak current rating of 3A makes it suitable for dynamic applications requiring short bursts of high current.

Maximum Drain Current (Abs) (ID): 0.6 A

With a maximum absolute drain current of 0.6A, this FET operates reliably under specified conditions, ensuring efficient performance.

No. of Terminals: 8

The 8-terminal configuration enhances connectivity options, providing flexibility in circuit design and integration.

Maximum Power Dissipation (Abs): 2 W

A power dissipation rating of 2W indicates effective thermal management, which is critical for maintaining performance in compact devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, improving design compactness without sacrificing performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology ensures high efficiency and low power consumption, making the FET suitable for battery-powered applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C provides a wide thermal tolerance, enhancing reliability in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material ensures good electrical characteristics and thermal stability, vital for various electronic applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the reliability of connections, improving the overall durability and performance of the FET.

Maximum Drain Current (ID): 0.75 A

A maximum drain current of 0.75A reinforces reliability in low to medium current applications, making it a robust choice.

Maximum Drain-Source On Resistance: 1.4 ohm

A low on-resistance of 1.4 ohms minimizes power loss during operation, improving efficiency and thermal performance in circuit applications.

Terminal Position: DUAL

The dual terminal position enhances accessibility, which is beneficial for layout flexibility and ease of connection on PCBs.

Technical Specifications

Power Field Effect Transistors (FET) STS1C1S250 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

.6 A

Maximum Drain Current (ID):

.75 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS1C1S250 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19