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STP16CP596TTR

STMicroelectronics

STP16CP596TTR by STMicroelectronics

STP16CP596TTR from STMicroelectronics is a segment LED display driver with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 125 °C. It features a compact 24-terminal design for surface mounting, ideal for automotive applications. With serial data input and support for up to 16 segments, it ensures efficient graphics display control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,913 parts In-Stock

1+ parts

-

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3,913

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Vyrian

USA . 2,732 parts In-Stock

1+ parts

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2,732

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Anansix

USA . 2,125 parts In-Stock

1+ parts

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2,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 134 parts In-Stock

1+ parts

$4.879

100+ parts

-

1k+ parts

-

10k+ parts

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134

$4.879

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IDEA Electronic Components Group

UK . 2,050 parts In-Stock

1+ parts

$11.466

100+ parts

-

1k+ parts

$10.319

10k+ parts

-

2,050

$11.466

-

$10.319

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$18.750

100+ parts

-

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-

883

$18.750

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MKK Technologies

India . 693 parts In-Stock

1+ parts

$21.561

100+ parts

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693

$21.561

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DigiPath Technology Company

USA . 693 parts In-Stock

1+ parts

$21.561

100+ parts

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10k+ parts

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693

$21.561

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Corphita

USA . 2,793 parts In-Stock

1+ parts

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2,793

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Parana Technologies

USA . 1,763 parts In-Stock

1+ parts

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100+ parts

$13.709

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1,763

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$13.709

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Elevate your display solutions with the STP16CP596TTR from STMicroelectronics, a trusted leader in innovative technology. Engineered for superior performance, this graphics display driver excels in automotive applications and beyond, offering unmatched reliability and efficiency. Its compact design allows for seamless integration, while its wide operating temperature range ensures consistent functionality. Enhance your designs with a product that combines quality, versatility, and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures lightweight construction, durability, and protection against environmental factors.

Display Mode: SEGMENT

Segment display mode makes it suitable for clear and readable numeric or alphanumeric outputs, enhancing user experience.

Data Input Mode: SERIAL

Serial data input simplifies the communication with microcontrollers, making integration into various systems straightforward.

Surface Mount: YES

Surface mount compatibility allows for compact designs and easier assembly in automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage gives flexibility in power supply options and enhances power delivery for robust performance.

Package Shape: RECTANGULAR

The rectangular package shape aids in space-efficient layout designs on PCBs, optimizing the circuit design.

Power Supplies (V): 3.5/5

Supports a range of power supplies, making it versatile for various applications and enhancing compatibility.

No. of Terminals: 24

The 24 terminals provide ample connection points for interfacing with other components, facilitating complex designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for space-efficient designs, critical for modern compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this driver is suitable for high-temperature environments, ideal for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures extends the usability of the product in harsh weather conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and long-term reliability of connections, which is crucial for maintaining performance.

Terminal Position: DUAL

Dual terminal positioning allows for better PCB design flexibility and optimized routing for connections.

Maximum Seated Height: 1.1 mm

The low seated height makes it ideal for low-profile applications where space conservation is critical.

Width: 4.4 mm

A compact width further promotes design flexibility, allowing for integration in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The limited time at peak reflow temperature reduces the risk of thermal damage during the soldering process.

Peak Reflow Temperature °C: 260

This high peak temperature capability ensures compatibility with various soldering processes for robust assembly.

Length: 7.8 mm

A manageable length ensures it can fit in various circuit designs without hindering layout options.

Temperature Grade: AUTOMOTIVE

Designed for automotive grade applications, ensuring reliability and performance in demanding conditions.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, making it suitable for rigorous applications.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage facilitates compatibility with many common electronic components, enhancing system integration.

No. of Segments: 16

Having 16 segments allows for more complex display outputs, making it suitable for varied applications.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch provides high density in PCB layout, allowing for compact designs in modern electronics.

Minimum fmax: 25 MHz

With a minimum frequency of 25 MHz, it ensures fast response times for dynamic display applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, ensuring proper handling and storage to maintain product integrity.

Interface IC Type: LED DISPLAY DRIVER

Being an LED display driver makes it ideal for a wide range of display applications, ensuring compatibility with LED technologies.

Technical Specifications

Graphics Display Drivers STP16CP596TTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CP596TTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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