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STM32L072V8I6

STMicroelectronics

STM32L072V8I6 by STMicroelectronics

STM32L072V8I6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 terminals. With integrated DAC and ADC channels, it's ideal for low-power applications in industrial settings. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,139 parts In-Stock

1+ parts

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6,139

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Anansix

USA . 2,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,398

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Digiode

USA . 753 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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753

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 858 parts In-Stock

1+ parts

$10.040

100+ parts

-

1k+ parts

-

10k+ parts

-

858

$10.040

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-

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Microchip USA

USA . 3,960 parts In-Stock

1+ parts

$22.318

100+ parts

-

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-

10k+ parts

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3,960

$22.318

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IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$58.609

100+ parts

-

1k+ parts

$52.748

10k+ parts

-

405

$58.609

-

$52.748

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MKK Technologies

India . 314 parts In-Stock

1+ parts

$110.210

100+ parts

-

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314

$110.210

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DigiPath Technology Company

USA . 314 parts In-Stock

1+ parts

$110.210

100+ parts

-

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314

$110.210

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Corphita

USA . 4,351 parts In-Stock

1+ parts

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4,351

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Vigor

Singapore . 2,265 parts In-Stock

1+ parts

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100+ parts

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2,265

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Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

$70.076

1k+ parts

-

10k+ parts

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2,091

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$70.076

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Overview

Unlock limitless possibilities with the STM32L072V8I6 microcontroller from STMicroelectronics, a leader in innovative solutions. Designed for low-power applications, this compact powerhouse combines exceptional performance with energy efficiency, making it ideal for IoT devices, wearables, and industrial automation. Its robust features ensure reliability in diverse environments, empowering your projects with superior connectivity and flexibility while minimizing costs. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable yet lightweight material ensures reliability in various applications.

Surface Mount: YES

Enables compact design and easy integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of voltage supply systems for versatile applications.

Package Shape: SQUARE

Promotes ease of placement and efficient use of space on PCBs.

Bit Size: 32

Allows for efficient processing of complex calculations and operations.

DAC Channels: YES

Supports digital-to-analog conversion, making it suitable for audio and signal processing applications.

No. of Terminals: 100

Provides numerous connections for peripherals and enhances functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Facilitates high-density interconnections while saving PCB space.

Minimum Supply Voltage: 1.8 V

Operational at low voltages, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for high-temperature environments, enhancing reliability in industrial applications.

CPU Family: CORTEX-M0

Offers a balance of performance and low power consumption, ideal for portable devices.

Minimum Operating Temperature: -40 °C

Ensures functional reliability in extreme cold conditions, suitable for outdoor applications.

ADC Channels: YES

Enables the microcontroller to process analog signals, making it versatile for various applications.

DMA Channels: YES

Enhances data transfer efficiency by offloading data movement, improving overall performance.

Terminal Position: BOTTOM

Facilitates efficient mounting on PCBs for better heat dissipation and electrical performance.

ROM Words: 65536

Provides ample program storage for complex applications.

Maximum Seated Height: 0.6 mm

Allows for shallow profiles, useful in space-constrained designs.

Digital To Analog Converters: 2-Ch 12-Bit

Offers high-resolution output for superior signal integrity in applications.

Width: 7 mm

Compact size aids in space-efficient designs without compromising functionality.

Data EEPROM Size: 3K

Provides non-volatile storage for critical configuration data.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Rich set of peripherals enhances functionality and supports diverse application requirements.

Maximum Clock Frequency: 32 MHz

Offers a good balance between performance and power consumption for most applications.

Length: 7 mm

Compact form factor is ideal for low-profile applications.

Temperature Grade: INDUSTRIAL

Designed for demanding industrial environments ensuring durability and longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while minimizing power consumption.

No. of Timers: 8

Supports complex timing and event management in embedded applications.

RAM Bytes: 20480

Sufficient memory for handling multiple tasks and data processing workflows.

Technology: CMOS

Ensures low power consumption and high noise immunity, vital for portable devices.

Terminal Form: BALL

Enhances soldering reliability and minimizes footprint on PCBs.

Analog To Digital Converters: 16-Ch 12-Bit

Provides high-resolution input for various sensor integrations.

Nominal Supply Voltage: 3 V

Optimized for typical applications ensuring stable performance.

No. of DMA Channels: 7

Allows efficient data handling and increases processing speed.

PWM Channels: YES

Supports pulse width modulation, crucial for motor control and dimming applications.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Wide range of communication interfaces makes it highly adaptable in various systems.

ROM Programmability: FLASH

Allows for easy updates and modifications to firmware, enhancing product life cycle.

Terminal Pitch: 0.5 mm

Fine pitch design supports high-density layouts without sacrificing performance.

Speed: 32 rpm

Indicates suitability for applications requiring responsive and quick updates.

On Chip Program ROM Width: 8

Facilitates efficient data handling and processing speed.

No. of I/O Lines: 84

Offers versatile connectivity options for a broad range of external devices.

Technical Specifications

Microcontrollers STM32L072V8I6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

84

No. of Terminals:

100

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

3K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072V8I6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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