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STP16DPPS05XTTR

STMicroelectronics

STP16DPPS05XTTR by STMicroelectronics

STP16DPPS05XTTR from STMicroelectronics is a 16-segment LED display driver with a serial data input mode, operating b/w 3-5.5V. It features a compact design (4.4mm x 7.8mm) and supports automotive applications with a max temp of 125 °C. Ideal for efficient graphics displays in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,036 parts In-Stock

1+ parts

-

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9,036

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Digiode

USA . 3,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

3,507

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-

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Anansix

USA . 243 parts In-Stock

1+ parts

-

100+ parts

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243

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,439 parts In-Stock

1+ parts

$8.114

100+ parts

-

1k+ parts

-

10k+ parts

-

4,439

$8.114

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-

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

1+ parts

$8.521

100+ parts

-

1k+ parts

$7.669

10k+ parts

-

1,088

$8.521

-

$7.669

-

AZTECH Wire

Italy . 187 parts In-Stock

1+ parts

$13.890

100+ parts

-

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-

10k+ parts

-

187

$13.890

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MKK Technologies

India . 2,312 parts In-Stock

1+ parts

$16.023

100+ parts

-

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10k+ parts

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2,312

$16.023

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DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$16.023

100+ parts

-

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10k+ parts

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2,312

$16.023

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-

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Perfect Parts

USA . 8,400 parts In-Stock

1+ parts

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8,400

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Corphita

USA . 1,813 parts In-Stock

1+ parts

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1,813

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Parana Technologies

USA . 930 parts In-Stock

1+ parts

-

100+ parts

$10.188

1k+ parts

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930

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$10.188

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Overview

Elevate your display solutions with the STP16DPPS05XTTR from STMicroelectronics, a leader in innovative technology. This robust graphics display driver is designed for versatility, seamlessly integrating into automotive and consumer applications alike. With its compact design and reliable performance across extreme temperatures, you unlock unmatched quality and efficiency. Trust in STMicroelectronics for superior products that empower your creativity and enhance user experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Display Mode: SEGMENT

Segment display mode offers clear visibility and simple integration into various display designs, enhancing user experience.

Data Input Mode: SERIAL

Serial data input enables easy communication with microcontrollers and reduces the number of required pins, streamlining circuit design.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, contributing to smaller and lighter product form factors.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options, supporting a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, facilitating efficient use of surface area.

Power Supplies (V): 3.3/5

Compatibility with both 3.3 V and 5 V power supplies increases versatility in product usage across different systems.

No. of Terminals: 24

With 24 terminals, the product can interface with multiple devices, providing ample connectability for complex applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This packaging style reduces size while allowing for efficient heat dissipation, essential in high-performance applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V enhances compatibility with lower voltage applications, increasing design options.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding thermal environments, including automotive applications.

Minimum Operating Temperature: -40 °C

Capability to operate at extremely low temperatures supports functionality in harsh environments, ideal for outdoor or industrial uses.

Terminal Finish: MATTE TIN

Matte tin terminals provide excellent solderability and corrosion resistance, enhancing the longevity of the device.

Terminal Position: DUAL

Dual terminal position aids in flexible routing on the PCB, allowing for optimized component placement and soldering.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slim profile for compact designs, making it ideal for space-constrained applications.

Width: 4.4 mm

A width of 4.4 mm allows the product to fit into smaller enclosures, promoting versatility in design.

Maximum Time At Peak Reflow Temperature (s): 30

Support for extended peak reflow times improves compatibility with different solder materials, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

Ability to withstand high reflow temperatures is critical for compatibility with various PCB assembly processes.

Length: 7.8 mm

A compact length of 7.8 mm enhances design flexibility, making it suitable for small electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive temperature grading ensures reliability and safety in automotive applications, meeting industry standards.

Terminal Form: GULL WING

Gull wing terminals provide stable mechanical connections, making soldering easier and enhancing reliability.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V makes it ideal for compatibility with low-power digital systems, reducing overall power consumption.

No. of Segments: 16

With support for 16 segments, the driver can display complex information, enabling advanced visual outputs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density placement, maximizing the number of components on a PCB.

Minimum fmax: 30 MHz

A minimum frequency of 30 MHz ensures fast operation, supporting high-definition visuals and responsive performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling precautions, which is manageable in most assembly environments.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this component is specifically optimized for controlling LED displays, ensuring vibrant and efficient output.

Technical Specifications

Graphics Display Drivers STP16DPPS05XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

30 MHz

Trade Compliance

STP16DPPS05XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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