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STP16N50M2

STMicroelectronics

STP16N50M2 by STMicroelectronics

STP16N50M2 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 52A pulsed drain current, and operates at temperatures from -55 °C to 150 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

$0.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.450

1k+ parts

$0.435

10k+ parts

$0.400

1,000

-

$0.450

$0.435

$0.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,492 parts In-Stock

1+ parts

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2,492

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Digiode

USA . 2,166 parts In-Stock

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2,166

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Vyrian

USA . 1,976 parts In-Stock

1+ parts

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1,976

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

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-

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IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.579

1k+ parts

$0.546

10k+ parts

$0.520

1,000

-

$0.579

$0.546

$0.520

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,377 parts In-Stock

1+ parts

$1.104

100+ parts

-

1k+ parts

$0.994

10k+ parts

-

1,377

$1.104

-

$0.994

-

MKK Technologies

India . 1,535 parts In-Stock

1+ parts

$2.076

100+ parts

-

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1,535

$2.076

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DigiPath Technology Company

USA . 1,535 parts In-Stock

1+ parts

$2.076

100+ parts

-

1k+ parts

-

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1,535

$2.076

-

-

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AZTECH Wire

Italy . 116 parts In-Stock

1+ parts

$16.090

100+ parts

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116

$16.090

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QUARKTWIN TECHNOLOGY LTD

USA . 22,260 parts In-Stock

1+ parts

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22,260

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Corphita

USA . 3,640 parts In-Stock

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3,640

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Alle Elektronik GmbH

Germany . 3,406 parts In-Stock

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3,406

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Epart123

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 53 parts In-Stock

1+ parts

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100+ parts

$1.320

1k+ parts

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53

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$1.320

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Overview

Unlock unparalleled performance with the STP16N50M2 from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET delivers exceptional efficiency and reliability for your switching applications, ensuring optimal operation even in demanding environments. With built-in diode protection and a wide operational temperature range, it empowers designers to create cutting-edge solutions for industrial, automotive, and consumer electronics. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and faster switching speeds, making them ideal for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces the need for external components, streamlining overall system design.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flow, improving performance in power electronics.

Minimum DS Breakdown Voltage: 500 V

High breakdown voltage ensures reliability in high-voltage applications, reducing the risk of component failure.

Package Shape: RECTANGULAR

The rectangular package shape facilitates ease of mounting and integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and ease of soldering, making them ideal for robust applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower quiescent current and improved efficiency in power management applications.

Maximum Pulsed Drain Current (IDM): 52 A

A high pulsed drain current capacity makes this FET suitable for applications requiring a strong current surge without damage.

Avalanche Energy Rating (EAS): 215 mJ

High avalanche energy rating ensures that the FET can withstand transient conditions, enhancing reliability and longevity.

No. of Terminals: 3

The simplicity of a 3-terminal design facilitates compact circuit layouts while providing essential connectivity.

Maximum Power Dissipation (Abs): 110 W

The ability to dissipate up to 110 W makes this FET suitable for high-power applications, improving system performance.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides secure installation options, enhancing the thermal management of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to low gate power consumption and high-speed operation, making it ideal for various electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in demanding environments and thermal conditions.

Transistor Element Material: SILICON

Silicon as the base material offers a balance between performance and cost, widely used and trusted in semiconductor applications.

Minimum Operating Temperature: -55 °C

The capability to operate at low temperatures ensures the FET can function reliably in harsh environments.

Maximum Drain Current (ID): 13 A

A maximum drain current rating of 13 A ensures it can handle significant loads, making it suitable for power control applications.

Maximum Drain-Source On Resistance: 0.28 ohm

Low on-resistance leads to reduced power loss and improved efficiency in switching operations, crucial for power application.

Terminal Position: SINGLE

The single terminal position provides a compact design that is easy to integrate into PCBs.

Case Connection: DRAIN

Direct drain connection enhances performance and facilitates seamless integration into various circuit configurations.

Maximum Feedback Capacitance (Crss): 1.35 pF

Low feedback capacitance results in faster switching times, beneficial for applications demanding high speeds.

Technical Specifications

Power Field Effect Transistors (FET) STP16N50M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.35 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

52 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP16N50M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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