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STM32F102CBT6TR

STMicroelectronics

STM32F102CBT6TR by STMicroelectronics

STM32F102CBT6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at 2-3.6V, and supports up to 25 MHz clock speed. With 48 terminals and multiple connectivity options like I2C and USB, it's ideal for industrial applications. Its robust design ensures reliable performance in harsh environments.

Median Price

$3.069

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,400 parts In-Stock

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$3.069

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$3.069

Verical

USA . 2,400 parts In-Stock

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$3.069

2,400

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$3.069

Chip1Stop

Japan . 2,400 parts In-Stock

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$3.240

2,400

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$3.240

Distributors (In-Stock)

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Chip Stock

USA . 9,174 parts In-Stock

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Vyrian

USA . 4,491 parts In-Stock

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Anansix

USA . 1,713 parts In-Stock

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1,713

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Digiode

USA . 772 parts In-Stock

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Vigor

Singapore . 7,916 parts In-Stock

1+ parts

$3.310

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7,916

$3.310

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AZTECH Wire

Italy . 1,051 parts In-Stock

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$11.000

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$11.000

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IDEA Electronic Components Group

UK . 584 parts In-Stock

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$23.554

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$21.198

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584

$23.554

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$21.198

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Microchip USA

USA . 6,115 parts In-Stock

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$25.649

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MKK Technologies

India . 2,149 parts In-Stock

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$44.291

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$44.291

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DigiPath Technology Company

USA . 2,149 parts In-Stock

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$44.291

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2,149

$44.291

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Corphita

USA . 1,557 parts In-Stock

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1,557

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Parana Technologies

USA . 355 parts In-Stock

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$28.162

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355

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$28.162

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Overview

Unlock the potential of your projects with the STM32F102CBT6TR microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this compact powerhouse empowers engineers to develop innovative solutions across diverse applications—from industrial automation to consumer electronics. Benefit from low power consumption coupled with high performance, ensuring seamless integration and enhanced functionality in your designs. Elevate your next project with a trusted name in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection for the microcontroller in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automation in circuit board assembly.

Maximum Supply Voltage: 3.6 V

This voltage range enables compatibility with a variety of low-power applications.

Package Shape: SQUARE

A square package shape can assist in simplifying layout and routing in PCB designs.

Bit Size: 32

The 32-bit architecture provides improved processing power and efficiency, suitable for complex applications.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages, allowing developers flexibility in power management.

No. of Terminals: 48

A higher number of terminals enhances connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design allows for space-efficient placement on PCBs, ideal for compact devices.

Minimum Supply Voltage: 2 V

Low minimum supply voltage makes it suitable for battery-operated devices and power-sensitive applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in industrial environments.

CPU Family: CORTEX-M3

The Cortex-M3 is known for its efficient performance and low power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in extreme conditions, suitable for outdoor and harsh applications.

ADC Channels: YES

Onboard ADC channels facilitate the conversion of analog signals, essential for sensing applications.

DMA Channels: YES

Direct Memory Access (DMA) improves data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability and ease of soldering on PCBs.

ROM Words: 131072

Ample ROM allows for the storage of extensive firmware and application code.

Maximum Seated Height: 1.6 mm

Low height profile supports slim design requirements in small electronic devices.

Width: 7 mm

Compact width is suitable for space-constrained applications while maintaining sufficient functionality.

Peripherals: DMA(7), POR, RTC, TIMER(6)

Multipurpose peripherals enhance functionality, allowing for diverse applications such as real-time clocks and timers.

Maximum Clock Frequency: 25 MHz

A moderate clock frequency balances performance with power consumption, ideal for many embedded applications.

Length: 7 mm

The compact length contributes to a small footprint on the PCB, making it suitable for tight layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and stability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance and efficiency, making it ideal for real-time applications.

RAM Bytes: 16384

Substantial RAM facilitates running more complex applications and handling larger datasets in memory.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed operation.

Terminal Form: GULL WING

Gull wing leads are easy to handle during assembly and provide reliable solder joints.

Analog To Digital Convertors: 10-Ch 12-Bit

10 channels with 12-bit resolution enable accurate analog signal processing, perfect for precision applications.

Maximum Supply Current: 36.1 mA

Relatively low maximum supply current makes this microcontroller suitable for battery-operated designs.

Nominal Supply Voltage: 3.3 V

Nominal voltage aligns with common logic levels in many systems, simplifying design and integration.

PWM Channels: YES

PWM channels are essential for applications requiring motor control or adjustable brightness in LEDs.

Connectivity: I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Versatile connectivity options enable integration with various devices and protocols, enhancing application flexibility.

ROM Programmability: FLASH

Flash memory allows for easy firmware updates and upgrades without needing to replace the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density designs, valuable in advanced electronic applications.

Speed: 48 rpm

This speed metric can indicate performance in specific tasks, relevant for time-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data storage and handling within the microcontroller.

No. of I/O Lines: 37

A generous number of I/O lines provides ample interface options for connecting external components and sensors.

Technical Specifications

Microcontrollers STM32F102CBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

36.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(6)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F102CBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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