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STM32F383RCY6TR

STMicroelectronics

STM32F383RCY6TR by STMicroelectronics

STM32F383RCY6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 262144 ROM words, and 32768 RAM bytes. It operates at a max clock frequency of 32 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 13,915 parts In-Stock

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13,915

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Vyrian

USA . 2,705 parts In-Stock

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2,705

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Anansix

USA . 2,244 parts In-Stock

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2,244

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Digiode

USA . 271 parts In-Stock

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271

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Distributors (Availability)

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AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$9.150

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141

$9.150

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IDEA Electronic Components Group

UK . 175 parts In-Stock

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$21.305

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-

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$19.175

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175

$21.305

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$19.175

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MKK Technologies

India . 1,890 parts In-Stock

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$40.063

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1,890

$40.063

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DigiPath Technology Company

USA . 1,890 parts In-Stock

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$40.063

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1,890

$40.063

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Metaverse IC Inc.

Canada . 13,915 parts In-Stock

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13,915

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RC Electronics

USA . 13,000 parts In-Stock

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13,000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,866 parts In-Stock

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Microchip USA

USA . 10,326 parts In-Stock

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Vigor

Singapore . 2,193 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Corphita

USA . 484 parts In-Stock

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484

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Parana Technologies

USA . 145 parts In-Stock

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$25.474

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145

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$25.474

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Overview

Unlock the potential of your next project with the STM32F383RCY6TR microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable solutions for various applications in the microcontroller category. With its advanced features and versatile capabilities, this product offers customers exceptional value, efficiency, and performance. Whether you're working on IoT devices, consumer electronics, or industrial automation, the STM32F383RCY6TR provides the power and flexibility you need to bring your ideas to life. Choose STMicroelectronics for superior technology that empowers innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and space in product design.

Maximum Supply Voltage: 1.95 V

A relatively low maximum supply voltage helps in reducing power consumption and heat generation, increasing efficiency.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit designs and PCB layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processing tasks efficiently.

Power Supplies (V): 1.8,1.8/3.3

The multiple power supply options provide flexibility in designing and optimizing power consumption based on specific requirements.

No. of Terminals: 66

The high number of terminals enables connectivity to various external components and peripherals for enhanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates reliable connections and soldering during PCB assembly, ensuring robustness.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows for operation in low-power modes and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this microcontroller suitable for industrial applications where temperature variations occur.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture offers high performance and efficiency for a wide range of embedded applications, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the microcontroller to function reliably in harsh environmental conditions.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making the microcontroller suitable for applications requiring analog-to-digital conversion.

DMA Channels: YES

DMA channels enhance data transfer speeds and efficiency by offloading data movement tasks from the CPU, improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, optimizing space and improving signal integrity.

ROM Words: 262144

The large ROM capacity provides ample storage for program code and data, allowing for versatile application development.

Width: 3.767 mm

A compact width dimension enables space-efficient PCB designs and compact product form factors.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency supports fast processing speeds and real-time operation in demanding applications.

Length: 4.229 mm

The moderate length dimension offers a balanced form factor for easy integration into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged environments with temperature fluctuations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient and high-performance data processing capabilities for embedded applications.

RAM Bytes: 32768

The generous RAM capacity enables efficient data storage and manipulation for a wide range of applications, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and durable.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and improves connection reliability, ensuring robust electrical connections on the PCB.

Maximum Supply Current: 78.1 mA

The moderate maximum supply current requirement allows for efficient power management and helps in extending battery life in portable devices.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides stable and reliable power input to the microcontroller, ensuring consistent performance and operation.

PWM Channels: YES

The presence of PWM channels enables precise control over motor speed, LED brightness, and other analog functions, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of firmware, providing flexibility and future-proofing for the microcontroller.

Terminal Pitch: 0.4 mm

The small terminal pitch enables high-density PCB designs and allows for more compact and lightweight products.

Speed: 72 rpm

The high speed capability of 72 rpm ensures rapid data processing and system responsiveness in time-critical applications.

No. of I/O Lines: 51

The large number of I/O lines facilitates versatile connectivity with external devices and peripherals, enabling rich functionality and expansion options.

Technical Specifications

Microcontrollers STM32F383RCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

4.229 mm

No. of I/O Lines:

51

No. of Terminals:

66

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA66,8X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

78.1 mA

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.767 mm

Peripheral IC Type:

Trade Compliance

STM32F383RCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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