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STP52N25M5

STMicroelectronics

STP52N25M5 by STMicroelectronics

STP52N25M5 by STMicroelectronics is a N-CHANNEL FET with 250V DS Breakdown Voltage, 28A ID, and 0.065 ohm RDS(on). Ideal for SWITCHING applications due to its 112A IDM and 230mJ EAS. Package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

$3.030

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 741 parts In-Stock

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$1.808

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741

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Chip1Stop

Japan . 783 parts In-Stock

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$3.030

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DigiKey

USA . 49 parts In-Stock

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$4.430

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Verical

USA . 741 parts In-Stock

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Digiode

USA . 825 parts In-Stock

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$1.693

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Vyrian

USA . 5,730 parts In-Stock

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Anansix

USA . 1,961 parts In-Stock

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IDEA Electronic Components Group

UK . 1,725 parts In-Stock

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$1.350

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$1.215

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Corphita

USA . 2,626 parts In-Stock

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$1.604

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MKK Technologies

India . 2,206 parts In-Stock

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$2.538

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DigiPath Technology Company

USA . 2,206 parts In-Stock

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$2.538

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Microchip USA

USA . 5,435 parts In-Stock

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Parana Technologies

USA . 1,256 parts In-Stock

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Perfect Parts

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Alle Elektronik GmbH

Germany . 551 parts In-Stock

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Overview

Elevate your projects with the STP52N25M5 Power Field Effect Transistor by STMicroelectronics. Crafted with precision and reliability in mind, this N-CHANNEL transistor offers a seamless switching experience, making it ideal for a wide range of applications. With a high DS Breakdown Voltage of 250V and a maximum Drain Current of 28A, this transistor guarantees exceptional performance and efficiency. Trust in STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations. Choose quality, choose STP52N25M5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower ON resistance and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for high-speed switching and efficient power management.

Minimum DS Breakdown Voltage: 250 V

With a high breakdown voltage, this FET can handle high voltages and is suitable for industrial and power electronic applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of PCB space.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections to the PCB, ensuring reliable performance in harsh operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and are easier to control, making them ideal for various switching applications.

Maximum Pulsed Drain Current (IDM): 112 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 230 mJ

The high avalanche energy rating indicates the FET's ability to withstand power spikes, ensuring reliable operation in rugged environments.

No. of Terminals: 3

The three terminals provide essential connections for power, control, and feedback signals, enabling versatile integration into electronic circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy heat dissipation and mechanical support, enhancing the FET's overall performance and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET suitable for demanding applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high thermal stability and low leakage current, ensuring long-term reliability and consistent performance.

Maximum Drain Current (ID): 28 A

With a high maximum drain current rating, this FET can handle continuous high current, making it suitable for power management and control applications.

Maximum Drain-Source On Resistance: 0.065 ohm

The low on-resistance minimizes power losses and heat generation, improving the efficiency and overall performance of the FET in high-current applications.

Terminal Position: SINGLE

The single terminal position simplifies the FET's connection to the circuit, reducing wiring complexity and improving overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) STP52N25M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW-ON RESISTANCE

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP52N25M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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