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STP20NM65N

STMicroelectronics

STP20NM65N by STMicroelectronics

STP20NM65N from STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features a 650V breakdown voltage, 19A max drain current, and 160W power dissipation. Ideal for high-performance power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,148 parts In-Stock

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3,148

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Digiode

USA . 2,824 parts In-Stock

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2,824

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Anansix

USA . 922 parts In-Stock

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922

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

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$1.164

100+ parts

-

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$1.047

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1,283

$1.164

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$1.047

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MKK Technologies

India . 1,646 parts In-Stock

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$2.188

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1,646

$2.188

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DigiPath Technology Company

USA . 1,646 parts In-Stock

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$2.188

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1,646

$2.188

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Andel Nordic

Denmark . 487 parts In-Stock

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$7.592

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$7.288

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$7.288

487

$7.592

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$7.288

$7.288

AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$8.240

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839

$8.240

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Alle Elektronik GmbH

Germany . 4,036 parts In-Stock

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Perfect Parts

USA . 2,184 parts In-Stock

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Parana Technologies

USA . 1,747 parts In-Stock

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$1.392

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$1.392

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Corphita

USA . 59 parts In-Stock

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Overview

Elevate your designs with the STP20NM65N from STMicroelectronics, a trusted leader in innovative power solutions. This N-channel FET combines superior switching capabilities with robust reliability, making it ideal for diverse applications such as power management and industrial automation. Experience enhanced efficiency and durability that empowers your projects to operate smoothly under demanding conditions. Choose ST for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency in switching applications, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and makes it convenient for integrating into circuits that require reverse current handling.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in power management and control circuits.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage makes this FET suitable for high-voltage applications, adding versatility to its usage in power electronics.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on printed circuit boards, simplifying integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support, making the component suitable for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for improved performance in switching applications, enabling high-speed operation and better efficiency.

Maximum Pulsed Drain Current (IDM): 60 A

A high pulsed current rating makes this FET ideal for applications requiring sudden bursts of power, enhancing operational flexibility.

Avalanche Energy Rating (EAS): 115 mJ

This rating indicates robustness against voltage transients, making the FET reliable in demanding environments.

Maximum Drain Current (Abs) (ID): 19 A

A high maximum drain current capability ensures that this FET can handle significant loads, suitable for various power applications.

No. of Terminals: 3

Three terminals offer a compact design while maintaining the necessary functionality for efficient circuit configurations.

Maximum Power Dissipation (Abs): 160 W

The ability to dissipate high power ensures reliable operation even under heavy load conditions, reducing the risk of thermal failure.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for easy installation and reliable mechanical support, beneficial for industrial and high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides enhanced efficiency and faster switching speeds, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures the FET can perform in extreme conditions, ideal for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon as the base material ensures good thermal stability and performance, contributing to overall reliability and efficiency.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, improving the longevity of the connection in various applications.

Maximum Drain Current (ID): 15 A

The specified maximum drain current ensures the FET can handle substantial loads while maintaining proper functionality in power concerns.

Maximum Drain-Source On Resistance: 0.27 ohm

Low on-resistance leads to lower power losses during operation, enhancing efficiency and reducing heat generation in the circuit.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout process, allowing for easier integration into various electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) STP20NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

115 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.27 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP20NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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