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STP11NM60FDFP

STMicroelectronics

STP11NM60FDFP by STMicroelectronics

STP11NM60FDFP by STMicroelectronics is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features 44A IDM, 350mJ EAS, and 0.45 ohm RDS(ON). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 35W at 150°C.

Median Price

$3.445

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,750 parts In-Stock

1+ parts

$1.966

100+ parts

-

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1,750

$1.966

-

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Chip1Stop

Japan . 350 parts In-Stock

1+ parts

$2.920

100+ parts

-

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350

$2.920

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Mouser Electronics

USA . 536 parts In-Stock

1+ parts

$3.970

100+ parts

-

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536

$3.970

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-

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DigiKey

USA . 120 parts In-Stock

1+ parts

$6.390

100+ parts

$3.104

1k+ parts

$2.541

10k+ parts

-

120

$6.390

$3.104

$2.541

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Verical

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

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1,750

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EBV Elektronik

Germany . 100 parts In-Stock

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100

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Distributors (In-Stock)

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Digiode

USA . 1,344 parts In-Stock

1+ parts

$1.868

100+ parts

-

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1,344

$1.868

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.003

100+ parts

-

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10

$3.003

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-

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Chip Stock

USA . 43,524 parts In-Stock

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43,524

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Vyrian

USA . 2,188 parts In-Stock

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2,188

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Anansix

USA . 1,257 parts In-Stock

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1,257

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Cyclops Electronics Ltd

UK . 1,150 parts In-Stock

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1,150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,706 parts In-Stock

1+ parts

$1.236

100+ parts

-

1k+ parts

$1.112

10k+ parts

-

1,706

$1.236

-

$1.112

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Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$1.670

100+ parts

-

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12

$1.670

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-

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Corphita

USA . 323 parts In-Stock

1+ parts

$1.769

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323

$1.769

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MKK Technologies

India . 136 parts In-Stock

1+ parts

$2.323

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136

$2.323

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$2.323

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136

$2.323

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Argo Parts USA

USA . 3,030 parts In-Stock

1+ parts

$3.003

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3,030

$3.003

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Continental Prestige Electronics

USA . 2,253 parts In-Stock

1+ parts

$3.003

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$2.943

2,253

$3.003

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-

$2.943

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.003

100+ parts

$2.943

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-

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100

$3.003

$2.943

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Microchip USA

USA . 3,404 parts In-Stock

1+ parts

$15.848

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3,404

$15.848

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A-Z Elektronik GmbH

Germany . 5,906 parts In-Stock

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5,906

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Kepictronics

USA . 2,450 parts In-Stock

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2,450

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Epart123

USA . 1,150 parts In-Stock

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GreenTree Electronics

Israel . 1,150 parts In-Stock

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Parana Technologies

USA . 950 parts In-Stock

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$1.477

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950

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$1.477

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Alle Elektronik GmbH

Germany . 895 parts In-Stock

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895

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Perfect Parts

USA . 268 parts In-Stock

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268

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Overview

Unlock the power of innovation with the STP11NM60FDFP by STMicroelectronics. Designed with superior quality and cutting-edge technology, this N-CHANNEL Power FET is a game-changer in the industry. Ideal for switching applications, this transistor offers reliable performance and efficiency. With a high breakdown voltage and low on-resistance, this product delivers unmatched value and benefits to customers. Trust STMicroelectronics for top-of-the-line components that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient and reliable performance in N-channel applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode for reverse current protection and simplified circuit design.

Transistor Application: SWITCHING

Ideal for switching applications, providing fast and efficient performance.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage allows for use in high voltage applications, ensuring safety and reliability.

Package Shape: RECTANGULAR

Saves space and allows for easy integration into circuit designs.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and secure connection to the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET's switching behavior.

Maximum Pulsed Drain Current (IDM): 44 A

High pulsed drain current capability for handling peak loads and surges.

Avalanche Energy Rating (EAS): 350 mJ

Ability to withstand avalanching effects, providing protection against voltage spikes.

Maximum Drain Current (Abs) (ID): 11 A

Sufficient continuous drain current rating for various applications.

No. of Terminals: 3

Simple 3-terminal design for easy integration and connection in circuits.

Maximum Power Dissipation (Abs): 35 W

High power dissipation capability for handling heat generated during operation.

Package Style (Meter): FLANGE MOUNT

Flange mount package style for secure mounting and heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and widely used technology for FETs, ensuring stable and predictable performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature for reliable performance in various environments.

Transistor Element Material: SILICON

Silicon material for the transistor element ensures high performance and efficiency.

Terminal Finish: MATTE TIN

Matte tin finish for the terminals provides good solderability and corrosion resistance.

Maximum Drain-Source On Resistance: 0.45 ohm

Low on-resistance for efficient power handling and minimal voltage drop.

Terminal Position: SINGLE

Single terminal position for easy connection and integration in circuits.

Case Connection: ISOLATED

Isolated case connection for safety and protection against electrical shocks.

Technical Specifications

Power Field Effect Transistors (FET) STP11NM60FDFP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP11NM60FDFP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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