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STM32G0B1VCT7

STMicroelectronics

STM32G0B1VCT7 by STMicroelectronics

STM32G0B1VCT7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 48 MHz clock speed. It includes 16 ADC channels and dual DACs for versatile applications. Ideal for industrial automation and IoT devices, it offers low power modes and extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,682 parts In-Stock

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6,682

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Digiode

USA . 2,884 parts In-Stock

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2,884

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Anansix

USA . 1,559 parts In-Stock

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1,559

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Distributors (Availability)

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AZTECH Wire

Italy . 1,056 parts In-Stock

1+ parts

$13.490

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1,056

$13.490

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Microchip USA

USA . 2,829 parts In-Stock

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$15.458

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2,829

$15.458

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

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$61.565

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$55.409

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1,307

$61.565

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$55.409

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Component Stockers USA

USA . 1,331 parts In-Stock

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$67.600

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1,331

$67.600

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MKK Technologies

India . 659 parts In-Stock

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$115.770

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659

$115.770

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DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

$115.770

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659

$115.770

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Corphita

USA . 4,733 parts In-Stock

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4,733

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Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

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$73.611

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2,108

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$73.611

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Overview

Elevate your designs with the STM32G0B1VCT7 microcontroller from STMicroelectronics—a beacon of quality and innovation. This powerful 32-bit Cortex-M0 solution offers robust performance for a wide range of applications, from industrial automation to IoT devices. With features like integrated DAC, ADC, and low power modes, it ensures efficiency without compromising on capabilities. Trust in ST's legacy of excellence to drive your next project towards success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures longevity and reliability in various applications.

Integrated Cache: YES

Enhanced performance due to faster data access speeds, making it suitable for intensive tasks.

Surface Mount: YES

Allows for compact designs and efficient PCB layout, saving space in electronic devices.

Maximum Supply Voltage: 3.6 V

Versatile voltage range supports a variety of power supply scenarios and components.

On Chip Data RAM Width: 8

Optimized for handling smaller data sizes, maintaining efficiency in processing.

Package Shape: SQUARE

Standardized shape allows for easy integration into various circuit designs.

Bit Size: 32

Provides a balance of performance and resource management, ideal for embedded applications.

DAC Channels: YES

Enables analog output functions, making it suitable for applications requiring audio or control signals.

No. of Terminals: 100

Offers a wide range of connectivity options for numerous peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

A compact design that can be easily mounted on PCBs with high density.

Minimum Supply Voltage: 1.7 V

Flexibility in power supply allows for energy conservation in battery-operated devices.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where high temperature performance is critical.

CPU Family: CORTEX-M0

Power-efficient architecture ideal for low-cost and energy-sensitive applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme environments, enhancing its applicability in harsh conditions.

ADC Channels: YES

Facilitates high-accuracy data acquisition, crucial for sensor applications.

DMA Channels: YES

Reduces CPU load by allowing direct data transfer, improving overall system efficiency.

Terminal Position: QUAD

Offers efficient space utilization on PCBs, allowing for flexible design options.

ROM Words: 262144

Generous ROM capacity allows for more complex applications and features.

Maximum Seated Height: 1.6 mm

Low profile design is advantageous for ultra-thin devices and optimal space management.

Digital To Analog Convertors: 2-Ch 12-Bit

High-resolution output capabilities suitable for precise analog signal generation.

Width: 4 mm

Compact dimensions help to maintain a small footprint in design.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Rich peripheral set supports a wide range of application needs, enhancing functionality.

Maximum Clock Frequency: 48 MHz

Sufficient processing speed to perform tasks efficiently, balancing power consumption.

Length: 14 mm

Compact size that accommodates high-density circuitry.

Temperature Grade: INDUSTRIAL

Designed for reliability in challenging environments, making it ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient processing architecture ensures reduced power usage while maintaining high performance.

No. of Timers: 13

A variety of timers allows for precise scheduling and operation control in applications.

RAM Bytes: 147456

Ample RAM size supports more complex applications and multitasking capabilities.

Technology: CMOS

Low power consumption combined with high speed, suitable for battery-operated devices.

Terminal Form: GULL WING

Standard form factor that aids in reliable connections and soldering.

Analog To Digital Convertors: 16-Ch 12-Bit

High-channel count and resolution makes it perfect for multi-sensor applications.

Maximum Supply Current: 100 mA

Adequate current capacity supports high-performance operation without overheating.

Nominal Supply Voltage: 3 V

Standard voltage provides compatibility with many common power systems.

No. of DMA Channels: 12

Increases data handling efficiency by letting peripherals control data transfer.

No. of Serial I/Os: 10

Multiple I/O options increase versatility for communication between devices.

PWM Channels: YES

Supports varied applications needing precise control over power delivery.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options make it compatible with a wide range of devices.

ROM Programmability: FLASH

Reprogrammable memory enables updates and modifications without hardware changes.

Terminal Pitch: 0.5 mm

Fine pitch allows for higher density layouts in PCB designs.

Format: FIXED-POINT

Suitable for applications that require precise control of numerical values.

Speed: 64 rpm

Effective in applications where moderate speed is required, such as in processing tasks.

Low Power Mode: YES

Energy efficiency in standby mode prolongs battery life and reduces power consumption.

On Chip Program ROM Width: 8

Efficient use of memory architecture supports smoother operation of applications.

No. of I/O Lines: 94

High number of I/O lines provide flexibility for multiple peripheral connections.

Technical Specifications

Microcontrollers STM32G0B1VCT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VCT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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