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STP30N20

STMicroelectronics

STP30N20 by STMicroelectronics

STP30N20 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 30 A, a breakdown voltage of 200 V, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,824 parts In-Stock

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5,824

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Anansix

USA . 2,849 parts In-Stock

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2,849

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Digiode

USA . 2,654 parts In-Stock

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2,654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,336 parts In-Stock

1+ parts

$1.424

100+ parts

-

1k+ parts

$1.282

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2,336

$1.424

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$1.282

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MKK Technologies

India . 872 parts In-Stock

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$2.678

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872

$2.678

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DigiPath Technology Company

USA . 872 parts In-Stock

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$2.678

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872

$2.678

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AZTECH Wire

Italy . 502 parts In-Stock

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$8.300

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502

$8.300

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Alle Elektronik GmbH

Germany . 4,797 parts In-Stock

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4,797

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Corphita

USA . 3,345 parts In-Stock

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3,345

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Parana Technologies

USA . 994 parts In-Stock

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$1.703

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994

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$1.703

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Overview

Unlock superior performance in your designs with the STP30N20 from STMicroelectronics, a leader in innovation and quality. This N-channel power FET excels in switching applications, delivering reliability and efficiency essential for modern electronics. With its robust construction and versatility, it’s ideal for everything from industrial automation to consumer electronics. Trust in STMicroelectronics to provide cutting-edge solutions that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide lower on-resistance and better efficiency for high-speed applications, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration in designs, providing additional protection and functionality, particularly in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, it can quickly toggle between on and off states, making it ideal for power management.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage increases the robustness of the transistor, allowing it to operate safely in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCB layouts, facilitating easier design integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide reliable mechanical stability and good electrical connections, suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for low power consumption during idle states, making it efficient for battery-operated devices.

Maximum Pulsed Drain Current (IDM): 120 A

A high pulsed drain current rating permits the device to handle substantial overloads, beneficial in pulse applications.

Avalanche Energy Rating (EAS): 140 mJ

The avalanche energy rating indicates the device's capability to withstand transient voltage spikes, providing reliability in fluctuating conditions.

No. of Terminals: 3

With three terminals, this FET is versatile for simple designs while maintaining robustness in electrical connections.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure placement and enhances heat dissipation, critical for effective thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-speed switching capabilities and low power consumption, making it efficient for modern applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating permits usage in demanding environments without compromising performance.

Transistor Element Material: SILICON

Silicon ensures good electrical properties and thermal conductivity, resulting in reliable performance across varied conditions.

Maximum Drain Current (ID): 30 A

A rated drain current of 30 A provides substantial power handling capability, suitable for high-performance applications.

Maximum Drain-Source On Resistance: 0.075 ohm

Low on-resistance minimizes power losses, enhancing overall efficiency, particularly in power conversion applications.

Terminal Position: SINGLE

Single terminal position simplifies device layout in circuits, making it user-friendly for designers.

Technical Specifications

Power Field Effect Transistors (FET) STP30N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP30N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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