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STM32F446MCY6TR

STMicroelectronics

STM32F446MCY6TR by STMicroelectronics

STM32F446MCY6TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 26 MHz. It features 135168 bytes of RAM and offers connectivity options such as CAN, I2C, SPI, UART, and more. This microcontroller is commonly used in industrial applications due to its low power mode and wide temperature range (-40°C to +85°C).

Median Price

$6.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$6.090

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$6.090

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Vyrian

USA . 8,517 parts In-Stock

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8,517

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Digiode

USA . 4,073 parts In-Stock

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4,073

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Anansix

USA . 1,445 parts In-Stock

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Continental Prestige Electronics

USA . 229 parts In-Stock

1+ parts

$6.090

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$5.968

229

$6.090

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-

$5.968

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$7.145

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778

$7.145

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Vigor

Singapore . 4,348 parts In-Stock

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$7.940

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4,348

$7.940

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Semicontronic

India . 699 parts In-Stock

1+ parts

$24.000

100+ parts

$23.400

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$23.280

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699

$24.000

$23.400

$23.280

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Aztec Data Supply Inc.

USA . 4,748 parts In-Stock

1+ parts

$24.850

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$24.850

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$27.000

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335

$27.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$30.565

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$29.037

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$29.037

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5,000

$30.565

$29.037

$29.037

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IDEA Electronic Components Group

UK . 824 parts In-Stock

1+ parts

$52.671

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$47.404

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824

$52.671

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$47.404

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Component Stockers USA

USA . 1,658 parts In-Stock

1+ parts

$60.570

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$60.570

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Corohmni

South Africa . 704 parts In-Stock

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$80.409

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704

$80.409

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MKK Technologies

India . 598 parts In-Stock

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$99.044

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$99.044

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DigiPath Technology Company

USA . 598 parts In-Stock

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$99.044

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$99.044

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QUARKTWIN TECHNOLOGY LTD

USA . 25,037 parts In-Stock

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25,037

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Perfect Parts

USA . 22,400 parts In-Stock

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Lixinc

USA . 18,075 parts In-Stock

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

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RC Electronics

USA . 7,199 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 6,779 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,748 parts In-Stock

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Corphita

USA . 4,125 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.968

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$5.786

10k+ parts

$5.664

2,000

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$5.968

$5.786

$5.664

Futuretech Components

Singapore . 1,769 parts In-Stock

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1,769

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Parana Technologies

USA . 612 parts In-Stock

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$62.976

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612

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$4.071

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$4.071

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$4.071

200

-

$4.071

$4.071

$4.071

Overview

Discover the STM32F446MCY6TR microcontroller by STMicroelectronics, a high-quality product that offers numerous advantages. STMicroelectronics is a trusted manufacturer known for its reliability and innovation in the industry. This microcontroller belongs to the category of powerful microcontrollers suitable for a wide range of applications. With its advanced features and capabilities, the STM32F446MCY6TR provides exceptional value, benefits, and advantages to customers. Whether you are working on industrial automation, consumer electronics, or IoT projects, this microcontroller offers the perfect solution with its efficient performance, extensive connectivity options, and low power mode. Experience the difference and unlock endless possibilities with the STM32F446MCY6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, making it resistant to impact and suitable for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily mounted on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows this microcontroller to operate with a wide range of power sources, increasing its versatility.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, this microcontroller can handle larger amounts of data efficiently, improving overall performance.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard circuit board designs, making integration easier and more convenient.

Bit Size: 32

The 32-bit architecture of this microcontroller provides enhanced processing capabilities, enabling complex operations and applications.

DAC Channels: YES

The inclusion of DAC channels allows this microcontroller to output analog signals accurately, expanding its range of possible applications.

No. of Terminals: 81

With 81 terminals, this microcontroller offers extensive connectivity options, enabling seamless integration with external devices or peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch ensures precise and reliable connections, improving signal integrity and overall performance.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows this microcontroller to operate efficiently in low-power applications, conserving energy and extending battery life.

Maximum Operating Temperature: 85 °C

This microcontroller can withstand high operating temperatures, making it suitable for use in harsh environments or industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family provides advanced processing capabilities, supporting complex algorithms and ensuring high-speed data processing.

No. of External Interrupts: 16

With 16 external interrupt lines, this microcontroller can respond quickly to external events or signals, enhancing its versatility and responsiveness.

Minimum Operating Temperature: -40 °C

This microcontroller is designed to operate reliably in extremely low temperatures, making it suitable for use in cold environments or outdoor applications.

ADC Channels: YES

The inclusion of ADC channels allows this microcontroller to accurately convert analog signals to digital data, enabling precise measurements or sensor integrations.

DMA Channels: YES

With DMA channels, this microcontroller can efficiently transfer data between peripherals and memory, reducing CPU usage and improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mechanical integration of this microcontroller, allowing for easier PCB layout and assembly.

