Loading...

STM32G041Y8Y6TR

STMicroelectronics

STM32G041Y8Y6TR by STMicroelectronics

STM32G041Y8Y6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With low power modes and multiple connectivity options, it's ideal for compact IoT applications. Its small size (2.14mm x 1.86mm) makes it perfect for space-constrained designs.

Median Price

$2.508

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,891 parts In-Stock

1+ parts

$2.508

100+ parts

-

1k+ parts

-

10k+ parts

-

1,891

$2.508

-

-

-

Vyrian

USA . 12,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,630

-

-

-

-

ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Anansix

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,234

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,355 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

5,355

$1.430

-

-

-

Corphita

USA . 3,259 parts In-Stock

1+ parts

$2.376

100+ parts

-

1k+ parts

-

10k+ parts

-

3,259

$2.376

-

-

-

Component Stockers USA

USA . 183 parts In-Stock

1+ parts

$2.690

100+ parts

$1.970

1k+ parts

-

10k+ parts

-

183

$2.690

$1.970

-

-

Microchip USA

USA . 7,013 parts In-Stock

1+ parts

$11.174

100+ parts

-

1k+ parts

-

10k+ parts

-

7,013

$11.174

-

-

-

IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$57.355

100+ parts

-

1k+ parts

$51.619

10k+ parts

-

312

$57.355

-

$51.619

-

MKK Technologies

India . 1,710 parts In-Stock

1+ parts

$107.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$107.852

-

-

-

DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

$107.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$107.852

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,893

-

-

-

-

Eastek

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Parana Technologies

USA . 1,683 parts In-Stock

1+ parts

-

100+ parts

$68.576

1k+ parts

-

10k+ parts

-

1,683

-

$68.576

-

-

Overview

Unlock the potential of your next project with the STM32G041Y8Y6TR microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this compact powerhouse is tailored for diverse applications, from IoT devices to industrial automation. Enjoy features like low power consumption and robust performance in extreme environments, ensuring efficient operation without compromise. Elevate your designs and experience seamless connectivity while benefiting from STMicroelectronics' legacy of innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the microcontroller from environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into circuit boards, making this microcontroller ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V allows for versatility in power applications, catering to low-power designs.

On Chip Data RAM Width: 8

An 8-bit RAM width facilitates efficient data processing for applications requiring moderate data handling capabilities.

Package Shape: RECTANGULAR

The rectangular shape supports flexible PCB design layouts and effective usage of space on the board.

Bit Size: 32

A 32-bit architecture enhances computational power, enabling more complex applications and better performance.

No. of Terminals: 18

Having 18 terminals provides sufficient connectivity options for various peripherals while maintaining a compact form factor.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This design minimizes space requirements and supports high-density applications, making it suitable for modern electronic devices.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage supports battery-powered applications, increasing the potential for low-energy devices.

Maximum Operating Temperature: 85 °C

The ability to operate at up to 85 °C ensures reliable performance in a range of environmental conditions.

CPU Family: CORTEX-M0

The Cortex-M0 architecture provides energy efficiency and sufficient processing power for embedded systems.

Minimum Operating Temperature: -40 °C

This feature expands the usability in extreme environments, making it suitable for diverse applications.

ADC Channels: YES

Integrated ADC channels allow for easy connection of analog sensors, enhancing the microcontroller’s functionality.

DMA Channels: YES

With DMA support, the microcontroller can perform data transfers efficiently, reducing CPU overhead and improving speed.

Terminal Position: BOTTOM

Bottom-terminal placement can aid in better thermal management and connection to PCBs.

ROM Words: 65536

A significant ROM size allows the storage of complex programs and functionalities, enhancing the microcontroller's capabilities.

Maximum Seated Height: 0.59 mm

A low seated height enables integration into thin packages, which is advantageous for portable devices.

Width: 1.86 mm

A narrow width supports compact designs, suitable for space-constrained applications.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

The range of peripherals enhances the microcontroller's capability, allowing for versatile applications.

Maximum Clock Frequency: 48 MHz

With a clock frequency of 48 MHz, the device can perform tasks quickly, making it efficient for real-time applications.

Length: 2.14 mm

A compact length facilitates space-saving designs while maintaining connectivity.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes high performance with low power consumption, suitable for battery-operated devices.

No. of Timers: 9

Multiple timers enable precise control and timing functions, beneficial for various time-sensitive applications.

RAM Bytes: 8192

Ample RAM allows for better data processing and multitasking capabilities within applications.

Technology: CMOS

CMOS technology ensures low power consumption and is widely used in modern microcontrollers for efficiency.

Terminal Form: BALL

Ball terminal structures aid in efficient soldering and robust connections, improving assembly reliability.

Analog To Digital Convertors: 16-Ch 12-Bit

The high-resolution ADC with multiple channels enables precise sensor readings, making it ideal for data acquisition.

Maximum Supply Current: 6.9 mA

Low current consumption enhances battery life in portable devices, making this microcontroller ideal for energy-sensitive applications.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3 V strikes a balance between performance and power efficiency.

No. of DMA Channels: 5

Five DMA channels facilitate efficient data transfers, optimizing memory access without CPU intervention.

No. of Serial I/Os: 3

Having multiple serial I/Os supports various communication protocols, enhancing versatility in interfacing with other devices.

PWM Channels: YES

PWM support enables control over motor speeds and dimming of LEDs, useful for automation and control systems.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options enhance communication capabilities, facilitating integration with other devices and systems.

ROM Programmability: FLASH

The use of flash memory allows for easy updates and reprogramming, improving the microcontroller's flexibility over time.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for compact designs with dense pin configurations, suitable for modern applications.

Format: FIXED POINT

The fixed-point format is efficient for arithmetic operations, making it suitable for embedded applications requiring fast processing.

Speed: 64 rpm

The specified speed makes it suitable for low-speed applications, ensuring precise movement and functionality.

Low Power Mode: YES

Low power mode capabilities extend battery life and reduce energy consumption in idle states, ideal for energy-efficient applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is efficient for many embedded applications, balancing size and processing capabilities.

No. of I/O Lines: 16

Sixteen I/O lines provide flexibility in interfacing with various peripherals, expanding the possible applications.

Technical Specifications

Microcontrollers STM32G041Y8Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B18

Length:

2.14 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

16

No. of Serial I/Os:

3

No. of Terminals:

18

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA18,5X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.86 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G041Y8Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20