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STP16CP596MTR

STMicroelectronics

STP16CP596MTR by STMicroelectronics

STP16CP596MTR from STMicroelectronics is a robust LED display driver designed for automotive applications. It operates within a supply voltage range of 3-5.5V, supports serial data input, and features 16 segments. With a wide temp range (-40 °C to 125 °C), it's ideal for reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,162 parts In-Stock

1+ parts

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4,162

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Digiode

USA . 3,205 parts In-Stock

1+ parts

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3,205

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Semi Source

USA . 3,000 parts In-Stock

1+ parts

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3,000

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

1+ parts

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1,000

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Anansix

USA . 449 parts In-Stock

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449

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$4.186

100+ parts

-

1k+ parts

$3.767

10k+ parts

-

1,240

$4.186

-

$3.767

-

MKK Technologies

India . 1,086 parts In-Stock

1+ parts

$7.872

100+ parts

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1,086

$7.872

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$7.872

100+ parts

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1,086

$7.872

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AZTECH Wire

Italy . 103 parts In-Stock

1+ parts

$13.980

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103

$13.980

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Microchip USA

USA . 304 parts In-Stock

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$19.462

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304

$19.462

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 1,409 parts In-Stock

1+ parts

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$5.005

1k+ parts

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1,409

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$5.005

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Corphita

USA . 372 parts In-Stock

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372

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Overview

Elevate your display projects with the STP16CP596MTR from STMicroelectronics, a leader in innovative semiconductor solutions. This graphics display driver combines exceptional quality and reliability, perfect for diverse applications, from automotive dashboards to consumer electronics. With its compact design and efficient power consumption, it ensures seamless integration while delivering vibrant visual performance. Experience unmatched value and performance that enhances your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances reliability and protects against environmental factors, making it ideal for various applications.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read output, making it suitable for applications requiring straightforward visual information.

Data Input Mode: SERIAL

The serial data input mode simplifies connectivity with microcontrollers and other components, facilitating easier integration into electronic systems.

Surface Mount: YES

Surface mount technology allows for a smaller form factor and better space efficiency in circuit board design.

Maximum Supply Voltage: 5.5 V

A higher supply voltage tolerance ensures versatility and compatibility with a wide range of existing systems.

Package Shape: RECTANGULAR

The rectangular package shape offers efficiency in PCB layout and design, maximizing space utilization.

Power Supplies (V): 3.5/5

Support for multiple power supply voltages adds flexibility for designers needing to adapt to different operational needs.

No. of Terminals: 24

With 24 terminals, the device provides ample connectivity options for functional and versatile implementation.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact applications, minimizing footprint while maximizing performance.

Minimum Supply Voltage: 3 V

A low minimum supply voltage allows compatibility with low-power systems, promoting energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this driver suitable for automotive and industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C enhances reliability in extreme temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent corrosion resistance and enhances the conductivity and longevity of connections.

Terminal Position: DUAL

Dual terminal position promotes better connectivity options and layout flexibility in circuit design.

Maximum Seated Height: 2.65 mm

The low seated height allows for slim designs while still providing a reliable connection, useful in space-constrained applications.

Width: 7.5 mm

The compact width is suitable for tight spaces, ideal for integration into small electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures the component can withstand typical reflow soldering processes without damage, facilitating easier manufacturing.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C indicates the chip's durability during soldering processes, ensuring quality and reliability.

Length: 15.4 mm

The compact length simplifies PCB design and optimizes space for other components.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive grade standards, ensuring high reliability and performance in all vehicle conditions.

Terminal Form: GULL WING

Gull wing terminals provide stable and reliable solder joints, enhancing connection integrity and ease of assembly.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V aligns with modern digital logic levels, ensuring compatibility with many digital systems.

No. of Segments: 16

With 16 segments, this display driver can drive a variety of segment displays, offering versatility in design.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance of space saving and ease of soldering, making it user-friendly.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz ensures high-speed data processing, essential for responsive display applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 designation allows for some level of moisture exposure during handling, simplifying production processes.

Interface IC Type: LED DISPLAY DRIVER

As a dedicated LED display driver, this IC is specifically optimized for controlling LED segments, making it a targeted solution for display applications.

Technical Specifications

Graphics Display Drivers STP16CP596MTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CP596MTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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