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STM32L152VET6D

STMicroelectronics

STM32L152VET6D by STMicroelectronics

STM32L152VET6D by STMicroelectronics is a 32-bit microcontroller with 83 I/O lines, DAC and ADC channels. Operating at up to 24 MHz, it has ROM of 524288 words and supports PWM. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and low profile package design (1.6 mm height).

Median Price

$7.142

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$7.142

100+ parts

-

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25

$7.142

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Vyrian

USA . 7,030 parts In-Stock

1+ parts

-

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7,030

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Digiode

USA . 3,178 parts In-Stock

1+ parts

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3,178

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Anansix

USA . 364 parts In-Stock

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364

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Distributors (Availability)

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Vigor

Singapore . 2,013 parts In-Stock

1+ parts

$6.190

100+ parts

-

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2,013

$6.190

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Ampacity Inc.

Singapore . 1,126 parts In-Stock

1+ parts

$7.000

100+ parts

-

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-

1,126

$7.000

-

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Continental Prestige Electronics

USA . 2,181 parts In-Stock

1+ parts

$7.142

100+ parts

-

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$6.999

2,181

$7.142

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-

$6.999

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.142

100+ parts

-

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1,000

$7.142

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AZTECH Wire

Italy . 426 parts In-Stock

1+ parts

$8.940

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426

$8.940

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Semicontronic

India . 962 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

962

$9.000

$8.775

$8.730

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Microchip USA

USA . 1,825 parts In-Stock

1+ parts

$22.958

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1,825

$22.958

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$40.787

100+ parts

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1k+ parts

$36.709

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2,222

$40.787

-

$36.709

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Aztec Data Supply Inc.

USA . 3,031 parts In-Stock

1+ parts

$51.485

100+ parts

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3,031

$51.485

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MKK Technologies

India . 287 parts In-Stock

1+ parts

$76.698

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287

$76.698

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DigiPath Technology Company

USA . 287 parts In-Stock

1+ parts

$76.698

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287

$76.698

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Argo Parts USA

USA . 2,392 parts In-Stock

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2,392

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Parana Technologies

USA . 563 parts In-Stock

1+ parts

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$48.767

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563

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$48.767

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Corphita

USA . 425 parts In-Stock

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425

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Overview

Unleash the power of innovation with the STM32L152VET6D microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by a reputable manufacturer with years of industry expertise. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC and ADC channels, DMA support, and PWM capabilities. With a compact design and efficient performance, this product delivers exceptional value and benefits to customers looking to push the boundaries of technology. Elevate your projects to new heights with the STM32L152VET6D microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product convenient for various applications.

Surface Mount: YES

Surface mount technology allows for smaller product design, increased component density, and improved overall performance.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power requirements for different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing layout and reducing footprint.

Bit Size: 32

A 32-bit architecture enables high computational power and efficient processing of data, making the product suitable for complex tasks.

DAC Channels: YES

Digital-to-analog conversion channels enable the product to interface with analog devices and sensors, extending its compatibility.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options, making the product versatile for different system configurations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact, low-profile design with fine pitch terminals, enhancing PCB layout efficiency and saving space.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in challenging environments and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function in cold environments without compromising performance.

ADC Channels: YES

Analog-to-digital conversion channels allow the product to process analog signals from external sources, expanding its functionality.

DMA Channels: YES

Direct Memory Access channels facilitate efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and assembly, enhancing ease of use and reducing installation time.

ROM Words: 524288

A large ROM capacity allows for storing extensive program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

The low seated height profile of the product enables it to fit in compact devices or applications with height constraints.

Width: 14 mm

The compact width dimension of the product makes it suitable for applications where space is limited.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency enables fast data processing and execution, enhancing performance and responsiveness.

Length: 14 mm

The short length of the product contributes to its compact form factor, suitable for small-sized devices and applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in challenging environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides high-speed processing and efficiency, making it suitable for real-time applications.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption, high noise immunity, and reliable performance.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and PCB assembly processes, enhancing reliability and ease of installation.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent and reliable operation of the product within specified voltage limits.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog devices and motors, enhancing the product's versatility.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick firmware updates, customization, and reprogramming of the product.

Terminal Pitch: 0.5 mm

The fine terminal pitch provides high-density interconnections on the PCB, optimizing layout space and improving signal integrity.

Speed: 32 rpm

With a speed of 32 rpm, the product offers fast data processing and execution, ideal for time-critical applications.

No. of I/O Lines: 83

A high number of input/output lines increase connectivity options, allowing the product to interface with multiple external devices.

Technical Specifications

Microcontrollers STM32L152VET6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L152VET6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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