Loading...

STM32F100ZET7B

STMicroelectronics

STM32F100ZET7B by STMicroelectronics

STM32F100ZET7B by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 144 terminals, and 24 MHz clock frequency. It features 16 timers, DMA and PWM channels, I2C and UART connectivity. Ideal for industrial applications requiring high-speed processing and multiple peripherals in a compact package.

Median Price

$7.871

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.871

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$7.871

-

-

-

Vyrian

USA . 10,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,568

-

-

-

-

Digiode

USA . 1,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

-

-

-

-

Anansix

USA . 901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

901

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,250 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

7,250

$6.830

-

-

-

Continental Prestige Electronics

USA . 6,186 parts In-Stock

1+ parts

$7.871

100+ parts

-

1k+ parts

-

10k+ parts

$7.714

6,186

$7.871

-

-

$7.714

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.871

100+ parts

-

1k+ parts

$7.478

10k+ parts

$7.320

50

$7.871

-

$7.478

$7.320

AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$18.959

100+ parts

-

1k+ parts

-

10k+ parts

-

624

$18.959

-

-

-

Ampacity Inc.

Singapore . 1,051 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$30.000

-

-

-

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$70.524

100+ parts

-

1k+ parts

$63.471

10k+ parts

-

217

$70.524

-

$63.471

-

MKK Technologies

India . 982 parts In-Stock

1+ parts

$132.615

100+ parts

-

1k+ parts

-

10k+ parts

-

982

$132.615

-

-

-

DigiPath Technology Company

USA . 982 parts In-Stock

1+ parts

$132.615

100+ parts

-

1k+ parts

-

10k+ parts

-

982

$132.615

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,252

-

-

-

-

Corphita

USA . 2,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,082

-

-

-

-

Argo Parts USA

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

-

-

-

-

Parana Technologies

USA . 1,210 parts In-Stock

1+ parts

-

100+ parts

$84.322

1k+ parts

-

10k+ parts

-

1,210

-

$84.322

-

-

Overview

Discover the STM32F100ZET7B from STMicroelectronics, a top-quality microcontroller that offers unparalleled performance and reliability. With its advanced features and innovative design, this product is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Experience the value and benefits of choosing a trusted manufacturer like STMicroelectronics, known for delivering cutting-edge solutions that exceed customer expectations. Upgrade your projects with the STM32F100ZET7B and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Surface Mount: YES

Easy to mount on PCBs for efficient assembly and space-saving design.

Maximum Supply Voltage: 3.6 V

Support for higher voltage input, allowing for flexibility in power supply options.

Package Shape: SQUARE

Compact shape for space-efficient PCB layout and design.

Bit Size: 32

High processing capability with 32-bit architecture for complex calculations and operations.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages for compatibility with various systems.

No. of Terminals: 144

Sufficient terminals for connecting to peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Slim profile package with fine pitch for compact and high-density PCB layouts.

Minimum Supply Voltage: 2.4 V

Wide range of supply voltage support for versatile power input options.

Maximum Operating Temperature: 105 °C

Industrial-grade temperature range for reliable operation in harsh environments.

CPU Family: CORTEX-M3

Efficient and powerful Cortex-M3 CPU for high-performance computing tasks.

Minimum Operating Temperature: -40 °C

Wide temperature range for use in extreme cold conditions without affecting performance.

ADC Channels: YES

Analog-to-digital conversion capabilities for interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing without CPU intervention.

Terminal Position: QUAD

Quad-terminal positioning for easy connectivity and integration into circuit designs.

ROM Words: 524288

Large ROM capacity for storing program code and data for complex applications.

Width: 20 mm

Compact width for space-efficient PCB layout and design.

Peripherals: DMA(12), PWM, TIMER(16)

Rich set of peripherals including DMA, PWM, and timers for versatile functionality and performance optimization.

Maximum Clock Frequency: 24 MHz

High clock frequency for fast processing and real-time operation.

Length: 20 mm

Compact length for space-efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture microcontroller for optimized performance and power efficiency.

No. of Timers: 16

Multiple timers for precise timing control and synchronization in various applications.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and manipulation in complex computing tasks.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull-wing terminal form for easy soldering and robust mechanical connection.

Maximum Supply Current: 20 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

No. of DMA Channels: 12

Multiple DMA channels for parallel data processing and transfer.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals.

Connectivity: I2C, UART(2), USART(3)

Multiple connectivity options including I2C, UART, and USART for interfacing with external devices.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and code modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact and high-density PCB design.

Speed: 24 rpm

High-speed processing capability for real-time applications and responsive performance.

No. of I/O Lines: 112

Plenty of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM32F100ZET7B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

12

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Connectivity:

I2C, UART(2), USART(3)

Peripherals:

DMA(12), PWM, TIMER(16)

Trade Compliance

STM32F100ZET7B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20