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STPIC6A259M

STMicroelectronics

STPIC6A259M by STMicroelectronics

STPIC6A259M from STMicroelectronics is a BICMOS latch with a 5V nominal supply, featuring open-drain output and a load capacitance of 30 pF. It operates in extreme temperatures (-40 °C to 125 °C), making it ideal for automotive applications. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,136 parts In-Stock

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4,136

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Digiode

USA . 2,926 parts In-Stock

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2,926

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Anansix

USA . 1,205 parts In-Stock

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1,205

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Zilex Electronics Inc.

Canada . 376 parts In-Stock

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376

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$30.805

100+ parts

-

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$27.725

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346

$30.805

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$27.725

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MKK Technologies

India . 79 parts In-Stock

1+ parts

$57.927

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79

$57.927

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DigiPath Technology Company

USA . 79 parts In-Stock

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$57.927

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79

$57.927

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Parana Technologies

USA . 1,689 parts In-Stock

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$36.832

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1,689

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$36.832

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Corphita

USA . 83 parts In-Stock

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Overview

Unlock the potential of your designs with the STPIC6A259M from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality latch & flip-flop is engineered for reliability, offering superior performance across automotive and industrial applications. With its robust temperature range and compact design, it ensures seamless integration and enhanced efficiency. Elevate your projects while enjoying the peace of mind that comes from partnering with an industry titan!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures resilience against environmental factors, enhancing product longevity.

Surface Mount: YES

Surface mount capability allows for compact designs and better integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards (PCBs), facilitating easier layouts.

Nominal Supply Voltage / Vsup: 5 V

The standard 5V operating voltage aligns with common electronic systems, making it versatile and easy to integrate.

Load Capacitance (CL): 30 pF

With a low load capacitance, this product supports high-speed operations and reduces power consumption.

Power Supplies: 5 V

Consistent power supply requirement ensures compatibility with a wide range of devices and applications.

No. of Terminals: 24

A higher number of terminals allows for more functionalities and connections in a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances board density by allowing more components to be placed in a limited space.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes this product suitable for automotive and high-performance applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility for interfacing with different logic levels and devices.

Trigger Type: LOW LEVEL

Low-level triggering simplifies design requirements and compatibility with other low-voltage devices.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme conditions, ideal for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning increases versatility in layout designs, making it easier to fit into various applications.

Maximum Seated Height: 2.65 mm

A low profile facilitates integration into slim designs, which is essential for modern electronic devices.

Width: 7.5 mm

Narrow width allows for efficient placement and use in space-constrained environments.

Output Polarity: TRUE

True output polarity enhances clarity and predictability in circuit behavior.

Minimum Supply Voltage (Vsup): 4.5 V

The 4.5V minimum supply voltage offers flexibility to accommodate different power source levels.

Length: 15.4 mm

Compact length contributes to overall space savings on PCBs, facilitating complex designs.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability in harsh conditions.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS processes, resulting in high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals allow for easier hand-soldering and better surface mount reliability.

Packing Method: TUBE

Tube packaging minimizes damage during transport and handling, ensuring component integrity.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout design and enhances manufacturability.

Maximum Supply Voltage (Vsup): 5.5 V

The 5.5V maximum supply voltage allows safe operation without risking damage to the component.

Technical Specifications

Latches & Flip-Flops STPIC6A259M attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.5 mm

Trade Compliance

STPIC6A259M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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