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STM32F100R4H6B

STMicroelectronics

STM32F100R4H6B by STMicroelectronics

STM32F100R4H6B by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at -40 to 85 °C. It features 2 DAC and 16 ADC channels, along with DMA support. Ideal for industrial applications requiring a max clock frequency of 24 MHz and connectivity via HDMI-CEC, I2C, IRDA, LIN, SPI, and USART(2).

Median Price

$2.656

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,362 parts In-Stock

1+ parts

$2.718

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-

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-

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1,362

$2.718

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Verical

USA . 825 parts In-Stock

1+ parts

-

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$2.593

825

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$2.593

Distributors (In-Stock)

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Digiode

USA . 2,063 parts In-Stock

1+ parts

$2.582

100+ parts

-

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2,063

$2.582

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Vyrian

USA . 7,611 parts In-Stock

1+ parts

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7,611

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ACDS - Activité Composants Distribution Service

France . 6,033 parts In-Stock

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6,033

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Anansix

USA . 2,870 parts In-Stock

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2,870

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Distributors (Availability)

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Continental Prestige Electronics

USA . 10,370 parts In-Stock

1+ parts

$0.601

100+ parts

-

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10,370

$0.601

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Ampacity Inc.

Singapore . 428 parts In-Stock

1+ parts

$2.310

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428

$2.310

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Corphita

USA . 2,143 parts In-Stock

1+ parts

$2.446

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2,143

$2.446

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Vigor

Singapore . 10,000 parts In-Stock

1+ parts

$2.470

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10,000

$2.470

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AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$14.340

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359

$14.340

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IDEA Electronic Components Group

UK . 783 parts In-Stock

1+ parts

$17.587

100+ parts

-

1k+ parts

$15.828

10k+ parts

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783

$17.587

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$15.828

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Microchip USA

USA . 7,796 parts In-Stock

1+ parts

$18.641

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7,796

$18.641

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MKK Technologies

India . 1,308 parts In-Stock

1+ parts

$33.071

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1,308

$33.071

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DigiPath Technology Company

USA . 1,308 parts In-Stock

1+ parts

$33.071

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1,308

$33.071

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Perfect Parts

USA . 17,443 parts In-Stock

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17,443

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RC Electronics

USA . 9,000 parts In-Stock

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9,000

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Cyclops Electronics Ltd (Excess)

UK . 6,033 parts In-Stock

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6,033

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Kepictronics

USA . 5,680 parts In-Stock

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5,680

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Parana Technologies

USA . 1,754 parts In-Stock

1+ parts

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100+ parts

$21.028

1k+ parts

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1,754

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$21.028

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Overview

Unlock the power of innovation with the STM32F100R4H6B microcontroller by STMicroelectronics. Designed with cutting-edge technology and a wide range of peripherals, this versatile device is perfect for a variety of applications. From industrial automation to consumer electronics, the STM32F100R4H6B delivers superior performance and efficiency. Trust in the quality and reliability of STMicroelectronics, and elevate your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of input power sources, increasing its versatility.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space, enabling compact and neat circuit designs.

Bit Size: 32

A 32-bit architecture enables high-performance computing and can handle complex tasks efficiently.

DAC Channels: YES

The presence of DAC channels allows for accurate analog voltage output, suitable for applications like audio processing or motor control.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with various external components.

No. of Terminals: 64

Having 64 terminals allows for ample connectivity options, enabling the product to interface with a wide range of peripherals and sensors.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high density in a compact form factor, making the product suitable for applications where board space is limited.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures that the product can operate efficiently even with lower power sources, enhancing its energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing its reliability and durability.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and energy efficiency, making the product suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in extreme cold environments, enhancing its versatility in different conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for improved performance.

ADC Channels: YES

The presence of ADC channels allows the product to convert analog signals into digital data, enabling precise measurements and sensor interfacing.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, enhancing overall system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal position simplifies board layout and assembly, making the product easier to integrate into electronic designs.

ROM Words: 16384

The large ROM capacity allows for storing a significant amount of program data, enabling the product to handle complex algorithms and applications.

Maximum Seated Height: 1.2 mm

The low seated height enables a thinner profile for the product, making it suitable for compact electronic devices and space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide high-resolution analog output, allowing the product to generate accurate voltage signals for precise control and measurements.

Width: 5 mm

The compact width of the product makes it suitable for applications where space is limited, ensuring easy integration into electronic designs.

Peripherals: DMA(7), POR, RTC, TIMER(12)

A rich set of peripherals, including DMA controllers, power-on reset, real-time clock, and timers, offer versatile functionality for various applications.

Maximum Clock Frequency: 24 MHz

The high clock frequency enables fast processing speeds, making the product suitable for applications that require real-time data processing and high performance.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds, the product can withstand soldering processes without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that the product can withstand soldering processes at elevated temperatures, meeting industry standards.

Length: 5 mm

The compact length of the product enables efficient use of board space and allows for sleek and compact electronic designs.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures that the product can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a RISC architecture, the product offers efficient processing and low power consumption, making it ideal for embedded systems.

RAM Bytes: 4096

The generous RAM capacity allows for efficient data storage and processing, enabling the product to handle multiple tasks simultaneously.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and noise immunity, enhancing the overall performance and efficiency of the product.

Terminal Form: BALL

Ball terminal form allows for reliable solder connections and easy assembly, making the product suitable for automated manufacturing processes.

Analog To Digital Convertors: 16-Ch 12-Bit

Sixteen 12-bit ADCs enable precise analog signal conversion, making the product suitable for applications that require accurate sensor measurements.

Maximum Supply Current: 15.7 mA

With a low supply current, the product offers energy efficiency and prolonged battery life, making it suitable for portable and battery-operated devices.

Nominal Supply Voltage: 3 V

The nominal supply voltage provides stable operation and compatibility with standard power sources, ensuring consistent performance of the product.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog outputs, making the product suitable for applications like motor speed control and LED dimming.

Connectivity: HDMI-CEC, I2C, IRDA, LIN, SPI, USART(2)

A variety of connectivity options, including communication protocols like I2C, SPI, and USART, enable seamless integration with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for field updates and flexible firmware configurations, enhancing the product's versatility and upgradeability.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting and compact design, making the product suitable for applications with limited board space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is capable of withstanding standard moisture exposure during storage and assembly, ensuring long-term reliability.

Speed: 24 rpm

With a speed of 24 rpm, the product offers fast data processing and response times, making it suitable for real-time control and monitoring applications.

On Chip Program ROM Width: 8

An 8-bit wide on-chip ROM allows for efficient program storage and execution, enabling the product to handle a wide range of algorithms and functions.

No. of I/O Lines: 50

Having 50 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility and functionality.

Technical Specifications

Microcontrollers STM32F100R4H6B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C, IRDA, LIN, SPI, USART(2)

Peripherals:

DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100R4H6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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