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STP120NF04

STMicroelectronics

STP120NF04 by STMicroelectronics

STP120NF04 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,754 parts In-Stock

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Digiode

USA . 3,703 parts In-Stock

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3,703

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Anansix

USA . 2,252 parts In-Stock

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2,252

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$1.101

100+ parts

-

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$0.991

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359

$1.101

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$0.991

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MKK Technologies

India . 436 parts In-Stock

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$2.071

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436

$2.071

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DigiPath Technology Company

USA . 436 parts In-Stock

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$2.071

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436

$2.071

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AZTECH Wire

Italy . 633 parts In-Stock

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$12.900

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633

$12.900

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Alle Elektronik GmbH

Germany . 3,137 parts In-Stock

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3,137

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Corphita

USA . 1,614 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 355 parts In-Stock

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$1.317

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355

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$1.317

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Overview

Unlock unparalleled performance with the STP120NF04 from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel power FET is designed for efficient switching applications, delivering reliability and exceptional durability in demanding environments. Its robust construction ensures minimal energy loss, making it ideal for power management solutions across automotive, industrial, and consumer electronics. Elevate your projects with unmatched quality and enhanced efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package ensures reliable performance and protection against environmental factors, making this FET suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient switching and lower conduction losses, enhancing the overall performance in various electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection against reverse polarity, increasing system reliability and reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and high efficiency, making it an ideal choice for power management.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle a variety of voltage levels, providing flexibility for different circuitry designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, facilitating easier integration into compact electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical and electrical connections, ensuring stability during operation and assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control in switching applications, minimizing leakage currents when the device is off.

Maximum Pulsed Drain Current (IDM): 480 A

A high pulsed drain current capability of 480 A confirms this FET's ability to handle demanding transient loads, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 1200 mJ

The high avalanche energy rating indicates excellent ruggedness against overload conditions, increasing the reliability of your design.

Maximum Drain Current (Abs) (ID): 120 A

This FET's robust maximum drain current rating of 120 A allows it to support high current applications without performance degradation.

No. of Terminals: 3

The three-terminal configuration simplifies circuit designs, making it easier to integrate into different system architectures.

Maximum Power Dissipation (Abs): 300 W

A maximum power dissipation of 300 W ensures that this FET can handle substantial power loads, ideal for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount design provides additional mounting stability, supporting reliable installation in various settings.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low gate drive power requirements and high input impedance, resulting in efficient switching performance.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can be used in high thermal environments, expanding its application range.

Transistor Element Material: SILICON

Silicon offers excellent electrical properties and reliability, making it a preferred material for power transistors.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and oxidation resistance, ensuring long-term reliability and ease of assembly.

Maximum Drain Current (ID): 120 A

With a consistent maximum drain current of 120 A, this FET is well-suited for high power applications where reliability is crucial.

Maximum Drain-Source On Resistance: 0.005 ohm

A low on-resistance of 0.005 ohm reduces power losses during operation, improving efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies design, allowing for easy layout and integration within existing systems.

Technical Specifications

Power Field Effect Transistors (FET) STP120NF04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1200 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP120NF04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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