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STM32L486QGI6TR

STMicroelectronics

STM32L486QGI6TR by STMicroelectronics

STM32L486QGI6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 132 terminals, and 16 external interrupts. It features 8-bit on-chip data RAM, operates at max 48 MHz clock frequency, and includes peripherals like BOR, DMA(14), RTC. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

$5.959

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 32,500 parts In-Stock

1+ parts

$6.462

100+ parts

-

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32,500

$6.462

-

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Chip1Stop

Japan . 12,500 parts In-Stock

1+ parts

-

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-

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$5.959

12,500

-

-

-

$5.959

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$5.773

5,000

-

-

-

$5.773

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 436 parts In-Stock

1+ parts

$5.170

100+ parts

-

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436

$5.170

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Vyrian

USA . 9,962 parts In-Stock

1+ parts

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9,962

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Chip Stock

USA . 6,010 parts In-Stock

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-

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6,010

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-

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Sensible Micro Corp

USA . 2,223 parts In-Stock

1+ parts

-

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2,223

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-

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IBS Electronics

USA . 1,248 parts In-Stock

1+ parts

-

100+ parts

-

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$6.788

10k+ parts

-

1,248

-

-

$6.788

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Anansix

USA . 816 parts In-Stock

1+ parts

-

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816

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Cyclops Electronics Ltd

UK . 120 parts In-Stock

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120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 21,332 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

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10k+ parts

-

21,332

$4.630

-

-

-

Semicontronic

India . 21,499 parts In-Stock

1+ parts

$4.810

100+ parts

$4.690

1k+ parts

$4.666

10k+ parts

-

21,499

$4.810

$4.690

$4.666

-

Corphita

USA . 4,725 parts In-Stock

1+ parts

$4.898

100+ parts

-

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4,725

$4.898

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Vigor

Singapore . 1,588 parts In-Stock

1+ parts

$8.090

100+ parts

-

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1,588

$8.090

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AZTECH Wire

Italy . 959 parts In-Stock

1+ parts

$12.250

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-

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959

$12.250

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IDEA Electronic Components Group

UK . 907 parts In-Stock

1+ parts

$19.873

100+ parts

-

1k+ parts

$17.886

10k+ parts

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907

$19.873

-

$17.886

-

MKK Technologies

India . 60 parts In-Stock

1+ parts

$37.370

100+ parts

-

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60

$37.370

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DigiPath Technology Company

USA . 60 parts In-Stock

1+ parts

$37.370

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60

$37.370

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Corohmni

South Africa . 11 parts In-Stock

1+ parts

$68.402

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11

$68.402

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Aztec Data Supply Inc.

USA . 2,764 parts In-Stock

1+ parts

$78.980

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-

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2,764

$78.980

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Glotronic Ltd.

UK . 38,000 parts In-Stock

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38,000

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Futuretech Components

Singapore . 12,500 parts In-Stock

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12,500

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Argo Parts USA

USA . 3,687 parts In-Stock

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3,687

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,543 parts In-Stock

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2,543

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Parana Technologies

USA . 2,370 parts In-Stock

1+ parts

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$23.761

1k+ parts

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2,370

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$23.761

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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GreenTree Electronics

Israel . 899 parts In-Stock

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899

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Kepictronics

USA . 639 parts In-Stock

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639

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Overview

Unlock the power of innovation with the STM32L486QGI6TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microcontrollers that offer exceptional performance and reliability. Ideal for a wide range of applications, this cutting-edge product provides customers with advanced features such as integrated cache, low power mode, and a wide variety of connectivity options. Experience the value and benefits of this innovative solution, designed to meet your needs and exceed your expectations. Elevate your designs with the STM32L486QGI6TR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications.

CPU Family: CORTEX-M4

The Cortex-M4 architecture is known for high performance and energy efficiency, making it suitable for demanding tasks while consuming less power.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture offers simplicity and efficiency in processing instructions, contributing to better performance and lower power consumption.

Analog To Digital Convertors: 19-Ch 12-Bit

Provides a high number of ADC channels with 12-bit resolution, enabling accurate conversion of analog signals to digital data for precise measurements.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3), USB

Offers a wide range of connectivity options, allowing seamless integration with different devices and protocols for communication and data transfer.

Low Power Mode: YES

Includes low power modes to conserve energy when the microcontroller is not in active use, making it suitable for battery-operated or energy-efficient applications.

Technical Specifications

Microcontrollers STM32L486QGI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B132

JESD-609 Code:

e2

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

109

No. of Terminals:

132

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

16384

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L486QGI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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