ROM Words: 262144

With a large ROM capacity of 262144 words, this microcontroller can store a significant amount of program code or firmware, supporting complex applications or algorithms.

Maximum Seated Height: 0.6 mm

The low maximum seated height ensures that this microcontroller can be easily integrated into compact designs or space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

The inclusion of 2-channel 12-bit digital-to-analog converters allows this microcontroller to generate accurate analog outputs, expanding its range of applications.

Width: 3.693 mm

The compact width of this microcontroller facilitates its integration into space-limited designs or miniaturized electronic devices.

Boundary Scan: YES

The presence of boundary scan capability simplifies testing and debugging processes, ensuring robust manufacturing and maintenance.

Peripherals: BOD, POR, TIMER(15), WDT(2)

With various built-in peripherals, including brown-out detection (BOD), power-on reset (POR), 15 timers, and 2 watchdog timers (WDT), this microcontroller offers comprehensive functionality for a wide range of applications.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency of 26 MHz enables fast processing and execution of instructions, enhancing the overall performance of this microcontroller.

Peak Reflow Temperature °C: 260

This microcontroller can withstand the high peak reflow temperature of 260°C during the soldering process, ensuring reliable connections and durability.

Length: 3.815 mm

The compact length of this microcontroller facilitates its integration into space-limited designs or miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

This microcontroller is designed to operate reliably within the industrial temperature range, making it suitable for demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

With a microcontroller architecture based on the Reduced Instruction Set Computing (RISC) philosophy, this product offers efficient execution of instructions, optimizing system performance.

No. of Timers: 15

The inclusion of 15 timers allows this microcontroller to handle various time-critical operations or events, enhancing its versatility and applicability.

RAM Bytes: 135168

With a substantial RAM capacity of 135168 bytes, this microcontroller can store and manipulate large amounts of data efficiently, supporting complex algorithms or data-intensive operations.

Technology: CMOS

Based on CMOS technology, this microcontroller offers low power consumption, high noise immunity, and reliable operation, making it suitable for a wide range of applications.

Terminal Form: BALL

The ball terminal form simplifies the mounting and soldering process, ensuring reliable connections and ease of integration into the system.

Analog To Digital Convertors: 14-Ch 12-Bit

The inclusion of 14-channel 12-bit analog-to-digital converters allows this microcontroller to accurately convert multiple analog signals into digital data, supporting precise measurements or sensor integration.

Maximum Supply Current: 115 mA

The maximum supply current of 115 mA ensures that this microcontroller can handle power-hungry operations or peripherals, providing sufficient power for demanding applications.

Nominal Supply Voltage: 2.4 V

The nominal supply voltage of 2.4 V provides stable power to this microcontroller, ensuring reliable and consistent operation under normal operating conditions.

No. of DMA Channels: 2

With 2 DMA channels, this microcontroller can efficiently handle simultaneous data transfers between multiple peripherals and memory, optimizing system performance.

No. of Serial I/Os: 6

The inclusion of 6 serial I/Os allows this microcontroller to easily communicate with other devices or modules, facilitating data exchange and system integration.

PWM Channels: YES

The presence of PWM channels enables this microcontroller to generate precise and controlled pulse-width modulation signals, making it suitable for applications such as motor control or LED dimming.

Connectivity: CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI

This microcontroller offers a wide range of connectivity options, including multiple CAN, I2C, I2S, SAI, SPI, UART, USART, and QSPI interfaces, enabling seamless communication with various peripherals or external devices.

ROM Programmability: FLASH

The ROM programmability using FLASH memory technology allows this microcontroller to be easily updated or reprogrammed, enhancing its flexibility and adaptability.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm facilitates the precise placement and soldering of this microcontroller, ensuring reliable connections and ease of integration.

Format: FLOATING POINT

With floating-point format support, this microcontroller can handle decimal numbers and perform complex mathematical operations with high precision, suitable for applications that require advanced numeric calculations.

Moisture Sensitivity Level (MSL): 1

This microcontroller has a moisture sensitivity level of 1, which means it has a low sensitivity to moisture, allowing for safe storage and prolonged shelf life.

Speed: 180 rpm

With a speed rating of 180 revolutions per minute, this microcontroller is suitable for applications involving motor control or precise rotational movements.

Low Power Mode: YES

The inclusion of a low-power mode allows this microcontroller to operate in energy-efficient states, conserving power and extending battery life.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8 bits, this microcontroller can efficiently store and execute program code or firmware, ensuring smooth operation and system reliability.

No. of I/O Lines: 63

The presence of 63 I/O lines provides ample connectivity options for this microcontroller, allowing for extensive interfacing with external devices or peripherals.

Technical Specifications

Microcontrollers STM32F446MCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B81

Length:

3.815 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

63

No. of Serial I/Os:

6

No. of Terminals:

81

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

135168

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

180 rpm

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.693 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(5), I2S(3), SAI(2), SPI(4), UART(2), USART(4), QSPI

Peripherals:

BOD, POR, TIMER(15), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F446MCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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