Loading...

STS11N3LLH5

STMicroelectronics

STS11N3LLH5 by STMicroelectronics

STS11N3LLH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 11 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in electronics.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3,663 parts In-Stock

1+ parts

$1.050

100+ parts

$0.389

1k+ parts

$0.273

10k+ parts

-

3,663

$1.050

$0.389

$0.273

-

Vyrian

USA . 12,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,349

-

-

-

-

Dan-Mar Components

USA . 3,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,663

-

-

-

-

Digiode

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,990

-

-

-

-

Anansix

USA . 2,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 1,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$0.567

100+ parts

-

1k+ parts

$0.510

10k+ parts

-

1,428

$0.567

-

$0.510

-

MKK Technologies

India . 1,700 parts In-Stock

1+ parts

$1.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,700

$1.066

-

-

-

DigiPath Technology Company

USA . 1,700 parts In-Stock

1+ parts

$1.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,700

$1.066

-

-

-

Ampacity Inc.

Singapore . 147 parts In-Stock

1+ parts

$18.050

100+ parts

-

1k+ parts

-

10k+ parts

-

147

$18.050

-

-

-

AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$19.090

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$19.090

-

-

-

Component Stockers USA

USA . 707 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

707

$99.990

-

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Perfect Parts

USA . 10,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,496

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,198

-

-

-

-

Corphita

USA . 4,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,925

-

-

-

-

Alle Elektronik GmbH

Germany . 3,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,363

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 497 parts In-Stock

1+ parts

-

100+ parts

$0.678

1k+ parts

-

10k+ parts

-

497

-

$0.678

-

-

Overview

Elevate your designs with the STS11N3LLH5 from STMicroelectronics, a powerhouse in the world of power FETs. Known for exceptional quality and reliability, STMicroelectronics ensures this N-channel transistor delivers outstanding performance in switching applications. Its compact surface-mount design fits seamlessly into any project, while its durability stands up to demanding environments. Choose the STS11N3LLH5 for efficiency that drives innovation and enhances your product's capabilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects against moisture and environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode enhances protection against reverse voltage conditions, improving reliability in circuit designs.

Transistor Application: SWITCHING

Designed primarily for switching applications, this FET ensures reliable operation in on/off control circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures robustness against voltage spikes, making it suitable for a range of applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, promoting versatile application designs.

Terminal Form: GULL WING

Gull wing terminals offer improved solderability, ensuring strong mechanical connections on the circuit board.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides a higher on-state current capability, which enhances overall performance in switching applications.

Maximum Pulsed Drain Current (IDM): 44 A

The high pulsed drain current rating allows for brief surges, making this FET suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 11 A

With a robust 11 A maximum drain current, this FET handles substantial load conditions efficiently.

No. of Terminals: 8

Having 8 terminals provides versatility in circuit design and enables various configurations.

Maximum Power Dissipation (Abs): 2.7 W

A power dissipation rating of 2.7 W ensures that it can operate effectively without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications, facilitating compact PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high speed, making it suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

Operating at high temperatures (up to 150 °C) enhances reliability and adaptability in extreme environments.

Transistor Element Material: SILICON

Silicon as the base material ensures excellent thermal stability and performance properties in various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish offers excellent corrosion resistance and reduces the risk of oxidation, ensuring reliable connectivity.

Maximum Drain Current (ID): 11 A

The sustained 11 A current capacity is ideal for a variety of power management scenarios.

Maximum Drain-Source On Resistance: 0.019 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency.

Terminal Position: DUAL

Dual terminal positioning allows for flexible placement on PCBs, improving design options.

Maximum Time At Peak Reflow Temperature (s): 30

The tolerance to a peak reflow temperature of 260 °C for up to 30 seconds ensures compatibility with most soldering processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for reliable soldering processes in automated manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) STS11N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS11N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19