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STM32F303VCT7TR

STMicroelectronics

STM32F303VCT7TR by STMicroelectronics

STM32F303VCT7TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz. It features 39 analog to digital converters and 2 digital to analog converters, making it suitable for applications requiring precise signal conversion. With its wide range of connectivity options including CAN, I2C, SPI, UART, and USB, it can be used in various industrial applications.

Median Price

$5.795

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 917 parts In-Stock

1+ parts

$6.918

100+ parts

$5.795

1k+ parts

$5.410

10k+ parts

-

917

$6.918

$5.795

$5.410

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.731

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1,000

-

-

$5.731

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Verical

USA . 917 parts In-Stock

1+ parts

-

100+ parts

$5.795

1k+ parts

$5.410

10k+ parts

-

917

-

$5.795

$5.410

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,488 parts In-Stock

1+ parts

$7.981

100+ parts

-

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2,488

$7.981

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Chip Stock

USA . 8,500 parts In-Stock

1+ parts

-

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8,500

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Vyrian

USA . 5,099 parts In-Stock

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5,099

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Anansix

USA . 1,070 parts In-Stock

1+ parts

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1,070

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,610 parts In-Stock

1+ parts

$4.650

100+ parts

$4.534

1k+ parts

$4.510

10k+ parts

-

1,610

$4.650

$4.534

$4.510

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

1+ parts

$4.650

100+ parts

-

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-

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1,489

$4.650

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Vigor

Singapore . 1,140 parts In-Stock

1+ parts

$5.400

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1,140

$5.400

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Corohmni

South Africa . 936 parts In-Stock

1+ parts

$6.475

100+ parts

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936

$6.475

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.669

100+ parts

$6.336

1k+ parts

$6.336

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3,000

$6.669

$6.336

$6.336

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Corphita

USA . 1,102 parts In-Stock

1+ parts

$7.561

100+ parts

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1,102

$7.561

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AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$14.020

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835

$14.020

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Microchip USA

USA . 5,999 parts In-Stock

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$17.719

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5,999

$17.719

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Aztec Data Supply Inc.

USA . 3,277 parts In-Stock

1+ parts

$32.880

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3,277

$32.880

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IDEA Electronic Components Group

UK . 133 parts In-Stock

1+ parts

$54.251

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$48.826

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133

$54.251

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$48.826

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MKK Technologies

India . 2,136 parts In-Stock

1+ parts

$102.016

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2,136

$102.016

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DigiPath Technology Company

USA . 2,136 parts In-Stock

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$102.016

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2,136

$102.016

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Lixinc

USA . 15,298 parts In-Stock

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15,298

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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Continental Prestige Electronics

USA . 4,668 parts In-Stock

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4,668

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Parana Technologies

USA . 1,883 parts In-Stock

1+ parts

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$64.866

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1,883

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$64.866

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Argo Parts USA

USA . 797 parts In-Stock

1+ parts

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797

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Discover the STM32F303VCT7TR microcontroller by STMicroelectronics, a high-quality and reliable solution for a wide range of applications. With its advanced features and robust design, this microcontroller offers exceptional performance and versatility. The STM32F303VCT7TR stands out with its low power consumption, making it perfect for battery-powered devices. Its extensive connectivity options, including CAN, I2C, SPI, and USB, ensure seamless integration into various systems. Whether you're designing industrial equipment, consumer electronics, or IoT devices, this microcontroller delivers value, benefits, and advantages that meet your needs. Trust in STMicroelectronics' expertise and choose the STM32F303VCT7TR for your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and heat resistance, making the microcontroller suitable for various environments and applications.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

3.6 V - With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, accommodating different voltage levels in various systems.

Package Shape:

SQUARE - The square package shape offers a compact design, maximizing board space utilization and enabling efficient integration into tight electronic layouts.

Bit Size:

32 - The 32-bit architecture of this microcontroller ensures efficient processing and execution of complex instructions, enabling higher performance and enhanced functionality.

DAC Channels:

YES - The presence of DAC channels allows the microcontroller to generate analog output signals accurately, making it suitable for applications such as audio processing and control systems.

Power Supplies (V):

2.5/3.3 - This microcontroller supports multiple power supply voltages, offering flexibility in different power configurations and ensuring compatibility with various systems.

No. of Terminals:

100 - With a high number of terminals, this microcontroller provides ample connectivity options, enabling the integration of multiple input and output devices for versatile applications.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - The flatpack, low profile, and fine pitch package style enhances the microcontroller's compatibility with modern, space-constrained designs, making it ideal for compact electronic devices.

Minimum Supply Voltage:

2 V - The low minimum supply voltage requirement allows the microcontroller to operate efficiently even in low-power scenarios, contributing to energy-saving and battery-powered applications.

Maximum Operating Temperature:

105 °C - The high maximum operating temperature tolerance ensures reliable performance and stability in demanding industrial environments where heat dissipation is a concern.

CPU Family:

CORTEX-M4F - The Cortex-M4F CPU family provides advanced processing capabilities and features, including digital signal processing (DSP) instructions, enabling the microcontroller to handle complex algorithms and tasks effectively.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature range enables the microcontroller to operate reliably in extreme cold environments without compromising performance, ensuring its suitability for a wide range of applications.

