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STP13NM50N

STMicroelectronics

STP13NM50N by STMicroelectronics

STP13NM50N by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 500V breakdown voltage, 12A max drain current, and operates at up to 150 °C. This versatile FET is suitable for high-power circuits with efficient thermal management.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,991 parts In-Stock

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Digiode

USA . 1,594 parts In-Stock

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Anansix

USA . 261 parts In-Stock

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261

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IDEA Electronic Components Group

UK . 1,455 parts In-Stock

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$1.260

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$1.134

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$1.260

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$1.134

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MKK Technologies

India . 1,622 parts In-Stock

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$2.370

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$2.370

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DigiPath Technology Company

USA . 1,622 parts In-Stock

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$2.370

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$2.370

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AZTECH Wire

Italy . 846 parts In-Stock

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$17.550

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846

$17.550

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Component Stockers USA

USA . 479 parts In-Stock

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$99.990

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479

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Corphita

USA . 4,753 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,066 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 989 parts In-Stock

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$1.507

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989

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Perfect Parts

USA . 547 parts In-Stock

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Kepictronics

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Overview

Unlock the power of efficiency with the STP13NM50N from STMicroelectronics. Renowned for its quality and innovation, this N-channel power FET excels in demanding applications, ensuring reliable performance even under high voltage and current conditions. Its built-in diode enhances reliability, making it ideal for switching tasks across various industries. Experience superior durability, impressive energy savings, and the trusted performance that comes with STMicroelectronics’ legacy, elevating your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the transistor reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and better efficiency, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Incorporating a built-in diode enhances protection against voltage spikes, making it a safe choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET optimizes performance and efficiency in control circuitry.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage allows this transistor to operate safely in high-voltage applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, facilitating easier design and integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a robust mechanical connection and ease of soldering onto PCB for reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better current control and higher efficiency, making this FET suitable for modern electronic designs.

Maximum Pulsed Drain Current (IDM): 48 A

With a pulsed current capability of 48 A, this device can handle significant current surges, making it resilient under transient conditions.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating ensures reliable operation under high-energy conditions, providing additional protection and durability.

Maximum Drain Current (Abs) (ID): 12 A

This rated maximum drain current allows for substantial power handling, making it beneficial for high-current applications.

No. of Terminals: 3

The three-terminal design simplifies the circuit layout, streamlining connections and enhancing ease of use.

Maximum Power Dissipation (Abs): 100 W

With a 100 W power dissipation capability, this device can operate efficiently without overheating, crucial for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides additional mechanical stability, making it suitable for robust and demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high speed and efficiency, making it an excellent choice for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high operational temperature ensures reliability under extreme conditions, enhancing the longevity of the device in various applications.

Transistor Element Material: SILICON

Silicon as the material offers high performance and reliability, making this FET suitable for a wide range of electronic applications.

Terminal Finish: TIN

Tin finish enhances solderability, ensuring consistent connections and improved fabrication processes.

Maximum Drain Current (ID): 12 A

The ability to handle up to 12 A makes this transistor ideal for applications requiring robust current management.

Maximum Drain-Source On Resistance: 0.32 ohm

A low on-resistance minimizes power loss, improving efficiency and enhancing the performance of the device in switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies design and connectivity, facilitating easier integration into circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP13NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.32 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP13NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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