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STP23NM50N

STMicroelectronics

STP23NM50N by STMicroelectronics

STP23NM50N by STMicroelectronics is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 68A IDM, 254mJ EAS, and 0.19 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 125W at 150 °C.

Median Price

$4.464

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 907 parts In-Stock

1+ parts

$3.960

100+ parts

$1.650

1k+ parts

$1.480

10k+ parts

-

907

$3.960

$1.650

$1.480

-

Arrow

USA . 907 parts In-Stock

1+ parts

$4.967

100+ parts

$2.089

1k+ parts

$2.049

10k+ parts

-

907

$4.967

$2.089

$2.049

-

Mouser Electronics

USA . 209 parts In-Stock

1+ parts

$5.930

100+ parts

$3.260

1k+ parts

$2.570

10k+ parts

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209

$5.930

$3.260

$2.570

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Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

-

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EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

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1,000

-

-

-

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Verical

USA . 740 parts In-Stock

1+ parts

-

100+ parts

$2.065

1k+ parts

$1.729

10k+ parts

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740

-

$2.065

$1.729

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,871 parts In-Stock

1+ parts

$3.762

100+ parts

-

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3,871

$3.762

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Vyrian

USA . 8,958 parts In-Stock

1+ parts

-

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8,958

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Anansix

USA . 2,529 parts In-Stock

1+ parts

-

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2,529

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-

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ACDS - Activité Composants Distribution Service

France . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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67

-

-

-

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Bristol Electronics

USA . 67 parts In-Stock

1+ parts

-

100+ parts

$1.859

1k+ parts

-

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67

-

$1.859

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Dan-Mar Components

USA . 67 parts In-Stock

1+ parts

-

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67

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$1.018

100+ parts

-

1k+ parts

$0.917

10k+ parts

-

1,709

$1.018

-

$0.917

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Semicontronic

India . 694 parts In-Stock

1+ parts

$1.780

100+ parts

$1.736

1k+ parts

$1.727

10k+ parts

-

694

$1.780

$1.736

$1.727

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MKK Technologies

India . 539 parts In-Stock

1+ parts

$1.915

100+ parts

-

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539

$1.915

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DigiPath Technology Company

USA . 539 parts In-Stock

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$1.915

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-

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539

$1.915

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Corphita

USA . 3,185 parts In-Stock

1+ parts

$3.564

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3,185

$3.564

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Microchip USA

USA . 7,745 parts In-Stock

1+ parts

$14.700

100+ parts

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7,745

$14.700

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Kepictronics

USA . 19,800 parts In-Stock

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19,800

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 3,933 parts In-Stock

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3,933

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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1,600

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Parana Technologies

USA . 107 parts In-Stock

1+ parts

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$1.218

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107

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$1.218

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iodParts Technologies Inc.

India . 67 parts In-Stock

1+ parts

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67

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Cyclops Electronics Ltd (Excess)

UK . 40 parts In-Stock

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40

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Overview

Power up your projects with the STP23NM50N by STMicroelectronics. Made with top-quality materials and cutting-edge technology, this N-channel power field effect transistor is perfect for switching applications, offering reliable performance and efficient operation. Whether you're working on industrial machinery or consumer electronics, this transistor is designed to meet your needs with a high breakdown voltage of 500V, a maximum drain current of 17A, and a low on-resistance of 0.19 ohms. Trust STMicroelectronics to deliver unmatched value and performance in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher electron mobility, making this transistor efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse voltage protection, enhancing the reliability of the system.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flow and minimize power losses.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this transistor can handle high voltages, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection to the circuit board, ensuring stable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and require a positive voltage to turn on, offering better control in power applications.

Maximum Pulsed Drain Current (IDM): 68 A

High pulsed drain current rating allows the transistor to handle surge currents and peak power demands.

Avalanche Energy Rating (EAS): 254 mJ

High avalanche energy rating ensures the transistor can withstand voltage spikes and transient conditions without damage.

Maximum Drain Current (Abs) (ID): 17 A

A high drain current rating enables the transistor to handle continuous current flow without overheating.

No. of Terminals: 3

Having three terminals allows for easy connectivity in the circuit layout.

Maximum Power Dissipation (Abs): 125 W

High power dissipation rating ensures the transistor can handle heat generated during operation without damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides mechanical stability and efficient heat dissipation for the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low on-resistance, and minimal gate leakage for efficient power control.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can operate in demanding thermal environments.

Transistor Element Material: SILICON

Silicon material provides reliability, durability, and high performance for the transistor element.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals ensures good solderability and long-term reliability in the circuit.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance minimizes power losses and improves efficiency in power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and connection, enhancing ease of use in the system.

Technical Specifications

Power Field Effect Transistors (FET) STP23NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

254 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP23NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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