Terminal Finish:

MATTE TIN - The matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable connections and long-term durability of the microcontroller in various operating conditions.

ADC Channels:

YES - The availability of ADC channels allows the microcontroller to accurately convert analog input signals into digital values, making it ideal for applications that require precise data acquisition and measurement.

DMA Channels:

YES - The presence of DMA channels facilitates efficient data transfer between peripherals and memory, reducing CPU overhead and enhancing overall system performance and responsiveness.

Terminal Position:

QUAD - The quad terminal position provides a balanced distribution of terminals, simplifying PCB layout and ensuring optimal electrical connections, contributing to the microcontroller's ease of use.

ROM Words:

262144 - With a large ROM capacity, this microcontroller can store a vast amount of program code and data, accommodating complex firmware requirements and enabling versatile application development.

Maximum Seated Height:

1.6 mm - The low maximum seated height allows the microcontroller to be mounted in slim and compact device designs without causing space constraints in electronic assemblies.

Digital To Analog Convertors:

2-Ch 12-Bit - The inclusion of two 12-bit DACs enables the microcontroller to convert digital signals into accurate analog outputs, making it suitable for applications such as audio amplification and waveform generation.

Width:

14 mm - The compact width of the microcontroller enables ergonomic board layout and facilitates integration into space-limited electronic systems, enhancing design flexibility.

Peripherals:

COMPARATOR(7), DMA(12), POR, PWM(33), RTC, TIMER(13) - The rich array of peripherals, including comparators, DMA channels, PWM channels, real-time clock (RTC), and timers, provides extensive functionality and versatility, enabling the microcontroller to interface with various devices and perform diverse tasks.

Maximum Clock Frequency:

32 MHz - The high maximum clock frequency allows the microcontroller to execute instructions quickly, enabling swift data processing and responsiveness, essential for time-critical applications.

Peak Reflow Temperature °C:

260 - The microcontroller's ability to withstand high reflow temperatures ensures reliable solder joints during the manufacturing process, enhancing the overall durability and quality of the end product.

Length:

14 mm - The compact length of the microcontroller contributes to space-efficient board design, making it suitable for miniaturized electronic devices with tight form factors.

Temperature Grade:

INDUSTRIAL - The microcontroller's industrial temperature grade rating certifies its reliability and performance in harsh operating conditions subjected to wide temperature ranges, making it suitable for industrial automation and control applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - The microcontroller's architecture as a RISC-based device enables efficient instruction execution and optimized power consumption, meeting the requirements of embedded systems demanding reliable performance with low power consumption.

RAM Bytes:

40960 - The substantial RAM capacity of this microcontroller allows for efficient storage and manipulation of data during program execution, facilitating the development of complex applications that require larger temporary data storage.

Technology:

CMOS - The complementary metal-oxide-semiconductor (CMOS) technology used in this microcontroller ensures low power consumption, reduced noise, and high integration density, providing an ideal balance of performance and efficiency.

Terminal Form:

GULL WING - The gull wing terminal form simplifies the microcontroller's handling during production and assembly processes, promoting high-speed automated soldering and enabling reliable connections on the PCB.

Analog To Digital Convertors:

39-Ch 12-Bit - The inclusion of 39 12-bit ADC channels allows the microcontroller to precisely convert analog signals into digital values, offering excellent accuracy and versatility for applications requiring extensive analog input monitoring.

Nominal Supply Voltage:

3.3 V - The microcontroller's nominal supply voltage of 3.3 V provides a standard, widely available power source that is suitable for various electronic systems and simplifies power management considerations.

PWM Channels:

YES - The presence of PWM channels enables the microcontroller to generate precise and flexible pulse-width modulated signals, making it useful for applications such as motor control, LED dimming, and audio volume control.

Connectivity:

CAN, I2C(2), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(3), USB - The extensive connectivity options, including CAN, I2C, I2S, IRDA, LIN, SPI, UART, USART, and USB, offer versatile communication capabilities, enabling seamless integration into a wide range of networked or peripheral-based systems.

ROM Programmability:

FLASH - The microcontroller's ROM programmability using flash memory technology allows for convenient and efficient firmware updates and modifications, ensuring flexibility and future-proofing of the device.

Terminal Pitch:

0.5 mm - The microcontroller's 0.5 mm terminal pitch enables high-density component placement on PCBs, supporting miniaturization trends and facilitating advanced circuit board designs.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates that the microcontroller has a moderate level of moisture sensitivity, requiring standard precautions during handling and storage, ensuring its reliability and durability.

Speed:

72 rpm - The microcontroller's speed rating of 72 rpm refers to its maximum execution speed, enabling rapid data processing and execution of instructions, making it suitable for applications requiring real-time responsiveness.

On Chip Program ROM Width:

8 - The on-chip program ROM width of 8 enables the microcontroller to read and execute instructions efficiently, enhancing overall performance and ensuring optimal memory utilization.

No. of I/O Lines:

87 - With 87 I/O lines, this microcontroller offers extensive interfacing capabilities, allowing for versatile connections with external devices, sensors, and peripherals, expanding the application potential.

Technical Specifications

Microcontrollers STM32F303VCT7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

87

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(3), USB

Peripherals:

COMPARATOR(7), DMA(12), POR, PWM(33), RTC, TIMER(13)

Analog To Digital Convertors:

39-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F303VCT7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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