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STM8L152K6T3

STMicroelectronics

STM8L152K6T3 by STMicroelectronics

STM8L152K6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65V and 3.6V, and includes 21 ADC channels. Its compact design with a low-profile package makes it ideal for automotive applications. With integrated peripherals like DMA and PWM, it's perfect for efficient control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,632 parts In-Stock

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6,632

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Digiode

USA . 3,589 parts In-Stock

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3,589

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Anansix

USA . 777 parts In-Stock

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777

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Distributors (Availability)

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Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$1.490

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6,000

$1.490

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Microchip USA

USA . 4,351 parts In-Stock

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$12.899

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4,351

$12.899

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AZTECH Wire

Italy . 927 parts In-Stock

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$15.040

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927

$15.040

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IDEA Electronic Components Group

UK . 219 parts In-Stock

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$19.979

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$17.981

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219

$19.979

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$17.981

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Component Stockers USA

USA . 2,236 parts In-Stock

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$30.220

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2,236

$30.220

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Ampacity Inc.

Singapore . 220 parts In-Stock

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$34.000

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220

$34.000

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MKK Technologies

India . 2,079 parts In-Stock

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$37.569

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2,079

$37.569

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DigiPath Technology Company

USA . 2,079 parts In-Stock

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$37.569

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2,079

$37.569

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Corphita

USA . 3,281 parts In-Stock

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3,281

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Parana Technologies

USA . 1,248 parts In-Stock

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$23.888

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1,248

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$23.888

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Overview

Unlock your design potential with the STM8L152K6T3 microcontroller from STMicroelectronics, a trusted leader in innovation. This low-power, versatile device excels in automotive and IoT applications, offering seamless connectivity and robust performance. Experience the benefits of its impressive temperature range and integrated peripherals, enabling you to create efficient, reliable solutions while maximizing energy savings. Elevate your projects with ST's quality and expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection for the microcontroller in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and makes assembly easier in automated PCB manufacturing.

Maximum Supply Voltage: 3.6 V

The operating voltage flexibility up to 3.6 V makes this microcontroller suitable for low-power applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and allows for efficient thermal management.

Bit Size: 8

The 8-bit architecture is well-suited for simple control tasks, making it an efficient choice for basic applications.

DAC Channels: YES

Integrated DAC channels facilitate smooth signal conversion for applications needing analog output.

Power Supplies (V): 1.8/3.3

Dual voltage supply options offer flexibility in design and compatibility with various power systems.

No. of Terminals: 32

A sufficient number of terminals provides ample I/O options for diverse peripheral and sensor connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design maximizes board space efficiency and minimizes height constraints.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage enables operation in energy-sensitive applications, extending battery life.

Maximum Operating Temperature: 125 °C

This wide temperature range ensures performance in high-temperature environments, suitable for automotive applications.

CPU Family: ST8

Utilizing the ST8 CPU family provides enhanced performance and reliability for real-time applications.

Minimum Operating Temperature: -40 °C

Extending operational limits down to -40 °C allows use in harsh environments, such as automotive and industrial settings.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and enhances long-term reliability of the connections.

ADC Channels: YES

Built-in ADC channels allow for easy interfacing with analog sensors, enhancing data acquisition capabilities.

DMA Channels: YES

DMA support improves data handling efficiency, freeing up CPU cycles for other tasks in complex applications.

Terminal Position: QUAD

Quad terminal positioning provides better routing options and improves PCB design flexibility.

ROM Words: 32768

A substantial ROM size supports complex application programming and storage.

Maximum Seated Height: 1.6 mm

Low seated height contributes to compact designs, making it suitable for space-constrained applications.

Digital To Analog Converters: 1-Ch 12-Bit

The 12-bit DAC enables high-resolution analog signal generation, enhancing performance in audio and control applications.

Width: 7 mm

Compact width enhances layout versatility and is ideal for small form factor designs.

Data EEPROM Size: 1K

1K EEPROM provides sufficient non-volatile storage for configuration settings and small data logging.

Peripherals: BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

A rich set of built-in peripherals allows comprehensive control functionality, reducing external components.

Maximum Clock Frequency: 16 MHz

A maximum clock speed of 16 MHz offers efficient processing for many real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microcontroller can withstand standard soldering processes without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows compatibility with lead-free soldering processes, enhancing environmental compliance.

Length: 7 mm

The compact length further contributes to low footprint designs, critical in modern electronics.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature classification guarantees reliability in challenging automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture improves instruction efficiency, leading to increased performance in embedded applications.

RAM Bytes: 2048

2KB of RAM allows for effective data processing and temporary data storage during operations.

Technology: CMOS

CMOS technology enhances power efficiency and allows for higher integration of components.

Terminal Form: GULL WING

Gull wing leads provide improved soldering reliability and ease of handling during assembly.

Analog To Digital Converters: 21-Ch 12-Bit

With 21 ADC channels, this microcontroller enables simultaneous readings from multiple sensors, ideal for complex monitoring tasks.

Maximum Supply Current: 80 mA

Moderate supply current consumption ensures lower power dissipation and improved energy efficiency.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is optimal for many applications, balancing performance and power draw.

PWM Channels: YES

PWM channels facilitate motor control and various other duty cycle modulated applications, enhancing functionality.

Connectivity: I2C, IRDA, SPI, USART

A wide range of connectivity options allows integration with various devices and protocols, enhancing versatility.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to firmware, providing flexibility in deployment.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch supports fine-pitch layout designs suitable for advanced electronic applications.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, ensuring stable storage and handling practices.

Speed: 16 rpm

A speed rating of 16 rpm is adequate for real-time processing tasks, supporting various control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is ideal for straightforward computational tasks and control applications.

No. of I/O Lines: 30

30 I/O lines provide significant interfacing capability for diverse device connection and control tasks.

Technical Specifications

Microcontrollers STM8L152K6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L152K6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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