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STM32F413CHU3

STMicroelectronics

STM32F413CHU3 by STMicroelectronics

STM32F413CHU3 by STMicroelectronics is a 32-bit microcontroller with 10-Ch 12-bit ADC, 2-Ch 12-Bit DAC, and Flash ROM. Ideal for automotive applications with CAN(3), I2C(3), SPI(5) connectivity options. Operates b/w -40 to 125 °C temperature range.

Median Price

$13.220

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,164 parts In-Stock

1+ parts

$13.220

100+ parts

$8.480

1k+ parts

$7.090

10k+ parts

-

1,164

$13.220

$8.480

$7.090

-

EBV Elektronik

Germany . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,560

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 352 parts In-Stock

1+ parts

$12.492

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$12.492

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$12.580

-

-

-

Vyrian

USA . 3,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,844

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-

-

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Anansix

USA . 2,109 parts In-Stock

1+ parts

-

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10k+ parts

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2,109

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,780 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$9.480

-

-

-

Semicontronic

India . 1,415 parts In-Stock

1+ parts

$11.180

100+ parts

$10.900

1k+ parts

$10.845

10k+ parts

-

1,415

$11.180

$10.900

$10.845

-

Ampacity Inc.

Singapore . 1,124 parts In-Stock

1+ parts

$11.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

$11.180

-

-

-

Corphita

USA . 4,350 parts In-Stock

1+ parts

$11.835

100+ parts

-

1k+ parts

-

10k+ parts

-

4,350

$11.835

-

-

-

Continental Prestige Electronics

USA . 6,155 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

$12.328

6,155

$12.580

-

-

$12.328

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$12.580

100+ parts

$12.328

1k+ parts

-

10k+ parts

-

2,000

$12.580

$12.328

-

-

Microchip USA

USA . 4,299 parts In-Stock

1+ parts

$30.368

100+ parts

-

1k+ parts

-

10k+ parts

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4,299

$30.368

-

-

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Corohmni

South Africa . 355 parts In-Stock

1+ parts

$30.597

100+ parts

-

1k+ parts

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355

$30.597

-

-

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IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$54.014

100+ parts

-

1k+ parts

$48.613

10k+ parts

-

9

$54.014

-

$48.613

-

Aztec Data Supply Inc.

USA . 8,522 parts In-Stock

1+ parts

$59.830

100+ parts

-

1k+ parts

-

10k+ parts

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8,522

$59.830

-

-

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MKK Technologies

India . 1,525 parts In-Stock

1+ parts

$101.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,525

$101.570

-

-

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DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$101.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$101.570

-

-

-

Lixinc

USA . 17,178 parts In-Stock

1+ parts

-

100+ parts

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17,178

-

-

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Argo Parts USA

USA . 4,519 parts In-Stock

1+ parts

-

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4,519

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,000

-

-

-

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

-

100+ parts

$64.582

1k+ parts

-

10k+ parts

-

531

-

$64.582

-

-

Overview

Unlock the ultimate potential of your projects with the STM32F413CHU3 by STMicroelectronics. This high-quality microcontroller offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With its advanced technology and reliable performance, this product ensures seamless connectivity and precision control. Experience the advantages of STMicroelectronics' expertise and innovation with the STM32F413CHU3, your key to success in the world of microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact placement on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, this microcontroller can withstand voltage fluctuations without risking damage.

Address Bus Width: 26

A wider address bus allows for more memory addressing capabilities and supports larger data sets for complex applications.

Package Shape: SQUARE

The square package shape provides consistent orientation on the PCB and efficient use of space.

Bit Size: 32

A 32-bit architecture enables processing of larger data chunks and faster calculations compared to lower bit sizes.

DAC Channels: YES

Digital to analog converters allow for precise control and conversion of digital signals to analog output, essential for many applications.

No. of Terminals: 48

Having a higher number of terminals provides more connectivity options and interfaces for peripherals and external devices.

Minimum Supply Voltage: 1.7 V

With a low minimum supply voltage, this microcontroller can operate efficiently even in low power situations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for harsh environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold conditions.

ADC Channels: YES

Analog to digital converters enable the microcontroller to read and process analog signals from sensors or other devices.

DMA Channels: YES

Direct memory access channels enhance data transfer rates and efficiency by allowing data to be transferred without CPU intervention.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connections on the PCB, reducing the risk of signal interference or loss.

ROM Words: 1572864

The large ROM size provides ample storage for program instructions and data, allowing for complex algorithms and applications to be executed.

Maximum Seated Height: 0.65 mm

The low maximum seated height makes this microcontroller suitable for compact designs and applications where space is limited.

Digital To Analog Convertors: 2-Ch 12-Bit

Having two 12-bit DAC channels allows for dual analog output with precision control and accurate signal generation.

Width: 7 mm

The compact width makes this microcontroller suitable for small form factor designs and space-constrained applications.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the microcontroller and external memory or devices.

Peripherals: BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

A wide range of peripherals including PWM, RTC, and multiple timers enhance the microcontroller's functionality and versatility for various applications.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency enables fast processing speeds and real-time operation for time-sensitive applications.

Length: 7 mm

The compact length ensures a small footprint on the PCB and allows for efficient use of space in the overall system design.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability and durability in automotive applications, meeting stringent environmental requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers efficient and optimized performance for embedded applications.

RAM Bytes: 327680

With a large RAM size, this microcontroller can handle data processing and storage requirements for complex algorithms and applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

No lead terminal form simplifies the manufacturing process and ensures secure connections with robust solder joints.

Analog To Digital Convertors: 10-Ch 12-bit

With ten 12-bit ADC channels, this microcontroller can efficiently convert multiple analog signals to digital form for processing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent power delivery to the microcontroller, maintaining reliable operation.

PWM Channels: YES

Pulse width modulation channels enable precise control of digital signals for applications such as motor control and LED dimming.

Connectivity: CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(3), USB

Support for multiple communication interfaces including UART, SPI, I2C, and USB enhances connectivity options for interfacing with various devices.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates and customization without the need for specialized programming equipment.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density mounting on the PCB, saving space and accommodating more components in a compact design.

Speed: 100 rpm

With a speed of 100 rpm, this microcontroller can efficiently process instructions and data at a rapid rate, suitable for real-time applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows for storing program instructions directly on the microcontroller, enhancing performance and efficiency.

No. of I/O Lines: 36

The ample number of I/O lines provides flexibility for interfacing with external peripherals and devices, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers STM32F413CHU3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(3), USB

Peripherals:

BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

10-Ch 12-bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F413CHU3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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