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STP16C596MTR

STMicroelectronics

STP16C596MTR by STMicroelectronics

STP16C596MTR from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates with a supply voltage of 4.5-5.5V, supports serial data input, and drives up to 16 segments. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,171 parts In-Stock

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6,171

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Digiode

USA . 2,635 parts In-Stock

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2,635

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Anansix

USA . 845 parts In-Stock

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845

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,430 parts In-Stock

1+ parts

$6.190

100+ parts

-

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$5.571

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1,430

$6.190

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$5.571

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MKK Technologies

India . 1,068 parts In-Stock

1+ parts

$11.639

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1,068

$11.639

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DigiPath Technology Company

USA . 1,068 parts In-Stock

1+ parts

$11.639

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1,068

$11.639

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AZTECH Wire

Italy . 432 parts In-Stock

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$12.770

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432

$12.770

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Microchip USA

USA . 426 parts In-Stock

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$20.211

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426

$20.211

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Ampacity Inc.

Singapore . 1,069 parts In-Stock

1+ parts

$50.500

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1,069

$50.500

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Corphita

USA . 3,070 parts In-Stock

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3,070

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Parana Technologies

USA . 2,308 parts In-Stock

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$7.401

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2,308

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$7.401

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A-Z Elektronik GmbH

Germany . 1,937 parts In-Stock

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1,937

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Overview

Elevate your display projects with the STP16C596MTR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust graphics display driver ensures stunning visuals and reliable performance in demanding environments. With its compact design and exceptional temperature resilience, it's ideal for automotive and industrial applications. Trust in ST's commitment to quality and innovation, empowering you to create captivating displays that stand out and last longer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making this driver suitable for a wide range of applications.

Display Mode: SEGMENT

Segment display mode offers clear and understandable visual information, ideal for applications requiring straightforward numeric and character displays.

Data Input Mode: SERIAL

The serial data input mode allows for efficient data transmission, reducing the complexity of wiring and improving system integration.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies assembly processes, making it a good choice for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V allows for integration in standard operating environments without the need for additional voltage regulation.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout design on PCBs, contributing to optimized space utilization.

Power Supplies (V): 5

Designed for a standard 5 V supply, making it easy to use in common electronic devices and systems.

No. of Terminals: 24

With 24 terminals, this driver provides ample connectivity for interfacing with various circuits and components.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space and weight are critical, enabling compact design solutions.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable performance within a range suitable for many standard environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating indicates ability to perform in extreme conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver can be used in harsh environments, ensuring reliable performance in cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent corrosion resistance and reliable electrical connectivity, enhancing longevity.

Terminal Position: DUAL

Dual terminal position supports flexible design options and adaptability to different board layouts.

Maximum Seated Height: 2.65 mm

A compact seated height of 2.65 mm is advantageous for low-profile applications, contributing to space-saving designs.

Width: 7.5 mm

A width of 7.5 mm makes the device suitable for tight layouts while still allowing for effective thermal dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting a maximum time of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250 °C aligns with most PCB assembly processes, ensuring ease of integration into manufacturing.

Length: 15.4 mm

This length is optimum for fitting within various compact designs, enhancing versatility in applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures durable performance and reliability in automotive applications.

Technology: CMOS

CMOS technology is energy-efficient, offering low power consumption and making it a preferred choice for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improves reliability in connections, ideal for rigorous applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with typical digital systems, simplifying integration.

No. of Segments: 16

With 16 segments, this driver allows for complex displays, making it ideal for applications requiring detailed visual output.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for effective spacing in PCB layouts, ensuring compatibility with standard assembly practices.

Minimum fmax: 25 MHz

A minimum fmax of 25 MHz supports fast data processing, crucial for responsive display applications.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, meaning proper handling during assembly is essential for reliability.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, it is specifically designed for high-efficiency driving of LED segments, ensuring optimal performance in display applications.

Technical Specifications

Graphics Display Drivers STP16C596MTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16C596MTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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