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STP15N65M5

STMicroelectronics

STP15N65M5 by STMicroelectronics

STP15N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 44A IDM and 0.34 ohm RDS(on), operating in ENHANCEMENT MODE. The transistor has a single configuration with built-in diode, suitable for high-power RECTANGULAR package designs.

Median Price

$2.285

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 806 parts In-Stock

1+ parts

$3.360

100+ parts

$1.512

1k+ parts

$1.134

10k+ parts

$0.975

806

$3.360

$1.512

$1.134

$0.975

Future Electronics

Canada . 3,698 parts In-Stock

1+ parts

-

100+ parts

$1.210

1k+ parts

$1.180

10k+ parts

$1.150

3,698

-

$1.210

$1.180

$1.150

Avnet

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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900

-

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Distributors (In-Stock)

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Digiode

USA . 169 parts In-Stock

1+ parts

$1.216

100+ parts

-

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-

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-

169

$1.216

-

-

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TME

Poland . 88 parts In-Stock

1+ parts

$2.130

100+ parts

$1.480

1k+ parts

$1.130

10k+ parts

-

88

$2.130

$1.480

$1.130

-

Bristol Electronics

USA . 164 parts In-Stock

1+ parts

$2.338

100+ parts

$1.449

1k+ parts

$1.169

10k+ parts

-

164

$2.338

$1.449

$1.169

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Vyrian

USA . 8,183 parts In-Stock

1+ parts

-

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8,183

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

1+ parts

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6,000

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IBS Electronics

USA . 4,598 parts In-Stock

1+ parts

-

100+ parts

$1.697

1k+ parts

$1.255

10k+ parts

-

4,598

-

$1.697

$1.255

-

Anansix

USA . 1,235 parts In-Stock

1+ parts

-

100+ parts

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1,235

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Dan-Mar Components

USA . 164 parts In-Stock

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164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$1.101

100+ parts

-

1k+ parts

$0.991

10k+ parts

-

862

$1.101

-

$0.991

-

Corphita

USA . 2,506 parts In-Stock

1+ parts

$1.152

100+ parts

-

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-

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2,506

$1.152

-

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MKK Technologies

India . 402 parts In-Stock

1+ parts

$2.071

100+ parts

-

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402

$2.071

-

-

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DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$2.071

100+ parts

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402

$2.071

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Microchip USA

USA . 6,025 parts In-Stock

1+ parts

$18.070

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6,025

$18.070

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Epart123

USA . 6,000 parts In-Stock

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6,000

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 4,772 parts In-Stock

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4,772

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Perfect Parts

USA . 4,014 parts In-Stock

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4,014

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Alle Elektronik GmbH

Germany . 991 parts In-Stock

1+ parts

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991

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Parana Technologies

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$1.317

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776

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$1.317

-

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Overview

Experience the power of innovation with the STP15N65M5 by STMicroelectronics. This high-quality Power FET offers exceptional performance in a variety of switching applications, thanks to its cutting-edge technology and reliable construction. With a maximum pulsed drain current of 44A and a minimum DS breakdown voltage of 650V, this transistor delivers superior efficiency and durability. Trust in STMicroelectronics to provide you with the tools you need to succeed in your projects. Elevate your designs with the STP15N65M5 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the Power FET lightweight and durable for easy handling and long-lasting usage.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, making the product more reliable and efficient in various circuit configurations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power FET provides fast and efficient switching capabilities.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this Power FET can handle high voltages, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in circuit boards, ensuring stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and lower output resistance, enhancing overall circuit efficiency.

Maximum Pulsed Drain Current (IDM): 44 A

The high pulsed drain current rating allows the Power FET to handle short-duration peak currents, making it suitable for power surge protection.

Avalanche Energy Rating (EAS): 160 mJ

The high avalanche energy rating ensures reliable operation under surge conditions, providing added protection to the circuit.

No. of Terminals: 3

Having 3 terminals simplifies the circuit connection, making installation and troubleshooting easier.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and easy mounting in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and reliability in power switching applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making them a preferred choice for power applications.

Maximum Drain Current (ID): 11 A

The high maximum drain current rating allows the Power FET to handle continuous currents without overheating.

Maximum Drain-Source On Resistance: 0.34 ohm

With a low on-resistance, this Power FET minimizes power losses and heat dissipation in high current applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and layout, reducing complexity and improving reliability.

Case Connection: DRAIN

The drain case connection provides a direct path for current flow, improving efficiency and heat dissipation in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STP15N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.34 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

44 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP15N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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