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STP10N62K3

STMicroelectronics

STP10N62K3 by STMicroelectronics

STP10N62K3 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 620V breakdown voltage, 33.6A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,569 parts In-Stock

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2,569

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Anansix

USA . 2,135 parts In-Stock

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2,135

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Digiode

USA . 102 parts In-Stock

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102

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ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

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80

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Bristol Electronics

USA . 80 parts In-Stock

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80

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Dan-Mar Components

USA . 80 parts In-Stock

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80

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,435 parts In-Stock

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$0.437

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$0.393

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1,435

$0.437

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$0.393

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MKK Technologies

India . 327 parts In-Stock

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$0.822

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327

$0.822

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DigiPath Technology Company

USA . 327 parts In-Stock

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$0.822

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327

$0.822

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$0.940

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$0.855

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$0.771

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70

$0.940

$0.855

$0.771

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Microchip USA

USA . 340 parts In-Stock

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$18.785

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340

$18.785

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AZTECH Wire

Italy . 364 parts In-Stock

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$19.000

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Perfect Parts

USA . 2,481 parts In-Stock

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Corphita

USA . 1,777 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,450 parts In-Stock

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Parana Technologies

USA . 699 parts In-Stock

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$0.522

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699

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$0.522

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RC Electronics

USA . 550 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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Overview

Unlock the power of efficiency with the STP10N62K3 from STMicroelectronics, a leading innovator in semiconductor technology! This robust N-channel power FET is designed for seamless switching applications, ensuring superior performance and reliability. With its high breakdown voltage and outstanding thermal management, it’s perfect for industrial, automotive, and consumer electronics. Trust in ST's commitment to quality and experience unparalleled benefits that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance and protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuits, providing protection and enhancing circuit reliability.

Transistor Application: SWITCHING

Optimized for switching applications, this FET allows for efficient operation in power supplies and motor control.

Minimum DS Breakdown Voltage: 620 V

A high breakdown voltage enables safe operation in high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout on PCBs, allowing for compact design and ease of mounting.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and robust electrical connections, advantageous in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode operation ensures lower power consumption during idle states, improving overall circuit efficiency.

Maximum Pulsed Drain Current (IDM): 33.6 A

High pulsed drain current capability allows the FET to handle brief surges in current, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 220 mJ

The FET's avalanche rating provides added robustness against transient events, increasing circuit reliability.

Maximum Drain Current (Abs) (ID): 8.4 A

The ability to handle a maximum drain current of 8.4 A makes it versatile for various electronic applications.

No. of Terminals: 3

With three terminals, this FET design simplifies integration into various circuit configurations.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capacity allows for efficient heat management in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates easy installation and excellent thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high switching speeds and low power consumption, ideal for modern electronic devices.

Maximum Operating Temperature: 150 °C

A higher maximum operating temperature allows the FET to function reliably in harsh conditions.

Transistor Element Material: SILICON

Silicon materials contribute to excellent electrical performance and thermal stability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing long-term reliability.

Maximum Drain Current (ID): 8.4 A

Reiterating the maximum drain current capability, this ensures versatility in real-world applications.

Maximum Drain-Source On Resistance: 0.75 ohm

Low on-resistance minimizes power losses during operation, thus increasing overall efficiency.

Terminal Position: SINGLE

A single terminal position allows for straightforward integration into various designs.

Technical Specifications

Power Field Effect Transistors (FET) STP10N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

220 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

8.4 A

Maximum Drain Current (ID):

8.4 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

33.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP10N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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