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STP20NF06

STMicroelectronics

STP20NF06 by STMicroelectronics

STP20NF06 from STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 20 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

$0.585

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 500 parts In-Stock

1+ parts

-

100+ parts

$0.585

1k+ parts

$0.555

10k+ parts

$0.520

500

-

$0.585

$0.555

$0.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,414 parts In-Stock

1+ parts

$0.608

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4,414

$0.608

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Vyrian

USA . 4,567 parts In-Stock

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4,567

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Anansix

USA . 916 parts In-Stock

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916

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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100

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Semtec, LLC

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Corphita

USA . 2,801 parts In-Stock

1+ parts

$0.576

100+ parts

-

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2,801

$0.576

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IDEA Electronic Components Group

UK . 653 parts In-Stock

1+ parts

$1.239

100+ parts

-

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$1.115

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-

653

$1.239

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$1.115

-

MKK Technologies

India . 174 parts In-Stock

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$2.330

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174

$2.330

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DigiPath Technology Company

USA . 174 parts In-Stock

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$2.330

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174

$2.330

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AZTECH Wire

Italy . 678 parts In-Stock

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$11.760

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678

$11.760

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Infinite Electronics LLP (Excess)

. 10,007 parts In-Stock

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Metaverse IC Inc.

Canada . 10,005 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,585 parts In-Stock

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4,585

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,078 parts In-Stock

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Parana Technologies

USA . 1,941 parts In-Stock

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$1.482

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1,941

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$1.482

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RC Electronics

USA . 615 parts In-Stock

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Kepictronics

USA . 130 parts In-Stock

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Overview

Elevate your projects with the STP20NF06 from STMicroelectronics, a trusted leader in power solutions. This N-channel FET delivers exceptional reliability for switching applications, ensuring high performance and efficiency. With robust build quality and a compact design, it excels in demanding environments, making it ideal for industrial automation, power management, and renewable energy systems. Experience unmatched value and innovation with STMicroelectronics, where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection, making the component suitable for various application environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally preferred for their higher electron mobility, allowing for better efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces the number of required components, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring quick response times and reduced power loss during operation.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V ensures that the FET can handle higher voltage applications safely.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, enabling compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support, making it easier to solder and handle in various assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low power consumption and high efficiency when the transistor is not in use.

Maximum Pulsed Drain Current (IDM): 80 A

The high pulsed drain current capacity allows the FET to manage substantial current loads during transient conditions.

Avalanche Energy Rating (EAS): 120 mJ

A robust avalanche energy rating means the FET can withstand high-energy conditions without failing, increasing reliability.

Maximum Drain Current (Abs) (ID): 20 A

Rated for a maximum drain current of 20 A, this FET can effectively handle significant power loads in various applications.

No. of Terminals: 3

Three terminals simplify the design while maintaining versatility for a wide range of circuit configurations.

Maximum Power Dissipation (Abs): 60 W

A power dissipation rating of 60 W allows for efficient thermal management, reducing the risk of overheating in high-load scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount style assists in stable installation on heat sinks or circuit boards, critical for reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching, making this product ideal for modern power electronics.

Maximum Operating Temperature: 175 °C

The ability to operate at temperatures up to 175 °C ensures reliability in high-temperature environments.

Transistor Element Material: SILICON

Silicon material supports efficient electrical properties and is widely used across the industry, ensuring availability and reliability.

Terminal Finish: MATTE TIN

Matte tin finish promotes good solderability and corrosion resistance, enhancing long-term performance in various conditions.

Maximum Drain Current (ID): 20 A

Consistent max drain current rating indicates reliability and capacity to handle substantial loads in a variety of applications.

Maximum Drain-Source On Resistance: 0.07 ohm

Low on-resistance minimizes power loss during operation, leading to improved overall efficiency in end-user applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, optimizing space and ease of use.

Case Connection: DRAIN

A drain connection simplifies the design for common switching configurations, reducing complexity in circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) STP20NF06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP20NF06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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